Memc Electronic Materials, Inc.

Kenneth Abraham Frank

Richard William Heim

Francis Richard Bronson

Yongqiang Lu

Roger Paul Durkee

Kevin Edwards

A modified process for chemical/mechanical polishing semiconductor wafers is provided. The process includes polishing a surface of the wafer, contacting the polished surface of the wafer with a surfactant, and drying the surface of the disengaged wafer for a sufficient period of time before contacting the surface of the wafer with a rinse media or subsequent process liquid. The process reduces defects, including etching stains, on the polished surface of the wafer.

Method of polishing a semiconductor wafer

Wafer demount apparatus automatically demounts and transports a polished semiconductor wafer to an inspection station. The apparatus includes a bridge located between a polishing block supporting wax-mounted wafers and an offload conveyor. The bridge fills the gap and provides a smooth transition surface for the wafers moving from the polishing block to the conveyor. The bridge is also capable of movement to achieve vertical and horizontal alignment with the polishing block.

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St. Charles, MO, United States of America

Kenneth Abraham Frank