Du Pont Toray Company Limited

E.i. Dupont De Nemours and Company

Kenji Uhara

Naofumi Yasuda

Kouichi Sawasaki

Hideki Moriyama

Brian C Auman

John Donald Summers

Meredith L Dunbar

James R Edman

Koichi Sawasaki

Michihiro Kubo

A multi-layer polyimide film including two or more laminated polyimide film layers is provided, with at least one of the two or more polyimide film layers is obtained by imidizing a polyamic acid derived from the reaction of at least one aromatic diamine containing 1-100 mol percent of carboxy-4,4'-diaminobiphenyl represented by the following formula, wherein m and n represent integers of 4 or less, including 0, and (m+n) is an integer of 1 or greater, and at least one aromatic tetracarboxylic dianhydride or a derivative thereof. Methods for obtaining a multi-layer polyimide film laminate can exhibit a peel strength of 10N/cm when laminated to a metal foil using an adhesive and can have a water absorption value of less than 3.0 weight percent.

Multi-layer polyimide films and flexible circuit substrates therefrom

This invention is directed to polyimide films having a carbon nanotube filler to provide a surface resistivity in a range from 50 ohm/square to 1.0&#xd7;10ohms/square. The electrically conductive polyimides of the present invention have an excellent balance of properties relative to conventional polyimides having a conductive filler, due at least in part to the film's water content, degree of imidization and polymer orientation.

Electrically conductive polyimide compositions having a carbon nanotube filler component and methods relating thereto

A laminate having improved resistance to separation failure when incorporated into a flexible circuit structure. The laminate comprising a highly bondable polyimide and is preferably formed from a polyamic acid comprising a tetracarboxylic acid component, a diamine component, and 0.1 to 5.0 mole % of a dicarboxylic acid component, with respect to the tetracarboxylic acid component, and wherein the adhesive strength of the laminate is greater than 10  N/cm, and more preferably greater than 19 N/cm.

Laminate type materials for flexible circuits or similar-type assemblies and methods relating thereto

The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4'-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate

Polyimide substrates having an interpenetrating network morphology and methods relating thereto

A polyimide film is manufactured from a random copolymeric, block copolymeric or interpenetrating polymer network-type polyamic acid prepared from pyromellitic dianhydride in combination with 22 to 78 mol % of 4,4&prime;-oxydianiline and 22 to 78 mol % of 3,4&prime;-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

A polyimide film is produced by copolymerizing pyromellitic dianhydride in combination with phenylenediamine, methylenedianiline and 3,4&prime;-oxydianiline in a specific molar ratio. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

A polyimide film of birefringence less than 0.01 is formed by drawing a copolymerized polyimide comprising a block component and a random component which are molecularly bonded, wherein the block component of copolymerized polyimide comprises an aromatic diamine compound having a rigid structure and an aromatic tetracarboxylic acid compound and wherein the random component of copolymerized polyimide comprises an aromatic diamine compound having a flexible structure and at least two aromatic tetracarboxylic acid components. The resulting polyimide film has high elasticity, a low thermal expansion equivalent to that of metal and low water absorbing properties. A method for its manufacture and a metal laminated plate having improved curl properties in which the polyimide is used as the base material are also disclosed.

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Aichi, Japan

Kenji Uhara