Sheldahl, Inc.

Kenneth B Gilleo

Marion A Tibesar

Keith L Casson

Carol Rita Myers

Edward Mahagnoul

Deanna Suilmann

Stephen E Chabot

A heat resistant multilayer circuit board used in the transportation environment in cars, boats, planes, etc, having two or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, at least one of the conductive layers being affixed to a heat resistant substrate. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

Method of manufacturing a multilayer electronic circuit

A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

Multilayer electronic circuit having a conductive adhesive

Method for electrically and mechanically connecting at least two

An electrically conductive adherent film-forming adhesive which is rapidly curable thermally from a flowable liquid to an adherent and coherent solid at temperatures below about 120.degree. C. and with a specific resistivity of less than about 0.001 ohm-cm. when cured, and comprising a uniform mixture with a formulation containing a liquid epoxy base resin, a hardening component for the epoxy resin consisting essentially of B.multidot.CF.sub.3 SO.sub.3 H, and silver metallic powder in an amount ranging from about 75% to 85%, with the powder having a substantial uniform particle size of less than about 20 microns (0.8 mil) in diameter.

Low temperature cure having single component conductive adhesive

An apparatus and method for preparing conductive bridges to electrically couple discrete electrical conductors arranged on opposed surfaces of a common substrate. The method and apparatus utilized includes subjecting the bore or opening in the substrate to the force of vacuum applied through a vacuum diffusion barrier. The substrate is exposed to the vacuum source through a plurality of spaced-apart bores of relatively small diameter, with the vacuum diffusion layer being in the form of a web of filter paper tracking and moving in synchronism with the substrate. Conventional silk screening techniques are utilized to form the conductors and bridges, with polymer thick conductive fluids being employed as the printing medium. Multiple layers of conductors may be formed, with dual-sided circuitry being applied to the substrate. The multiple layers are fabricated by initially plating a layer of metal upon the exposed surface of the polymer thick conductive films, and thereafter printing a defined pattern of dielectric upon the electroplated copper. Subsequently, a second polymer thick conductive fluid is employed as a printing medium upon the surface of the dielectric, with contact to the copper being available through vias formed in the dielectric layer. Following cure of such second layer, the exposed surfaces may be plated with a film of copper, nickel or other suitable metal.

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W. Kingston, RI, United States of America

Kenneth B Gilleo