Ube Industries, Inc.

Kenji Sonoyama

Takeshige Nakayama

Tomonori Nakayama

Hiroshi Inoue

Seiichirou Takabayashi

Seiji Ishikawa

Susumu Takasaki

Koji Hayashi

Akira Kawabata

Tadao Muramatu

A method for producing an aqueous polyimide precursor solution composition includes reacting a tetracarboxylic dianhydride and a diamine in the presence of an imidazole, using water as a reaction solvent to provide an aqueous polyimide precursor solution composition. The polyamic acid and the imidazole are dissolved in the water. A concentration of the polyamic acid is 5 to 45 wt %, The imidazole is an imidazole having two or more alkyl groups as substituents. An amount of the imidazole is 1.6 moles or more per mole of the tetracarboxylic dianhydride, and a concentration of the imidazole compound based on a sum of the imidazole compound and the water is 9.47 wt % or less. The diamine component includes a diamine having a solubility in water at 25&#xb0; C. of 0.1 g/L or more.

Method for producing aqueous polyimide precursor solution composition

A process for producing a polyimide film laminate includes a substrate and a polyimide film, which includes forming a coating film including a polyamic acid solution composition on the surface of a substrate to produce a laminate composed of the substrate and the polyamic acid solution composition, heating the laminate composed of the substrate and the polyamic acid solution composition at a temperature ranging from at least 150 to 200&#xb0; C. for 10 minutes or longer, and then heating the heated laminate at a temperature up to 400 to 550&#xb0; C.

Production process of polyimide film laminate, and polyimide film laminate

Dicing tape comprises a tackifiable adhesive layer which is composed mainly of a polyimide and has a peel strength of 0.02 N/mm (20 gf/cm) or greater as the adhesive strength at near room temperature (20-50&#xb0; C.) and a cured peel strength of 0.3 N/mm (300 gf/cm) or greater. The tape exhibits adhesive strength with silicon wafers sufficiently high to allow dicing at near room temperature, and also exhibits high adhesive strength with circuit boards after curing, in light of the processing disadvantages of polyimide-based dicing tape resulting from its low tacky strength (initial adhesive strength) at low temperatures of around room temperature, which requires a higher ambient temperature to increase the adhesive force and thus necessitates supplementary heating equipment.

Dicing tape

An adhesive polyimide composition comprises 100 weight parts of a polyimide siloxane having a Tg of not lower than 200.degree. C. and 0.2 to 5 weight parts of a silane coupling agent having a glycidyl group. An epoxy resin may be incorporated into the polyimide composition. The polyimide siloxane is prepared by polymerization reaction of an aromatic tetracarboxylic acid dianhydride or its derivative and a diamine composition comprising 5 to 25 mol. % of a specific diaminosiloxane and 75 to 95 mol. % of an aromatic diamine having at least two benzene rings and one oxygen atom intervening these benzene rings. The adhesive polyimide composition is generally employed in the form of a solution in an organic solvent and for combining electrically conductive or insulating members.

Growing community of inventors

Ube, Japan

Kenji Sonoyama