Rohm Co., Ltd.

Tdk Corporation

Sae Magnetics (h.k.) Limited

Sony Corporation

Mitsubishi Gas Chemical Company, Inc.

Sony Computer Entertainment Inc.

Hymo Corporation

Kenji Sakai

Koji Shimazawa

Yasuhiro Ito

Yoshihiro Tsuchiya

Osamu Shindo

Kazuyoshi Izumi

Hisao Takeda

Eiji Yamada

Hiroyuki Tajiri

Katsuyuki Kanetaka

Mika Suzuki

Takumi Ohara

Toshiyuki Shimazawa

Nobutoshi Ootsuka

Hidefumi Hirai

A semiconductor laser device includes a semiconductor laser chip that emits laser light, a plate-like base, and a block protruding from the base and supporting the semiconductor laser chip. The block has a supporting surface and a wire bonding surface. The supporting surface faces a first side in a first direction perpendicular to the laser light emitting direction, and supports the semiconductor laser chip. The wire bonding surface is a surface to which a wire connected to the semiconductor laser chip is connected. The wire bonding surface is shifted in a second direction perpendicular to the emitting direction and the first direction with respect to the supporting surface. The wire bonding surface is inclined relative to the supporting surface, such that the wire bonding surface is more offset to a second side in the first direction with increasing distance from the supporting surface in the second direction.

Semiconductor laser device

A semiconductor laser device Acomprises a semiconductor laser chipand a stem. The stemincludes a baseand leadsA,B, andC fixed to the base, and supports the semiconductor laser chip. The semiconductor laser device Afurther comprises a first metal layerincluding a first layercovering the baseand the leadsA,B, andC, a second layerinterposed between the first layerand each of the baseand the leadsA,B, andC, and a third layerinterposed between the second layerand each of the baseand the leadsA,B, andC. Crystal grains in the second layerare smaller than crystal grains in the third layer. Such a configuration can suppress corrosion.

A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.

Method of manufacturing laser diode unit utilizing submount bar

A game device includes an input position acquiring unit and a first game control unit. The input position acquiring unit acquires a position of an entry provided by a player to a touch panel, which can concurrently detect entries at multiple points. The first game control unit displays objects and a sequence in which the objects should be erased on a screen image, and, in case that a position of an entry acquired is at a position corresponding to a position where an object to be erased next is displayed, erases the object from the screen image. The first game control unit includes: a single tap input control unit that, when an input on one object is acknowledged, erases the object; and a multiple-graphic-symbol-tap input control unit that, when inputs on multiple objects are acknowledged concurrently, erases those objects.

Game device, game control method, and game control program for controlling game on the basis of a position input received via touch panel

Apparatus and method of manufacturing laser diode unit utilizing submount bar

A process for producing a water-soluble polymer dispersion comprising polymerizing water-soluble monomers having double bonds in an aqueous salt solution that dissolves the monomers but does not dissolve the formed polymer while stirring in the presence of a dispersant composed of a polymer electrolyte soluble in this aqueous salt solution to obtain fine polymer particles dispersed in the aqueous salt solution, characterized by adding at least one viscosity-increase suppressor selected from the group consisting of: (A) a polyvalent carboxylic acid or a salt thereof, (B) a polyvalent phenol, (C) a cyclic compound containing a hydroxyl group and a carboxyl group or a salt thereof, (D) gluconic acid or a salt thereof, (E) a reaction product obtained by reacting methoxyhydroquinone and/or (meth)acrylic cationic monomer with a compound that generates radicals in an oxidizing atmosphere, (F) a reaction product obtained by reacting (meth)acrylic cationic polymer with a compound that generates radicals in an oxidizing atmosphere, (G) a reaction product obtained by reacting (meth)acrylic cationic polymer with an oxidant, and a mixture thereof.

Process for the preparation of dispersions using viscosity-increase inhibitors of water-soluble polymers

Disclosed are an adsorbent for CO, comprising a composite comprised of a porous inorganic carrier and, carried thereon, a binary complex of a nitrogen-containing compound and a copper(I) halide, the nitrogen-containing compound being at least one member selected from at least one pyridine compound and a diamine represented by R.sup.1 R.sup.2 N(CH.sub.2).sub.n --NR.sup.3 R.sup.4, wherein n is 2 or 3 and each of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 independently represents a hydrogen atom or a C.sub.1 -C.sub.4 alkyl group, with the proviso that when n is 2, each of at least two of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 represents a C.sub.1 -C.sub.4 alkyl group atoms and that when n is 3, at least one of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 represents a C.sub.1 -C.sub.4 alkyl group, and a method for separating carbon monoxide by adsorption using the adsorbent. The adsorbent is advantageous in that the adsorbent can adsorb CO with high selectivity and has high adsorptive and desorptive ability for CO, that the adsorbent can be produced using a conventional carrier and without using hydrochloric acid, with economical advantages, and that since the adsorbent is a solid, it can be handled with ease.

Adsorbent for carbon monoxide

Growing community of inventors

Tokyo, Japan

Kenji Sakai