Fujitsu Corporation

Kenji Takano

Kenichiro Abe

Takashi Shuto

Kenji Iida

Kiyotaka Seyama

Keiji Arai

Kaoru Sugimoto

Kazuya Arai

Junichi Kanai

Munekazu Shibata

Kenji Ilda

Takefumi Kashiwa

The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

Wiring board manufacturing method

A process for producing a circuit board includes the steps of etching the third metal layer of a three-layer metal laminate into a predetermined interconnection pattern by photolithography; forming a laminate on the interconnection pattern by a buildup method, the laminate including interconnection patterns with insulating layers provided therebetween, the interconnection patterns being electrically connected to each other; separating a first metal layer from a supporting substrate to detach the laminate; removing the first metal layer of the three-layer metal laminate by etching using a second metal layer as a barrier layer; and removing the exposed second metal layer by etching.

Process for producing circuit board

The method of manufacturing a circuit board is capable of preventing deformation of a core substrate, ensuring size thereof and highly concentrating cable patterns so as to realize compact and high-performance semiconductor devices. The method of manufacturing a circuit board of the present invention comprises the steps of: forming a multilayered body, in which cable patterns on different layers insulated by an insulating layer are electrically connected, on a core substrate by a buildup process; and separating the multilayered body from the core substrate. A metal layer is vacuum-adhered on the core substrate. The multilayered body is formed on the metal layer by the buildup process and separated from the core substrate together with the metal layer by breaking the vacuum state between the core substrate and the metal layer

Method of manufacturing circuit board

Growing community of inventors

Kawasaki, Japan

Kenji Takano