Canon Kabushiki Kaisha

Kabushiki Kaisha Toshiba

Rohm Co., Ltd.

Renesas Technology Corp.

Other

Toshiba Memory Corporation

Intel Corporation

Sanyo Electric Co., Ltd.

Ajinomoto Co., Ltd.

Anam Industrial Co., Ltd.

Nec Corporation

Nippon Kokan Kabushiki Kaisha

Fujitsu Microelectronics Limited

Kenji Takahashi

Kazumasa Tanida

Hisashi Ishikawa

Hiroshi Tajika

Ichiro Saito

Norihiro Kawatoko

Yuji Konno

Maki Kato

Yoshiro Udagawa

Masafumi Sano

Yoshinori Misumi

Ryo Hayashi

Takahiro Matsui

Takuya Hatsui

Akitoshi Yamada

Takashi Sasaki

Yuzuru Ishida

Miyuki Fujita

Souta Takeuchi

Eiichiro Ikeda

Hideo Numata

Masao Kato

Masahiko Kubota

Ikuo Nakazawa

Mie Matsuo

Ryuichi Kobayashi

Yoshinobu Shiraiwa

Mitsuo Umemoto

Hideo Aoki

Ichiro Omura

Hirokazu Komuro

Nobuyuki Hirayama

Katsumi Abe

Hisashi Kaneko

Chiaki Takubo

Nobuhiro Takeda

Makoto Sekita

Toshiyasu Sakai

Akira Suzuki

Yoshio Okayama

Hideya Kumomi

Kenji Kyuma

Masaya Uyama

Masato Ikeda

Hirokazu Ezawa

Yoshihiro Tomita

Kenichi Matsushita

Shinya Hirai

Norihiro Yoshinari

Sadayoshi Sakuma

Yoshihiko Nemoto

Shigeo Ogura

Hiroshi Kyogoku

Hirowo Inoue

Soichiro Nagamochi

Shuichi Tamatsukuri

Masahiro Sekiguchi

Mototaka Kanematsu

Shinya Iwahashi

Satoshi Hongo

Nobuo Onuma

Yumiko Hidaka

Futoshi Sasaki

Masaya Shima

Kanako Sawada

Hee Yeoul Yoo

Atsushi Kurosu

Yasuhiro Kusunose

Hiroo Inoue

Masamoto Tago

Ruriko Mikami

Seiichiro Yaginuma

Koujiro Kameyama

Takeru Yasuda

Makoto Sakurai

Akio Goto

Naoko Yamaguchi

Sunao Kurahashi

Kinya Ichikawa

Yasuhiro Yamaji

Akinori Horiuchi

Atsuko Kawasaki

Eiji Takano

Junichi Asada

Kenzo Ishida

Seiko Minami

Shiro Sujaku

Susumu Harada

Shuji Inoue

Seiichi Hirata

Toshiharu Sakurai

Kenzo Yamada

Ninao Sato

Masataka Hoshino

Mitsunori Toshishige

Yoshio Kinoshita

Jiro Kubota

Akihiro Hori

Tatsuhiko Shirakawa

Kazunori Hayashi

An ultrafine bubble (UFB)-containing liquid manufacturing apparatus includes a liquid ejecting unit having a thermal energy generating element, a flow path for leading liquid to the thermal energy generating element, a driving unit configured to drive the thermal energy generating element, and an ejection opening. The UFB-containing liquid manufacturing apparatus also includes a collecting unit configured to collect liquid ejected from the ejection opening. The driving unit drives the thermal energy generating element to cause film boiling in liquid led to the flow path and causes liquid containing ultrafine bubbles generated by the film boiling to be ejected from the ejection opening.

Ultrafine bubble-containing liquid manufacturing apparatus and manufacturing method

Ultrafine bubbles with a diameter of less than 1.0 &#x3bc;m are generated in liquid by causing film boiling in liquid by means of a heater.

Ultrafine bubble generating method, ultrafine bubble-containing liquid manufacturing apparatus and manufacturing method, and ultrafine bubble-containing liquid

A liquid ejection head including an orifice plate including an ejection orifice, an element substrate including an energy-generating element, and a flow path wall member for formation of a flow path, the flow path wall member being disposed between the element substrate and the orifice plate, wherein the orifice plate includes a first surface and a second surface which is opposite to the first surface and which is disposed facing the element substrate, the first surface includes a first diamond-like carbon film, respective contact angles &#x3b8;and &#x3b8;to pure water, of the first surface and the second surface, satisfy a relationship of Expression 1 defined in the specification, and composition in the first surface of the first diamond-like carbon film satisfies all relationships of Expression 2 to Expression 5 defined in the specification.

Liquid ejection head

A liquid ejection head is equipped with a substrate having therethrough a supply path to be supplied with a liquid, a top plate placed opposite to the substrate, having an ejection orifice for ejecting the liquid and constituting, between the top plate and the substrate, a flow path communicated with the supply path and the ejection orifice and a columnar member extending from the top plate to the inside of the supply path through the flow path. An end surface of the columnar member positioned in the supply path is tilted relative to the top plate in a direction away from the ejection orifice.

Liquid ejection head and method of manufacturing same

According to one embodiment, a semiconductor manufacturing method for a stacked body that includes a semiconductor substrate, a supporting substrate containing silicon, and a joining layer arranged between the semiconductor substrate and the supporting substrate to joint the semiconductor substrate and the supporting substrate, in which a surface of the semiconductor substrate opposite to the joining layer is to be ground, includes irradiating the stacked body with electromagnetic wave having energy of 0.11 to 0.14 eV from a side of the supporting substrate, and separating the semiconductor substrate from the supporting substrate.

Semiconductor manufacturing method and semiconductor manufacturing device

A storage system includes a storage unit having a plurality of routing circuits electrically networked with each other, each of the routing circuits being locally connected to a plurality of node modules, each of which includes nonvolatile memory, the plurality of node modules forming at least first and second storage regions, and a plurality of connection units, each connected to one or more of the routing circuits, and access the first and second storage regions through one or more of the routing circuits in accordance with a command. When one of the connection units receives a command to write second data into the first storage region while first data are being read out from the first storage region, said one of the connection units writes the second data into both the first and second storage regions.

Storage system that includes a plurality of routing circuits and a plurality of node modules connected thereto

A storage system includes a plurality of storage devices, and a server including a memory and an interface. The server is configured to store, in the memory, each of data pieces that are received through the interface from a client as a series of data to be written, in association with a single write command or a series of write commands received through the interface from the client, for each data piece, determine a target storage device and a logical address thereof at which the data piece is to be written, based on an identifier of the data piece received in association with the data piece through the interface from the client, and carry out, in parallel, writing of the data pieces stored in the memory at the determined logical addresses.

Parallel processing of a series of data units for writing

A method of manufacturing a semiconductor device includes disposing a peel-off layer on the second surface of the first substrate, wherein the second surface of the first substrate comprises semiconductor integrated circuits, and the peel-off layer does not extend to an outer peripheral portion of the first substrate, bonding a second substrate to the peel-off layer via a bonding layer, attaching a tape onto the first surface of the first substrate, wherein the tape comprises an adhesive agent having an adhesive strength capable of being lowered by UV irradiation, irradiating a portion of the adhesive agent provided at the outer peripheral portion with UV rays directed toward the first surface, and separating the first substrate from the second substrate at the adhesive agent portion and the peel-off layer portion.

Method for manufacturing semiconductor devices through peeling using UV-ray

A method for manufacturing a liquid ejection head substrate, in which a heat storage layer, a pair of electrodes extending from the surface of the heat storage layer toward the back surface, a heat-generating resistor layer in contact with the pair of electrodes and the surface of the heat storage layer, and a first cover layer configured to cover the heat-generating resistor layer are stacked, includes the steps of etching the heat-generating resistor layer and the first cover layer by using a mask disposed on a substrate including the heat-generating resistor layer and the first cover layer, removing the mask, and forming a second cover layer configured to cover an end portion of the heat-generating resistor layer in that order.

Method for manufacturing liquid ejection head substrate

A KVS data processing unit, upon receiving a KVS type command of a database system in which index data and actual data are stored in a pair, manipulates data stored in a storage device based on said command. An SQL command execution unit, upon receiving an SQL command, serializes this command, generates KVS type data, and passes this data to the KVS data processing unit. A KVS command processing unit, upon receiving a KVS command, serializes this command, and transmits this data to the KVS data processing unit.

Database device

A reproduction method of a liquid ejecting head including: a process of filling the flow path with an electrolyte solution containing metal, and filling a space between an electrode capable of applying a voltage to between itself and the upper protective film and the upper protective film with the electrolyte solution; and a process of applying a voltage to between the upper protective film and the electrode to make the metal contained in the electrolyte solution deposit on the surface of the upper protective film.

Reproduction method of liquid ejecting head

Even if electrostatic discharge occurs, dielectric breakdown of an insulating layer for covering an element on a base substrate is inhibited. A substrate for an ink jet recording head includes: a base substrate including an element configured to apply energy for ejecting ink to ink and an insulating protective layer for covering the element; an ejection orifice forming member including an insulating first member for forming an ink flow path for supplying ink to the element and a second member including an ejection orifice surface having ejection orifices provided therein; and a columnar conductive member extending between the second member and the base substrate in a direction intersecting the ejection orifice surface.

Substrate for ink jet recording head

An element substrate including a base having a heat-generating resistor element which generates thermal energy used for discharging a liquid; an electrically conductive protective layer covering the heat-generating resistor element; an insulating layer provided between the heat-generating resistor element and the protective layer; and a potential applying unit for applying a potential to the protective layer such that a potential of the protective layer is lower than a potential at one end of the heat-generating resistor element and higher than a potential at the other end of the heat-generating resistor element with a voltage being applied between the one end and the other end of the heat-generating resistor element.

Element substrate and method for discharging liquid

Cleaning under appropriate cleaning conditions is performed by disposing an electrode pair for measuring conductivity in the same liquid chamber as that of a material layer (i.e., an upper electrode) of a surface of a thermal action portion to be eluted, and measuring conductivity of a liquid using the electrode pair before kogation is removed.

Liquid ejection head, method for cleaning the head, recording apparatus provided with the head

An image sensing apparatus that carries out image sensing continuously and inputs a plurality of images, having a digital signal processing circuit that detects, at each input image, from image data thereof, an object that satisfies a preset condition, a first exposure value determination unit that calculates a first exposure value from the image data, a second exposure value determination unit that calculates a second exposure value based on the detected object, and a selection unit that selects either the first exposure value, the second exposure value, a currently set exposure value, or an exposure value calculated based on a luminance of an area referenced when calculating a currently set exposure value as an exposure value to be used for a next image sensing based on object detection results obtained by the digital signal processing circuit.

Image sensing apparatus and control method therefor

Growing community of inventors

Kawasaki, Japan

Kenji Takahashi