Hitachi Chemical Company, Ltd.

Kenji Takai

Akio Takahashi

Norio Moriike

Shin Takanezawa

Yoshinori Ejiri

Katsuyuki Masuda

Kiyoshi Hasegawa

Kenichi Kamiyama

Takayuki Sueyoshi

Koji Morita

Takako Watanabe

Nobuyuki Ogawa

Toshihisa Kumakura

Takako Ejiri

Takahiro Tanabe

Hitoshi Onozeki

Anthony H Tsai

Tatsuya Matsunaga

The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 &#x3bc;m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 &#x3bc;m or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.

Formation method of metal layer on resin layer, printed wiring board, and production method thereof

The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.

Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof

Formation method of metal layer on resin layer

Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 &#x3bc;m on a metal whose surface has a ten-point average roughness Rz of 2.0 &#x3bc;m or less, wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin selected from the group consisting of a novolak epoxy resin and an aralkyl epoxy resin; and (C) an epoxy resin curing agent.

Adhesion assisting agent fitted metal foil, and printed wiring board using thereof

Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof

Growing community of inventors

Oyama, Japan

Kenji Takai