Bando Chemical Industries, Inc.

Kenji Shimoyama

Toshikazu Taura

Kazuo Saito

Takuya Tomura

Tomoki Iwanaga

Mitsuru Yamada

Tomofumi Watanabe

Miki Matsui

Masafumi Takesue

The purpose of the present invention is to provide a grinding material which has a superior grinding rate and planarizing accuracy, with the grinding rate being less likely to be reduced over a relatively long period of time. The present invention is directed to a grinding material including a base, a grinding layer overlaid on a front face side of the base and including grinding grains and a binder for the grinding grains, and an adhesion layer overlaid on a back face side of the base, in which the grinding grains are diamond grinding grains, a wear quantity of the grinding layer as determined by a Taber abrasion test is no less than 0.03 g and no greater than 0.18 g, and, an Asker D hardness measured from a front face side of the grinding layer is no less than 80&#xb0; and no greater than 98&#xb0;.

Grinding material and production method of grinding material

An conductive paste comprises inorganic particles having alkylamine with 6 or less of carbon number on at least a portion of a surface, a polymer dispersant having a pigment affinity group in a main chain and/or a plurality of side chains, and, that comprising a polymer with a comb structure having a plurality of side chains constituting a solvation portion, a polymer having a plurality of pigment affinity portions made from a pigment affinity group in the main chain or a straight-chain polymer having a pigment affinity portion made from a pigment affinity group in one terminal of the main chain, a dispersion medium, wherein a weight reduction percentage at the time of heating solid content of the conductive paste from room temperature to 500&#xb0; C. by thermal analysis is 15% by weight or less.

Conductive paste

To provide a bonding composition where high joint strength can be obtained due to joining at a comparatively low temperature and under a pressureless condition, and, that is also equipped with thermal resistance that is difficult to cause a reduction of joint strength due to decomposition, deterioration and/or the like of a resin component at the time of an increase of an operating temperature, and to provide a bonding composition particularly containing metallic particles. A bonding composition containing inorganic metallic particles and organic components including unsaturated hydrocarbon and amine with 4 to 7 of carbon number

Bonding composition

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Kobe, Japan

Kenji Shimoyama