Seiko Epson Corporation

Kenji Otsuka

Yasuhide Matsuo

Kei Tadachi

Kosuke Wakamatsu

Hiroyuki Tsuchiya

Kazuo Higuchi

Kazuhiro Gomi

Wataru Takahashi

Minehiro Imamura

Tomohiro Hayashi

A particle coating method includes placing magnetic particles in a vessel, fixing the magnetic particles by a magnetic force caused by a magnetic field generated in the vessel, and forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method. Further, the method preferably includes forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method in a state where the magnetic particles are fixed by the magnetic force in a first direction, thereby obtaining coated magnetic particles, and forming a coating film on surfaces of the coated magnetic particles in a state where the coated magnetic particles are fixed by the magnetic force in a second direction different from the first direction.

Particle coating method and particle coating apparatus

An electronic device includes a joined-structure assembly in which a plurality of structures are joined together. At least one of the plurality of structures includes a movable region, a part of an adhesive agent applied between the structures faces a space communicating with the movable region, and the adhesive agent includes an organo-siloxane compound with three or more reaction points.

Electronic device, liquid ejection head, and method of manufacturing electronic device

A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

Joining method, apparatus of manufacturing joined body, joined body, ink jet head unit, and ink jet type recording apparatus

A method for manufacturing a MEMS device in which a plurality of substrates are joined in a stacked state and one face of faces defining a space formed in one substrate of the plurality of substrates is a movable region is disclosed.

Method for manufacturing MEMS device, MEMS device, liquid ejecting head, and liquid ejecting apparatus

A nozzle plate includes: a nozzle for discharging a liquid as droplets; a liquid-repellent film suppressing attachment of the droplets on one surface of the nozzle plate; and a first bonding film formed on the other surface of the nozzle plate and bonded with a substrate. In the nozzle plate, the liquid-repellent film includes a first plasma polymerized film having a Si skeleton, which includes a siloxane (Si&#x2014;O) bond and has a random atomic structure, and an elimination group bonded with the Si skeleton.

Nozzle plate, method for manufacturing nozzle plate, droplet discharge head, and droplet discharge device

A droplet ejection head comprises: a substrate having first through-holes forming reservoir chambers, a second through-hole forming a supply chamber, and a bonding film on one surface; a nozzle plate having nozzles for ejecting ejection liquid and a second bonding film on one surface, the first and second films being bonded together to cover the first through-holes and the second through-hole; a sealing plate on another surface of the substrate covering the first through-holes, one surface of the sealing plate contacting the substrate's another surface; and piezoelectric means on another surface of the sealing plate for driving the droplet ejection head. The bonding films contain an Si-skeleton of constituent atoms containing silicon atoms, with siloxane (Si&#x2014;O) bonds and elimination groups bonded to the silicon atoms, the constituent atoms being randomly bonded together, and the elimination groups existing near a surface of the bonding films.

Droplet ejection head and droplet ejection apparatus

A droplet ejection head comprises: a substrate having first through-holes forming reservoir chambers, a second through-hole forming a supply chamber, and a bonding film on one surface; a nozzle plate having nozzles for ejecting ejection liquid and one surface contacting the bonding film, the nozzle plate is bonded to the substrate through the bonding film to cover the first through-holes and the second through-hole; a sealing plate on another surface of the substrate covering the first through-holes, one surface of the sealing plate contacting the substrate's another surface; and piezoelectric means on another surface of the sealing plate for driving the droplet ejection head. The bonding film containing an Si-skeleton constituted of constituent atoms containing silicon atoms, with siloxane (Si&#x2014;O) bonds and elimination groups bonded to the silicon atoms, the constituent atoms being randomly bonded together, and the elimination groups existing near a surface of the bonding film.

Growing community of inventors

Chino, Japan

Kenji Otsuka