Ebara Corporation

Kenji Shinkai

Hiroshi Aono

Kuniaki Yamaguchi

Hideo Aizawa

Tadakazu Sone

Hiroyuki Shinozaki

Koji Maeda

Soichi Isobe

Hiroshi Shimomoto

Hidetatsu Isokawa

Masayuki Tamura

Mitsuhiko Inaba

Koichi Hashimoto

Tetsuya Yashima

Mitsuru Miyazaki

Junji Kunisawa

Toshio Yokoyama

Fujihiko Toyomasu

Haiyang Xu

Hidetaka Nakao

Shun Ehara

Dai Yoshinari

Kentaro Asano

Yusuke Mochida

A liquid feeder includes: a first arm having a first nozzle; a second arm having a second nozzle; a first rotation shaft supporting a proximal end part of the first arm; a second rotation shaft supporting a proximal end part of the second arm; a first rotation driver configured to rotate the first rotation shaft to turn the first arm from a fluid feed position to a retracted position; a second rotation driver configured to rotate the second rotation shaft to turn the second arm from a fluid feed position to a retracted position; and a controller. The first rotation shaft and the second rotation shaft are disposed coaxially with each other. The controller is capable of controlling the operation of the first rotation driver and the operation of the second rotation driver independently of each other.

Liquid feeder and polishing apparatus

A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.

Substrate processing apparatus

A substrate polishing apparatus includes a polishing tablehaving a polishing surfacein the upper surface, a substrate holding portionthat holds a substrate W having a surface to be polished in the lower surface, and a holding portion coverthat covers the outer side of the substrate holding portion. Between the lower portion of the holding portion coverand the upper surface of the polishing table, a gap portion for intakeis provided, and in the upper portion of the holding portion cover, a pipe for exhaustconnected to an exhaust mechanismis provided. By operating the exhaust mechanism, a rising air current from the gap portiontoward the pipeis formed between the outer surface of the substrate holding portionand the inner surface of the holding portion cover

Substrate polishing apparatus

A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.

The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.

Cleaning apparatus and substrate processing apparatus

There is provided a cover to which a polishing liquid is less likely to stick and solidify. The cover for a component of a polishing apparatus for polishing substrates is provided with a locking mechanism disposed inside the cover and configured to latch together a main body of the component and the cover. An external surface of the cover exposed to the outside has no recessed portion, and has no horizontal plane, except on the top portion of the cover.

Cover for component of polishing apparatus, component of polishing apparatus, and polishing apparatus

A lifting deviceincludes a lifting mechanismand an adjustment member. The lifting mechanismis provided between at least one of a plurality of units of a substrate processing apparatus and an installation surface of the unit, and adjusts height of the at least one unit with respect to the installation surface. The adjustment memberis provided with an extended sectionextended from the lifting mechanism, and is capable of operating the lifting mechanismthrough the extended section

Lifting device, substrate processing apparatus having lifting device, and unit transferring method

Growing community of inventors

Tokyo, Japan

Kenji Shinkai