International Business Machines Corporation

Kenneth A Bird

Roger Donell Weekly

Gary Franklin Goth

Sarah Huffsmith Knickerbocker

Bret Peter Elison

Jason Lee Frankel

Thoi Nguyen

Terrance Wayne Kueper

Ronald Xavier Arroyo

Kurt R Muller

Lawrence D Thorp

Douglas Y Kim

Stephen J Kish

Julius J Lambright

William A Ciarfella

Raschid Jose Bezama

Peter Jeffrey Brofman

Robert Anthony Rita

Suresh D Kadakia

Alan Piciacchio

Francis F Cappo

Ahmed Sayeed Shah

Scott A Sikorski

Myra Muth Boenke

Systems and arrangements to assess the thermal performance of a thermal solution based upon the ability of a device under test (DUT) to operate in accordance with electrical performance criteria are contemplated. Embodiments may include a tester to couple with the DUT to determine an operating junction temperature. In some embodiments, the measured junction temperature may be the operating junction temperature anticipated for the DUT in a customer installation. In other embodiments, the tester may comprise logic to calculate a projected, operating junction temperature based upon the measured junction temperature and known differences between the tester and a customer installation. Upon determining the operating junction temperature for the DUT at the customer installation, the operating junction temperature is compared against a maximum junction temperature for proper operation of the DUT. Advantageously, the maximum junction temperature may be varied based upon the project objective for a line of DUTs.

Systems and arrangements to assess thermal performance

The present invention relates generally to new planar substrates that are metallized and embedded with material to minimize the camber and method thereof. The invention also relates to the fabrication of multilayer ceramic (MLC) substrates for packaging electronic devices. More particularly, this invention relates to the fabrication of thin and small ceramic substrates which do not need post-sintering processing to control the flatness of the sintered product.

Planar metallized substrate with embedded camber control material and method thereof

A universal substrate includes an input/output (I/O) layer having a fixed I/O assignment of I/O locations for connection with a printed circuit board or the like. A chip receiving layer is provided for receiving one of at least two different but allied semiconductor chips, wherein each of the at least two different but allied chips include a set of bond pads and have a unique wire-out requirement. A first layer includes a plurality of bond pads and vias, the plurality of bond pads including at least two sets of bond pads, wherein each set is adapted for bond connection with a respective one of the at least two different semiconductor chips when received by said receiving means and further in accordance with a respective wire-out requirement. A second layer, different from the first layer, includes redistribution lines for coupling the plurality of bond pads and vias of the first layer to the I/O locations of the I/O layer in accordance with the wire-out requirements of the at least two different semiconductor chips and the fixed I/O assignment.

Universal cost reduced substrate structure method and apparatus

An electronic component package comprising a substrate having at least one die-receiving cavity formed therein, the cavity being defined by a die-receiving surface and an inner sidewall having a terraced contour, the substrate having an exterior surface bordering the cavity perimeter, the inner sidewall extending between the die-receiving surface and the substrate exterior surface, and at least one capacitor positioned completely within the cavity and mounted to the terraced contour of the inner sidewall.

Electronic component package with decoupling capacitors completely

A method and apparatus for the inspection and handling of surface level defects is taught. Briefly stated, the object to be inspected is positioned. A Laser light is polarized into at least one orientation and then reflected off of a rotated polygon mirror. This causes the light to 'move' over the area of interest. A plurality of fiber optic bundles are used to receive and conduct the reflected light back to photomultipliers. The photomultipliers convert the light into electrical signals while associated electronics digitize the signals, keeping track of pixels which are produced. By keeping track of pixel edge boundaries and determining if certain thresholds are exceeded or not met as appropriate, the area of interest can be checked for a variety of defects. By comparison of the defects to a reference base, the defects and hence the items inspected can be categorized.

Method and apparatus for object inspection

A method and apparatus for the inspection and handling of surface level defects is taught. Briefly stated, the object to be inspected is positioned. A Laser light is polarized into at least one orientation and then reflected off of a rotated polygon mirror. This causes the light to 'move' over the area of interest. A plurality of fiber optic bundles are used to receive and conduct the reflected light back to photomultipliers. The photomultiplers convert the light into electrical signals while associated electronics digitize the signals, keeping track of pixels which are produced. By keeping track of pixel edge boundaries and determining if certain thresholds are exceeded or not met as appropriate, the area of interest can be checked for a variety of defects. By comparison of the defects to a reference base, the defects and hence the items inspected can be categorized.

Advanced via inspection tool (AVIT)

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New Paltz, NY, United States of America

Kenneth A Bird