The Furukawa Electric Co., Ltd.

Kenkichi Suzuki

Hisashi Koaizawa

Michio Kondo

Toshihiro Nakamura

Nobuaki Orita

Hiroshi Kuraseko

Tsuneo Suzuki

Sadayuki Toda

Takeshi Hirayama

Takashi Fuyuki

Kiyoshi Yase

The linear semiconductor substrateorof the present invention comprises at least one desired thin filmformed on a linear substratehaving a length ten or more times greater than a width, thickness, or diameter of the linear substrate itself. Adopting semiconductor as the thin filmforms a linear semiconductor thin film. The linear semiconductor substrateorof the present invention is produced by utilizing a fiber-drawing technique which is a fabricating technique of optical fibers.

Linear semiconductor substrate, and device, device array and module, using the same

The present invention provides a SOI substrate that can realize a composite device formed of a MOS integrated circuit and a passive device and can reduce a size and a manufacturing cost of a semiconductor device. There is provided a fiber SOI substratecomprising a fiberwith a polygonal cross section, and a semiconductor thin filmcrystallized after film formation on at least one surface of the fiber, and a plurality of groovesthat extend in a linear direction of the fiberand are arranged at intervals in a width direction are formed on a surface of the fiber

Fiber SOI substrate, semiconductor device using this, and manufacturing method thereof

A display device includes a first fiber having a silicon layer or an oxide layer, on which an active element is formed on the surface of the fiber and a second fiber forming a combined one-dimensional substrate together with the first fiber by being combined with the first fiber and having light emitting layers formed on a plurality of domains of the device. The first fiber and the second fiber are respectively drawn out from take-up jigs, are cut in necessary lengths and separated into plural fibers, and these plural first or second fibers are mounted in parallel with each other on a fixing jig. In this state, at least one-side elements of active elements and passive elements are formed on the first or second fibers.

Semiconductor device and display device using a one-dimensional substrate and device fabricating method thereof

Growing community of inventors

Tsukuba, Japan

Kenkichi Suzuki