Matsushita Electric Industrial Co., Ltd.

Other

Kenji Suga

Masaharu Miyahara

Hironori Ito

Kazuya Shibasaki

Hiroshi Nakamura

Koji Mehara

Yasushi Inoue

Kazuhiko Sugimoto

Sumio Tate

Hisao Tada

A fan-motor-incorporated heat sink effectively supplies cooling air flow in a thin electronic device having limited space above the heat sink. The heat sink enables air intake above the heat sink by positioning a fan, the fins of a heat sink substrate and the side wall of the substrate lower than the fan driving unit. The heat sink substrate and the fins are formed such that air is exhausted only in one direction. A cover is provided on the side of the heat sink substrate on which the fan driving unit is mounted and to which air is taken in to prevent exhausted air from being taken in. The structure of the electronic device is positioned close to the upper surface of the fan driving unit on the heat sink. Thus, the heat sink can be installed on a thin electronic device while improving the cooling of a heat emitting element.

Heat sink and electronic device employing the same

A blower is provided for effectively cooling heat generating parts in a casing of a personal computer and so on, with a heat sink apparatus using the blower and an electronic equipment using the heat sink apparatus. The blower comprises a fan and an outer frame. The outer frame of the fan is made of a highly thermally conductive material such as aluminum. A radiation board is fixed to or formed integrally with a lower surface of the outer frame. Heat generated from a heat generating device is conveyed through the radiation board to the outer frame. The blower is provided with radiation fins so that the heat conveyed to the outer frame is transferred to the radiation fins as well.

Heat sink apparatus, blower for use therein and electronic equipment using the same apparatus

It is intended to provide a heat sink unit and an electronic apparatus capable of efficiently cooling a plurality of semiconductor devices and taking action for unnecessary electromagnetic waves. There are provided a plurality of fan units and electromagnetic shielding means for cutting off electromagnetic waves on a heat sink substrate. It is also provided a heat sink substrate, a unit having a fan for supplying fluid to the heat sink substrate and driving means for rotating the fan, and electromagnetic shielding means provided for the heat sink substrate.

Heat sink unit for cooling a plurality of exothermic units, and electronic apparatus comprising the same

There is disclosed a thermal conductive member which can be easily handled, and has high thermal conductivity and the high ability of intimate contact with a heat-generating device and a heatsink, and applies a small stress to a semiconductor package. An electronic device, using this thermal conductive member, is also disclosed. The thermal conductive member connects the heat-generating member to the heatsink serving to radiate heat generated by said heat-generating member, and includes an elastic member, and a thermal conductive foil wound on an elastic member in intimate contact therewith. The electronic device includes the heat-generating member such as a semiconductor, the heatsink for radiating heat generated by the heat-generating member, and the above thermal conductive member interposed between the heat-generating device and the heatsink. Even if the elastic member is made of nitrile rubber or silicone rubber, and the thermal conductive foil is made of graphite, copper or aluminum, the thermal conductivity is effected satisfactorily through the elastic member and the high thermal conductivity foil.

Thermal conductive member and electronic device using same

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Nakatsu, Japan

Kenji Suga