Seiko Epson Corporation

Kenji Uchiyama

Eiji Muramatsu

Kenichi Maruyama

Masaru Kamimura

Shigetoshi Yamada

Seiichi Sakura

Kazuaki Furuichi

Kinichi Maeda

Kougo Endou

A system for manufacturing an electronic device having a processing unit which includes a timer that processes a plurality of lots each having a plurality of work pieces and measuring in units of lots a processing time of the work pieces constituting the respective lots, an environmental information measurement module that measures environmental information corresponding to the processing time of the work pieces measured in units of lots, and a communication module for transmission and reception, and a work information management unit having a storage module which is provided to correspond to each lot, communicates with the communication module of the processing unit, and receives and stores the processing time and the environmental information of the work pieces of the lot.

Method and system for manufacturing electronic device, electronic device, and electro-optical apparatus

A semiconductor device connecting structure is provided for connecting a semiconductor IC to a substrate. A bonding layer is placed between the substrate and the semiconductor IC to accomplish adhesion therebetween. Sufficient heat and pressure are applied to the bonding layer to create spaces therein which deform during relative movement between the semiconductor IC and substrate thereby maintaining consistent electrical contact between the semiconductor contact bumps and electrodes on the substrate.

Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit

A semiconductor device connecting structure for connecting a semiconductor IConto a substrateA bonding layeris placed between the substrateand the semiconductor ICto accomplish adhesion therein. This bonding layer includes an ACFas a bonding material for joining said semiconductor IConto said substrateand a spaceformed within the ACFEven if the ICdeforms due to heat or the like, the deformation is absorbed by the space awhereupon the connecting conditions of bumpscan not be unstable.

In a compression-bond-connection substrate having a configuration wherein a plurality of wiring layers are formed, elevated compensation patterns having substantially the same thickness as that of backside wiring patterns are formed in positions corresponding to the backsides of substrate-side terminals to be conductively connected to opposing-side terminals on a compression-bonding-side surface of the compression-bond-connection substrate. Since uniform pressure is exerted on the substrate-side terminals when pressure is applied in compression-bonding, a highly reliable compression-bonding connected assembly can be stably obtained.

Compression-bond connection substrate, liquid crystal device, and electronic equipment

A multichip mounted structure has a substrate provided with substrate-side terminals and and a plurality of IC chips and provided with bumps and , respectively, so that the substrate-side terminals and are conductively connected with the bumps and , respectively. The bumps and provided on the plurality of IC chips and , respectively, form pairs of terminal lines opposing each other. Since the plurality of IC chips and are mounted on the substrate so that central lines L and L between the pairs of terminal lines which are individually formed approximately coincide with each other, it is not necessary to transport a position of a compressive head, and one piece of ACF can be commonly used.

Multichip mounted structure, electro-optical apparatus, and electronic apparatus

In a liquid crystal device, spherical-shaped semiconductor devices are mounted in a dispersive fashion on a wiring pattern extending toward a liquid crystal sealing region from input terminals connected to a flexible board. Each spherical-shaped semiconductor device is produced by forming a semiconductor device element on the surface of a spherical-shaped semiconductor material. In production of an electro-optical panel, MIS transistors are first produced in the form of spherical-shaped semiconductor devices, and then one spherical-shaped semiconductor device is installed in each pixel on an active matrix substrate, thereby allowing the MIS transistors to be produced at an optimum temperature without restriction caused by heat resistance of the substrate. When the active matrix substrate is adhesively bonded to an opposite substrate, the spherical-shaped semiconductor devices serve as spacers which allow the substrates to be precisely spaced a desired distance apart from each other.

Method for manufacturing an active matrix substrate

A method of mounting a component in which a component is thermally press-bonded onto a substrate with a conductive adhesive. The method includes a substrate heating step in which the substrate is heated to a temperature which is 20&deg; C.&tilde;40&deg; C. below the glass transition point of a bonding resin contained in the conductive adhesive, and a thermal press-bonding step in which the component is thermally press-bonded onto the substrate heated to the aforementioned temperature with the conductive adhesive.

Component mounting method and method of producing electro-optical device

The liquid crystal device comprises a pair of substrates and facing each other with liquid crystal interposed therebetween and having aluminum electrodes formed on opposing surfaces of the substrates that face each other and also comprises a protruding portion provided on one substrate of the pair of substrates extending toward the outside from the other substrate wherein the aluminum electrodes extend along the protruding portion and an overcoat layer is provided on the aluminum electrodes extending along the protruding portion

Liquid crystal device and electronic apparatus

In order to provide an anisotropic conductive adhesive agent which is capable of including a predetermined number of conductive particles between the terminals to be connected in a sure manner and which improves the conductive reliability, a plurality of conductive particles included in the insulating adhesive agent of the anisotropic conductive adhesive agent are non-uniformly provided on the one side of the two adhering surfaces of the insulating adhesive agent . At the time of positioning the anisotropic conductive adhesive agent between the two terminals, if the adhering surface, which is the one to which the conductive particles are non-uniformly provided, is disposed to the side of the terminal, which is the one having a smaller dimension of protrusion toward the adhesive side of two terminals, it prevents the conductive particles , which are not positioned there, from being pressed out, even in the case that the insulating adhesive agent is pressed out toward a lateral side by the terminals having a greater dimension of protrusion, at the time of thermal compression bonding. Accordingly, a predetermined number of conductive particles can be included between each of the terminals, thereby improving conductive reliability.

Connecting structure, liquid crystal device, electronic equipment, and anisotropic conductive adhesive agent and a manufacturing method thereof

In order to provide an adhesive which can enhance adhesiveness on each of adherends even when it is bonded with two adherends composed of different materials, an insulating adhesive material of an adhesive placed between the two adherends is composed of a two-layer structure of a first insulating adhesive material adhered with one adherend, and a second insulating adhesive material adhered with the other adherend. Each of the adhesives and is caused to have proper adhesive properties suitable for the adherend to be bonded with by, for example, adding different kinds of coupling agents. By this construction, the adhesion forces of the adhesives and on each adherend can respectively be enhanced, and the adhesion forces of the anisotropically electrically conductive adhesive can be improved as compared with adhesive comprising a conventional single insulating adhesive material.

Adhesive, liquid crystal device, process for manufacturing liquid crystal device, and electronic equipment

A semiconductor device in which electrical connection between a spherical semiconductor and a substrate can be reliably effected and a method of manufacturing such a semiconductor device. The spherical semiconductor includes contact pads that are treated to create a higher wettability with the fixative material (e.g. solder) then the wettability of the semiconductor material surrounding the contact pads. The substrate includes terminal which may be similarly treated to create a higher wettability with the solder than that of the substrate material surrounding the terminals. The difference in wettability and the surface tension of solder creates a biasing force that causes the contact pads and terminal to bond in an aligned manner. Additionally, the substrate may include a recess in the area where the spherical semiconductor is mounted, with terminals being formed in this recess The center of balance of the spherical semiconductor is deviated, so that, when micro-vibrations are imparted to the substrate, a predetermined part of the spherical semiconductor is directed downward, resulting in the contact pads of the spherical semiconductor being aligned with the contact pads of the substrate

Spherical semiconductor device and method of mounting the same on a substrate

A compression-bond-connection substrate compression-bonded to a compression-bonding target object has front-side terminals conductively connected to opposing-side terminals and backside terminals formed at the backsides thereof. The backside terminals are formed diagonally to the front-side terminals. Pressure is exerted uniformly on substrate-side terminals in the pressure application in compression-bonding. Therefore, a highly reliable compression-bonding connected assembly can be stably obtained.

Compression-bond-connection substrate, liquid crystal device, and electronic equipment

To provide a semiconductor device in which a plurality of spherical members are easily stacked at predetermined positions, with at least one of the spherical members being formed of a semiconductor material and having a semiconductor element or wiring formed on the surface of the spherical semiconductor material. One spherical member is placed in a depression formed by three spherical semiconductors that are substantially in contact. The spherical members are stacked in three dimensions so that four spherical members form a triangular pyramid to thereby form a semiconductor device . In the stacked spherical semiconductors , there may be provided a connecting spherical semiconductor E, which only performs the function of electrically connecting the spherical semiconductors , and a dummy spherical member F, which only performs the function of filling a gap between other spherical members.

Arrangement of stacked, spherically-shaped semiconductors

A semiconductor device, a mounting structure thereof, a liquid crystal device, and an electronic apparatus having an improved bump electrode structure, such that the bump electrodes and corresponding electrode terminals can be electrically connected through an anisotropic conductive film without compromising, or causing deterioration of, the electrical characteristics or reliability of the device, even when the bump electrodes are formed with a narrow pitch. Since the bump electrodes of the semiconductor device are tapered inward from top to bottom, the base portions of adjacent bump electrodes are spaced apart from each other by wider gaps than the corresponding upper portions. Thus, a large number of conductive particles in the conductive film do not gather between adjacent bump electrodes to cause short-circuiting therebetween. Further, since the upper portions of the bump electrodes are wider and the opposing surface areas of both the bump electrodes and the electrode terminals are relatively large, a large number of conductive particles are distributed between the bump electrodes and the electrode terminals. This ensures that the bump electrodes and the electrode terminals are electrically connected in a satisfactory manner. Therefore, with this arrangement, a high level of reliability can be achieved, even when the bump electrodes are formed in high density.

Semiconductor device, semiconductor device mounting structure, liquid crystal device, and electronic apparatus

Conductive connection can be effected between electrodes arranged at a minute pitch. When joining an IC chip ( ), which is a semiconductor device, to an external substrate ( ), conductive paste ( ) is sprayed in particles to terminals ( ) on the external substrate ( ) and the conductive paste ( ) is put on the electrodes ( ). Next, positioning of pads ( ) of the IC chip ( ) is effected with respect to the conductive paste ( ) and, in this condition, the IC chip ( ) and the substrate ( ) are glued to each other. Since the conductive paste ( ) is sprayed in particles and printed on the electrodes ( ), it is possible to correctly put the conductive paste ( ) thereon even when the electrodes ( ) are arranged at a minute pitch. Further, since conduction is effected between the pads ( ) and the electrodes ( ) through the conductive paste ( ), the conduction state is stable. This conductive connection method is suitably applicable to the connection between substrate side electrodes formed on a substrate and element side electrodes formed on an electronic element mounted on the substrate in a variety of devices such as liquid crystal devices and electronic apparatuses.

Inter-electrode connection structure, inter-electrode connection method, semiconductor device, semiconductor mounting method, liquid crystal device, and electronic apparatus

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Hotaka-machi, Japan

Kenji Uchiyama