Mitsubishi Materials Corporation

Ebara Corporation

Renesas Technology Corp.

Sanwa Shutter Corporation

Mitsubishi Denki Kabushiki Kaisha

Yokogawa Electric Corporation

Other

Renesas Electronics Corporation

Sumitomo Mitsubishi Silicon Corporation

Kabushiki Kaisha Toshiba

Nec Corporation

Tokyo Electron Limited

Nihon Micro Coating Co., Ltd.

Mitsubushi Denki Kabushiki Kaisha

Sumco Corporation

Kenji Yamaguchi

Sho Tatsuoka

Masayuki Nakanishi

Kenya Ito

Masaya Seki

Tamami Takahashi

Hiroyuki Amishiro

Kazuki Mizushima

Hiroaki Kusa

Kenichi Sato

Toshio Kumamoto

Motoshige Igarashi

Akira Osada

Masaki Okude

Ichiro Shiono

Kenji Hosoyama

Yoshiyuki Kamata

Akihisa Hongo

Mitsuhiko Shirakashi

Masayuki Nakagawa

Yoshikatsu Sakai

Kazuyuki Inoue

Fumitoshi Okazaki

Daisuke Hozumi

Masao Yokomori

Katsuhisa Tsuda

Hitoshi Saito

Hiroyuki Yano

Jun Watanabe

Jun Tamura

Takayuki Saito

Atsushi Shigeta

Kunio Oishi

Tsukuru Suzuki

Masataka Hatta

Tadashi Sasaki

Eiichi Shinohara

Kaoru Yamada

Shun Sato

Hirofumi Shiotsuki

Tsuyoshi Ogami

Gen Toyota

Akinori Saito

Satoru Sato

Akira Koyano

Yuko Maruyama

Masayuki Kamezawa

Nao Kanamori

Naoyuki Iwasaki

Kenji Kato

Souichi Asakawa

Kouichi Sassa

Yohta Furukawa

Shun-ichi Kobayashi

Takao Kajitani

Akio Yoshino

The present invention relates to a novel trolley coupling structure that allows coupling of base parts of trolleys aligned in the vertical or horizontal direction. The present invention provides a trolley coupling structure in which a first receiving recess part is provided in a base part of one trolley, a second receiving recess part is provided in a base part of another trolley, a locking member is pivotally attached to the first receiving recess part, a recess part body and a bent section are formed in the respective first and second receiving recess parts, and retaining of the locking member is achieved by constraining and locking a constraining piece part of the locking member at the bent section.

Trolley coupling structure

A surface-coated cutting tool comprises a hard coating layer that includes a TiAlN layer and is provided on a surface of a cutting tool body. In case the composition of the TiAlN layer is expressed by a formula: (TiAl)N, 0.10&#x2264;x&#x2264;0.35 (here, x is in atomic ratio) is satisfied. In the TiAlN layer, a high Ti band-like region is present in a direction at 30 degrees or less with respect to a line normal to the surface of the cutting tool body. An average composition X of the Ti component in the high Ti band-like region satisfies (x+0.01)&#x2264;X&#x2264;(x+0.05), an average width W of the high Ti band-like region is 30 to 500 nm, and an average area ratio St of the high Ti band-like region is 3 to 50 area %.

Surface-coated cutting tool

The hard coating layer of the cutting tool includes a complex nitride or complex carbonitride layer expressed by the composition formula: (TiAl)(CN). xand ysatisfy 0.60&#x2264;x&#x2264;0.95 and 0&#x2264;y&#x2264;0.005. xis an average content ratio of Al in a total amount of Ti and Al, and yis an average content ratio of C in a total amount of C and N. Some crystal grains composing the complex nitride or complex carbonitride layer have a cubic structure. In crystal grains having the cubic structure, the average crystal grain misorientaion is 1 degree or more; or 2 degrees or more, based on analysis of the polished surface perpendicular to a surface of the layer. A peak exists in 1-2 degrees of the average crystal grain misorientation in the frequency distribution of the average crystal grain misorientation and the area ratio.

Surface-coated cutting tool in which hard coating layer exhibits excellent chipping resistance

In a surface-coated cutting tool, a hard coating layer composed of a lower layer and an upper layer is deposited on a surface of a tool body made of a WC-based cemented carbide or a TiCN-based cermet. The lower layer has at least one Ti compound layer made of a TiCN layer and the upper layer is made of an &#x3b1;-type AlOlayer. In a case where, regarding AlOcrystal grains of the entire upper layer, a constituent atom-sharing lattice point distribution is measured, a highest peak is present in &#x3a3;3, and a distribution ratio of &#x3a3;3 is 70% or more. A ratio of a &#x3a3;3-coincidence grain boundary continuing from an interface between the lower layer and the upper layer to an outermost surface of the upper layer is 60% or more of a &#x3a3;3-coincidence grain boundary of the upper layer.

A surface-coated cutting tool has a hard coating layer on a tool body. The hard coating layer includes a (TiAl)(CN) layer (the average amount Xavg of Al and the average amount Yavg of C satisfy 0.60&#x2264;Xavg&#x2264;0.95 and 0&#x2264;Yavg&#x2264;0.005). Crystal grains having an NaCl type face-centered cubic structure in the layer have {111} orientation, a columnar structure in which the average grain width of the individual crystal grains having an NaCl type face-centered cubic structure is 0.1 &#x3bc;m to 2.0 &#x3bc;m and the average aspect ratio is 2 to 10 is included, and in the individual crystal grains having an NaCl type face-centered cubic structure, a periodic compositional variation in Ti and Al in the composition formula: (TiAl)(CN) is present and the difference between the average of maximum values of x and the average of minimum values thereof is 0.03 to 0.25.

A coated tool includes a hard coating layer that is formed with a (Ti,Al)(C,N) layer on its surface, the layer including an upper layer where a periodic compositional variation in Ti and Al is present in crystal grains having an NaCl type face-centered cubic structure, and a lower layer where a periodic compositional variation in Ti and Al is not present. The upper layer has a high Al amount, while the lower layer has a low Al amount. A value of I(200)/I(111) of the upper layer is greater than 10 and that of the lower layer is less than 3. The lower layer has a composition inclined structure where the Al amount increases from a tool body side towards an upper layer side. The lower layer contains multiple layers, where the Al amount of each layer can increase from the tool body side towards the upper layer side.

Surface-coated cutting tool in which hard coating layers exhibits excellent chipping resistance

The hard coating layer includes at least a complex nitride or complex carbonitride layer expressed by the composition formula (TiAl)(CN). The average Al content ratio xthe average C content ratio ysatisfy 0.60&#x2264;x&#x2264;0.95 and 0&#x2264;y&#x2264;0.005, respectively, each of the xand yis in atomic ratio. The crystal grains constituting the complex nitride or complex carbonitride layer include a crystal grain having the cubic structure. Predetermined average crystal grain misorientation and inclined angle distribution exist in the crystal grains having the cubic structure.

Surface-coated cutting tool having hard coating layer that exhibits excellent chipping resistance

A surface-coated cutting tool of the invention is a surface-coated cutting tool in which a surface of a tool body is coated with a lower layer and an upper layer, in which at least one layer of the lower layer is made of a TiCN layer, the upper layer has an average layer thickness of 2 to 15 &#x3bc;m and is made of an AlOlayer having an &#x3b1;-type crystal structure in a chemically deposited state, and in a coincidence grain boundary distribution graph, a highest peak is present in &#x3a3;3 in the range of &#x3a3;3 to &#x3a3;29, a distribution ratio of &#x3a3;3 occupies 35 to 70% of the whole coincidence grain boundary length of &#x3a3;3 or more, and a coincidence grain boundary of &#x3a3;31 or more occupies 25 to 60% of the whole coincidence grain boundary length of &#x3a3;3 or more.

Surface coating cutting tool

The hard coating layer includes at least a complex nitride or complex carbonitride layer expressed by the composition formula (TiAl)(CN). The average Al content ratio xthe average C content ratio ysatisfy 0.60&#x2264;x&#x2264;0.95 and 0&#x2264;y&#x2264;0.005, respectively, each of the xand yis in atomic ratio. The crystal grains constituting the complex nitride or complex carbonitride layer include a crystal grain having the NaCl face-centered cubic structure. A predetermined average crystal grain misorientation exists in the crystal grains having the NaCl face-centered cubic structure.

A surface-coated cutting tool of the present invention includes: a cutting tool body; and a hard coating layer provided on a surface of the cutting tool body, in which the hard coating layer includes a complex nitride or carbonitride layer, which is expressed by a composition formula: (TiAl)(CN), the average content ratio Xof Al and the average content ratio Yof C in the complex nitride or carbonitride layer satisfy 0.60&#x2264;X&#x2264;0.95 and 0&#x2264;Y&#x2264;0.005, provided that each of Xand Yis in atomic ratio, the complex nitride or carbonitride layer includes crystal grains with a cubic structure, and in the crystal grains with the cubic structure, a composition of Ti and Al is periodically changed in a direction of the normal line to the surface of the cutting tool body.

Surface-coated cutting tool and method for producing the same

A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Polishing apparatus and polishing method

A hard coating layer on a cutting tool includes at least a Ti and Al complex nitride or carbonitride layer and has an average layer thickness of 1 to 20 &#x3bc;m. In a case where a composition of the complex nitride or carbonitride layer is expressed by: (TiAl)(CN), a content ratio x and a content ratio y satisfy 0.60&#x2266;x&#x2266;0.95 and 0&#x2266;y&#x2266;0.005, where x and y are in atomic ratio. Crystal grains constituting the complex nitride or carbonitride layer include cubic phase crystal grains and hexagonal phase crystal grains. An area ratio occupied by the cubic phase crystal grains is 30-80%. An average grain width W is 0.05-1.0 &#x3bc;m. An average aspect ratio A of the crystal grains with the cubic grain structure is 5 or less. A periodic content ratio change of Ti and Al in (TiAl)(CN) exists in each of the cubic phase crystal grains.

Surface coated cutting tool

A surface-coated cutting tool includes a lower layer including a Ti compound layer, an intermediate layer including an &#x3b1;-AlOlayer, and an upper layer including a Zr-containing &#x3b1;-AlOlayer. The outermost layer of the lower layer contains 0.5 to 3 at % of oxygen. The frequencies of inclination angles between a normal line to a (0001) plane of AlOgrains of the intermediate layer and a normal line to a surface of a tool body have a highest peak in an inclination angle division of 0 to 10&#xb0;. The ratio of the frequencies is 50 to 70%. The frequencies between the normal line to the (0001) plane of AlOgrains of the entirety of the intermediate and the upper layers and the normal line to the tool body surface have a highest peak in an inclination angle division of 0 to 10&#xb0;. The ratio of the frequencies is 75% or more.

A probe apparatus can suppress a spark from occurring near a wafer surface simply and efficiently when inspecting electrical characteristics of a semiconductor device at wafer level. A spark preventing devicemounted in the probe apparatus includes a surrounding memberwhich surrounds probe needlesG andS between a probe cardand a mounting table; and a gas supply deviceconfigured to supply a gas to a vicinity of the probe needlesG andS through an inside or a vicinity of the surrounding memberto form an atmosphere of a preset pressure higher than an atmospheric pressure in the vicinity of the probe needlesG andS when inspecting the electrical characteristics of each chip on a semiconductor wafer W. A contact platealso serves as the surrounding member

Probe apparatus

Growing community of inventors

Tokyo, Japan

Kenji Yamaguchi