Ford Motor Company Limited

Kenneth A Salisbury

Jay DeAvis Baker

Myron Lemecha

Paul E Stevenson

Prathap Amerwai Reddy

Bernard A Meyer

Wells L Green

Richard K McMillan, Ii

Pawel Kalinowski

Thomas B Merala

Matti Mikkor

An electronic module containing a heat sink member, a flexible printed circuit board with electrical components mounted on both sides, and a protective cover. The heat sink member has an external surface containing a plurality of protruding fins. Its internal surface contains a raised grid of ribs with cavities present between the ribs. The cavities contain ceramic-filled silicone for improved heat transfer between the electrical components present on the circuit board, and the heat sink member. High heat-producing components are mounted on one side of the circuit board and are thermally coupled with the heat sink member by means of copper-plated through-holes in the circuit board. The protective cover is mounted to the internal surface of the heat sink and encloses the printed circuit board. A connector assembly serves to connect the electronic module to external circuitry.

Electronic module containing an internally ribbed, integral heat sink

A printed wiring board having electronic circuit devices (13, 44) such as semiconductors including a heat sink forming a housing (32, 36) for the printed wiring board, one of the electronic devices (13) being mounted on one portion (12) of a heat spreader that is formed of a material having high thermal conductivity, another portion (10) of the heat spreader forming a thermal energy flow path to the heat sink, thereby lowering the junction temperature at the electronic device (13) and increasing the reliability of the wiring board.

Printed circuit board with high heat dissipation

A micro soldering apparatus and method comprising a system (10) for attaching an electronic component (12) to a substrate (14). The system (10) comprises a soldering tool (16) including a dispensing orifice assembly (18) for pulsatingly dispensing a controlled quantity of molten solder (19) to a component (12) and substrate (14) so that the component is joined to the substrate (14) mechanically and electrically upon solidification of the molten solder (19). There is no physical contact between the dispensing orifice assembly (18) and joint. The system (10) also includes a controller for the soldering tool (16). The controller functions in response to process control parameters so that the controlled quantity of molten solder (19) is dispensed through a non-oxidizing atmosphere by a pressure pulse applied to the molten solder.

Micro soldering system for electronic components

Growing community of inventors

Livonia, MI, United States of America

Kenneth A Salisbury