Fuji Corporation

Fuji Machine Mfg. Co., Ltd.

Kenji Tsukada

Masatoshi Fujita

Akihiro Kawajiri

Masato Suzuki

Yoshitaka Hashimoto

Ryojiro Tominaga

Katsuaki Makihara

Tasuku Takeuchi

Seigo Kodama

Kazuhiro Sugiyama

Ryo Sakakibara

A circuit forming method including a first wiring forming step of forming a first metal wiring on a resin layer, and a second wiring forming step of forming a second metal wiring on the first metal wiring, in which a Young's modulus of the first metal wiring and a Young's modulus of the second metal wiring are different from each other.

Circuit forming method

In a method for manufacturing a circuit board according to an additive manufacturing shaping method, a circuit board manufacturing method and a circuit board manufacturing device that can reduce the influence of thermal stress on a circuit board by reducing the number of heating steps are provided. A circuit board manufacturing method according to the present disclosure includes a board shaping step of laminating and shaping a circuit board having a wiring on a peeling member adhered to a base member, an attachment step of attaching a metal paste contacting the wiring to the circuit board, an electronic component arrangement step of arranging an electronic component on the circuit board to arrange the electronic component and the wiring via the metal paste, and a heating press step of arranging a press member above the circuit board, and causing the peeling member to be easily released from the base member and curing the metal paste by collectively heating the peeling member and the metal paste while pressing the circuit board with the base member and the press member to correct warpage of the circuit board.

Circuit board manufacturing method and circuit board manufacturing device

To provide an electronic circuit production method using 3D layer shaping capable of producing an electronic circuit having improved electrical properties and mechanical properties by utilizing characteristics of a fluid containing a metal particle by selectively using the fluid containing the metal particle. The electronic circuit production method using 3D layer shaping, the method including a wiring forming step of forming a wiring by applying a fluid containing a nano-sized metal nanoparticle on an insulating member and curing the applied fluid containing the metal nanoparticle; and a connection terminal forming step of forming a connection terminal electrically connected to the wiring by applying a fluid containing a micro-sized metal microparticle and curing the applied fluid containing the metal microparticle.

Electronic circuit production method using 3D layer shaping

A circuit formation method includes: a protruding portion formation step of forming a protruding portion by applying a curable viscous fluid onto a base and curing the curable viscous fluid; a wiring formation step of forming a wiring extending toward the protruding portion by applying a metal-containing liquid containing nanometer-sized metal fine particles onto a base and making the metal-containing liquid conductive; a paste application step of applying a resin paste containing micrometer-sized metal particles different from the metal-containing liquid on the protruding portion and the wiring, such that the protruding portion and the wiring are connected to each other; and a component placement step of placing a component having an electrode on the base, such that the electrode is in contact with the resin paste applied on the protruding portion.

Circuit formation method

A circuit forming method, comprising: a coating step of applying a metal-containing liquid and a metal paste in an overlapping manner on a base, the metal-containing liquid containing fine metal particles and the metal paste containing a resin binder and metal particles larger than the fine metal particles in the metal-containing liquid; and a heating step of making the metal-containing liquid and the metal paste coated in the coating step conductive by heating the metal-containing liquid and the metal paste.

A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.

Manufacturing apparatus for performing additive manufacturing of an electrical device

In a circuit forming device, a resin laminated body is formed by curing an ultraviolet curable resin ejected by an ejecting device. Then, ultraviolet curable resin is ejected into a cavity of the resin laminated body, and an electronic component is placed on the ultraviolet curable resin. Then, the electronic component is cured and the electronic component is fixed.

Method for forming circuit

A circuit forming method where a metal ink is ejected to a planned formation position of a first wiring at an upper face of a base material. Then, the metal ink is baked, and first wiring is formed. Further, a planned connection section of the first wiring and a second wiring is unbaked. The metal-ink is ejected over an upper face of the unbaked metal ink and a planned formation position of the second wiring at the upper face of the base material. Since the wettability of the upper face of the unbaked metal ink and the wettability of the upper face of the base material are equal to each other, the ejected metal ink ejected and the unbaked metal ink are not separated from each other, so that it is possible to properly connect the first wiring and the second wiring to each other.

To provide a data conversion device capable of generating data necessary for shaping a target object using an inkjet method from three-dimensional data in accordance with an impact diameter. Grid data generation section of data conversion device generates grid data obtained by defining layer data by each grid region indicating a position to which a droplet is ejected by the inkjet method. Ejection position change section changes the position (ejection region) to which the droplet is ejected on grid data, based on impact diameter when the droplet is ejected and length of grid regions.

Data conversion device and lamination shaping system

A device forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a first conveyance speed (low speed) in a case in which a wiring layer forming process is performed directly after the resin layer forming process, and forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a second conveyance speed (high speed) in a case in which a consecutive resin layer forming process is performed directly after the resin layer forming process.

Wiring board manufacturing method and wiring board manufacturing device

When manufacturing three-dimensional electronic device by layering multiple layer cross sections sliced at a predetermined thickness of three-dimensional electronic device which is the target for forming, first, each layer cross section using multiple types of materials is formed by being layered on top of the layer cross section underneath, and each time a layer cross section is formed, the cross section is cured or sintered by being exposed to ultraviolet light, a laser beam, visible light, and so on. The forming method for each cross section may be forming cross section by discharging a binder via a droplet discharge method such as inkjet printing or dispensing, or by spreading a layer of powdered material and bonding the powdered material by discharging a binder or sintering it by exposing it to a laser beam.

Electronic device manufacturing device and manufacturing method thereof

To form wiring on circuit board and conductor body, metal ink containing metal particles is dispensed by inkjet head straddling the circuit board and the conductor body. Then, a laser is applied by laser emitting device to the dispensed metal ink. The metal ink to which the laser is applied is baked and wiring is formed. A laser corresponding to the laser emission amount per unit of area based on the material of the circuit board, which is resin, is applied to the metal ink on the circuit board, and a laser corresponding to the laser emission amount per unit of area based on the conductor body is applied to the metal ink on the conductor body. The metal ink on the circuit board and the metal ink on the conductor body is baked appropriately, and wiring is formed appropriately straddling the circuit board and the conductor body.

Wiring forming method and circuit board

An inkjet printing device including a head unit that includes an inkjet head, a fixed tank for storing ink to be supplied to the inkjet head, and a tank attachment section to which ink tank for storing ink to be replenished to the fixed tank is exchangeably attached. When ink tanks are exchanged, an ink tank attached to the tank attachment section of head unit is removed by an arm section of the tank exchange mechanism, and an ink tank to be used for exchange removed from tank storage unit is attached to the tank attachment section of the head unit.

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Toyota, Japan

Kenji Tsukada