Integrated Device Technology, Inc.

Kenneth Astrof

Robert A Gubser

Ajay Kumar Ghai

Viresh Patel

Jitesh Shah

James Bryan Northcutt

Stephen Amar Tibbitts

Bruce Edward Clark

John William Fallisgaard

Packaged integrated circuit devices include an oscillator circuit having a resonator (e.g., quartz crystal, MEMs, etc.) associated therewith, which is configured to generate a periodic reference signal. A built-in self-test (BIST) circuit is provided, which is selectively electrically coupled to first and second terminals of the resonator during an operation by the BIST circuit to test at least one performance characteristic of the resonator, such as at least one failure mode. These test operations may occur during a built-in self-test time interval when the oscillator circuit is at least partially disabled. In this manner, built-in self-test circuitry may be utilized to provide an efficient means of testing a resonating element/structure using circuitry that is integrated within an oscillator chip and within a wafer-level chip-scale package (WLCSP) containing the resonator.

Packaged oscillators with built-in self-test circuits that support resonator testing with reduced pin count

A packaged integrated circuit includes an integrated circuit substrate and a cap bonded to a surface of the integrated circuit substrate. The cap has a recess therein that is at least partially lined with at least one segment of an inductor. This inductor may be electrically coupled to an electrical component within the integrated circuit substrate. In some embodiments, the inductor is patterned to extend along a sidewall and interior top surface of the recess, which extends opposite the integrated circuit substrate. The inductor may include a plurality of arcuate-shaped segments and may be patterned to be symmetric about a center-tapped portion thereof. The cap may also include a magnetic material therein that increases an effective inductance of the inductor relative to an otherwise equivalent cap and inductor combination that is devoid of the magnetic material.

Packaged integrated circuits having high-Q inductors therein and methods of forming same

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Edmonds, WA, United States of America

Kenneth Astrof