3m Innovative Properties Company

Kenneth A P Meyer

Raymond Patrick Johnston

Kevin W Gotrik

John J Sullivan

Matthew S Stay

Joseph Clark Carls

Haiyan Zhang

Duy K Lehuu

Gregory L Abraham

Moses Mekala David

David G Freier

Michael Alan Meis

Douglas Scott Dunn

Rolf W Biernath

Nicholas A Johnson

David F Slama

Ryan Patrick Simmers

Daniel J Schmidt

Robert L W Smithson

William A Tolbert

Caleb T Nelson

Charles David Hoyle

Thomas R Corrigan

Jaewon Kim

Raymond J Kenney

Robert A Sainati

Thomas R Hoffend, Jr

Martin Kristoffersen

Owen M Anderson

Przemyslaw Pawel Markowicz

Phillip E Tuma

Brian W Lueck

Stanley Rendon

Vadim N Savvateev

Matthew C Messina

David J Muradian

A patterned conductive article includes a substrate having a first groove therein; a conductive seed layer disposed in the first groove; and a unitary conductive body disposed at least partially in the first groove. The conductive seed layer covers at least a majority of a bottom surface of the first groove, and the unitary conductive body covers the conductive seed layer and at least a majority of side surfaces of the first groove. In a plane through the unitary conductive body that is parallel to and separate from the conductive seed layer, the unitary conductive body has a lower first line edge roughness at a first interface with the side surfaces and the conductive seed layer has a higher second line edge roughness at an edge of the conductive seed layer.

Patterned conductive article

Light control films comprise a light input surface and alight output surface opposite the light input surface and alternating transmissive regions and absorptive regions disposed between the light input surface and the light output surface. The absorptive regions have an aspect ratio of at least 30 and are canted in the same direction. The alternating transmissive regions and absorbing regions have a maximum relative transmission at a viewing angle other than 0 degrees.

High transmission light control films with asymmetric light output

An article includes a polishing layer that includes a plurality of raised cells separated by a plurality of channels. Each of the plurality of raised cells includes a microstructured working surface, a substantially vertical channel surface, and an offset surface between an edge of the working surface and an upper edge of the channel surface. The microstructured working surface includes a plurality of microstructures. Tops of the plurality of microstructures define a top plane and bases of the plurality of microstructures define a base plane. The substantially vertical channel surface defines a wall of a channel of the plurality of channels and the channel surface defines a channel plane. The offset surface includes a nonplanar portion of displaced material. The displaced material defines a displacement plane that is below the base plane or within a tolerance of the top plane.

Microreplicated polishing surface with enhanced co-planarity

A patterned article includes a unitary polymeric layer and a plurality of electrically conductive elements embedded at least partially in the unitary polymeric layer. Each electrically conductive element includes a conductive seed layer having a top major surface and an opposite bottom major surface in direct contact with the unitary polymeric layer, and includes a metallic body disposed on the top major surface of the conductive seed layer. The metallic body has a bottom major surface and at least one sidewall. The bottom major surface contacts the conductive seed layer. Each sidewall is in direct contact with the unitary polymeric layer and extends from the bottom major surface of the metallic body toward or to, but not past, a top major surface of the unitary polymeric layer. The conductive elements may be electrically isolated from one another. Processes for making the patterned article are described.

Patterned article including electrically conductive elements

A patterned conductive articleincludes a substrateincluding a unitary layer-and includes a micropattern of conductive tracesembedded at least partially in the unitary layer. Each conductive trace extends along a longitudinal direction (y-direction) of the conductive trace and includes a conductive seed layerhaving a top major surfaceand an opposite bottom major surfacein direct contact with the unitary layer; and a unitary conductive bodydisposed on the top major surface of the conductive seed layer. The unitary conductive body and the conductive seed layer differ in at least one of composition or crystal morphology. The unitary conductive body has lateral sidewallsand at least a majority of a total area of the lateral sidewalls is in direct contact with the unitary layer.

The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes at least one of a plurality of precisely shaped pores and a plurality of precisely shaped asperities. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

Polishing pads and systems and methods of making and using the same

The present application provides articles () having a polymeric substrate () with a plurality of solid and/or hollow microneedles () extending therefrom. Each solid microneedle is formed by a molding process and the microneedle has body with first () and second cavities () extending therein. The hollow microneedles are formed by removing a portion of the polymeric material disposed between the first cavity and the second cavity. A method for determining the location of a microneedle in an article comprising solid microneedles is also provided. The method comprises directing electromagnetic radiation toward an article comprising a plurality of microneedles and imaging the article.

Article with hollow microneedles and method of making

The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes a plurality of precisely shaped pores, a plurality of precisely shaped asperities and a land region. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

The present disclosure relates to illumination or lighting assemblies and systems that provide illumination using LEDs. In one aspect, the present disclosure provides a lighting assembly, comprising: multiple light emitting diodes that emit light; an optical system that directs the light emitted by the light emitting diodes, the optical system positioned adjacent to light emitting diodes; and a cooling fin including a two-phase cooling system, the cooling fin positioned adjacent to the light emitting diodes such that the two-phase cooling system removes heat from the light emitting diodes. In another aspect, the present disclosure provides a lighting system including multiple lighting assemblies. The lighting assemblies and systems of the present disclosure can be used in, for example, a street light, a backlight (including, for example, a sun-coupled backlight), a wall wash light, a billboard light, a parking ramp light, a high bay light, a parking lot light, a signage lit sign (also referred to as an electric sign), static signage (including, for example, sun-coupled static signage), illuminated signage, and other lighting applications.

Lighting assemblies and systems

A decollimator for a daylighting system includes a conical section having a circular end, a square end, and a conical shape tapering inwardly from the circular end to the square end. A mixing zone section is attached to the square end of the conical section and has a square cross sectional shape of a substantially constant cross sectional dimension. The decollimator also includes either a window with a converging Fresnel lens on the circular end of the conical section, a window with a diverging Fresnel lens on an end of the mixing zone section opposite the conical section, or both. When the conical section receives collimated light, the conical section, the mixing zone section, and the Fresnel lens together decollimate the light and provide the decollimated light out of the mixing zone section.

Optical decollimator for daylighting systems

Growing community of inventors

White Bear Township, MN, United States of America

Kenneth A P Meyer