Toyobo Co., Ltd.

Toyo Boseki Kabushiki Kaisha

Toyobo Mc Corporation

Kenji Shiga

Mitsuo Nishida

Daiki Funaoka

Akira Nishimoto

Osamu Iritani

Yosuke Watanabe

Junko Sakai

Kazunori Komatsu

Takashi Matsuo

Provided is a sealant for electrical and electronic parts having excellent fire resistance and adhesiveness, and provided are a method for manufacturing a sealant for electrical and electronic parts suitable therefor and a resin composition for sealing electrical and electronic parts. A resin composition for sealing electrical and electronic parts containing: a polyester (A) obtained by copolymerizing a polyalkylene glycol component and/or a polylactone component; an epoxy resin (B); a polyolefin resin (C); and a phosphoric acid ester (D).

Resin composition for sealing electrical electronic parts, method of producing electrical electronic parts, and sealed electrical electronic parts

It is provided that a resin composition for sealing electrical electronic components which is not susceptible to gelation even when stagnant under high temperature conditions, and which are excellent in initial bond strength to an aluminum material, and which exhibits superior durability under a cooling and heating cycle load and the like. It is also provided that a sealed electrical electronic component with the resin composition for sealing electrical electronic components. A resin composition for sealing electrical electronic components, containing a crystalline polyester-based elastomer (A), a phenol-modified xylene resin (B1) and/or a phenol resin (B2), and a polyolefin resin (C), and having a melt viscosity of 5 dPa&#xb7;s or more and 3000 dPa&#xb7;s or less when dried to a water content of 0.1% or less, heated to 220&#xb0; C., subjected to a pressure of 1 MPa, and extruded through a die with a hole diameter of 1.0 mm and a thickness of 10 mm.

Resin composition for sealing electrical electronic components, method of producing electrical electronic component, and sealed electrical electronic component

It is provided that a polyester composition for electrical/electronic part-sealing material having melt fluidity, initial peel strength, and initial dielectric breakdown strength that are required for electrical/electronic part-sealing material while also having excellent heat resistance, resistance to thermal aging, and durability with respect to hot-cold cycling. A polyester resin composition for electrical/electronic part-sealing material, comprising, as a main component, a copolymer polyester elastomer containing 50 weight % or more and 70 weight % or lower of an aliphatic polycarbonate segment and having 6 equivalents/10g or more and 50 equivalents/10g or lower of terminal vinyl groups.

Polyester resin composition for electrical/electronic part-sealing material, sealed product, and production method thereof

An object of the present invention is to provide a modifier which improves moldability in melt molding, particularly, injection molding, extrusion molding, profile molding, direct blow molding, or calendar processing molding using a polyester resin and, furthermore, which can improve mechanical physical property while maintaining transparency, and a polyester molded article using the modifier. The present invention relates to a modifier for a polyester resin, comprising an amorphous polyester resin (I), and a reactive compound (II) containing two or more glycidyl groups and/or isocyanate groups per one molecule and having a weight average molecular weight of not less than 200 and not more than 500 thousands.

Modifier for polyester resin and process for producing molded article with the same

A polyester resin composition for profile extrusion molding comprising an amorphous polyester, at least one component selected from the group consisting of a crystalline polyester and a nucleating agent, and optionally a reactive compound; a polyester resin composition for profile extrusion molding comprising a polyester resin, and a reactive compound having a weight average molecular weight of 200 to 500,000; and a profile shape comprising a resin having a reduced viscosity ratio of 1.01 to 3.00, a reduced viscosity ratio being a ratio of a reduced viscosity of a resin after molding to that of a resin before molding. They do not suffer from sagging in the molding process, they improve the shape accuracy at corners and edges of profile shapes from a die to a sizing step and also resistance to whitening on bending in transparent products, and can provide profile shapes having good solvent resistance and detergent resistance.

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Otsu, Japan

Kenji Shiga