Toshiba Mitsubishi-Electric Industrial Systems Corporation

Kureha Corporation

Kenji Suzuki

Michihisa Miyahara

Hiroshi Sakabe

Toshihide Nakano

Koki Nakamura

Hidetaka Ishitobi

Yoshino Harada

A coupling member includes: first, second, and third portions each having a flat plate-like shape; and a fillet portion. The first portion has a first side and a second side orthogonal to each other. The second portion is bent at the first side relative to the first portion, and extends to an inner surface of the first portion. The third portion is bent at the second side relative to the first portion, and extends to an inner surface of the first portion. A bend radius of an outer surface of the coupling member at the first side is equal to a bend radius of a surface of a first extending member facing the first side. A bend radius of an outer surface of the coupling member at the second side is equal to a bend radius of a surface of a second extending member facing the second side.

Coupling member and housing

A first AC terminal, a first positive DC terminal, and a first negative DC terminal protrude from a first end portion in the length direction of a flat plate portion of a laminated bus bar. The first AC terminal, the first positive DC terminal, and the first negative DC terminal are arranged in alignment in this order from a third end portion toward a fourth end portion in a width direction of the flat plate portion. A second AC terminal, a second positive DC terminal, and a second negative DC terminal protrude from a second end portion of the flat plate portion in the length direction. The second AC terminal, the second negative DC terminal, and the second positive DC terminal are arranged in alignment in this order from the third end portion toward the fourth end portion.

Laminated bus bar, power converter, power conversion device, and uninterruptible power supply device

The semiconductor device according to the present invention includes a semiconductor module, a cooling member, and a heat transfer member. The semiconductor module includes a switching element and a diode connected in antiparallel to each other. The heat transfer member is disposed between the semiconductor module and the cooling member so as to transfer heat generated by the switching element and the diode to the cooling member. The heat transfer member has a mounting surface on which the switching element and the diode are mounted side by side and a surface which is opposite to the mounting surface and is disposed in contact with the cooling member. In the heat transfer member, the thermal conductivity in a first direction parallel to the mounting surface is higher than the thermal conductivity in a second direction perpendicular to the mounting surface.

Semiconductor device having a switching element and a diode connected in antiparallel

The production method of the present invention includes: a supplying step of supplying reaction raw materials to at least one of a plurality of reaction vessels mutually communicated through a gas phase; a polymerizing step of carrying out a polymerization reaction; and a step of removing at least some of the water present in the reaction vessels. Each of the steps is carried out in parallel, and a reaction mixture is transferred sequentially between the reaction vessels. The total amount of water contained in the reaction raw materials in at least one of the reaction vessels to which the reaction raw materials are supplied is 3 moles or more per mole of the sulfur source, and the internal temperature of at least one of the reaction vessels to which the reaction raw materials are supplied is from 180&#xb0; C. to 300&#xb0; C.

Growing community of inventors

Chuo-ku, Japan

Kenji Suzuki