Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Kenji Otomo

Kouichi Santo

Hitokazu Shitanaka

Naohiro Nishioka

Kouji Tanabe

Futoshi Matsui

Shigetaka Douzono

Masahiro Hirobe

Takayoshi Kishimoto

Mikio Nishimura

Kazuhisa Fujita

A switch device includes a box-shaped case, a harness portion, and a fixing member. The harness portion is connected to a switch contact point and includes a plurality of lead lines extending out of the case. The case includes a holding body and a guide portion. The holding body includes a fixing portion protruding from an outer face of the case and provided on a tip side, and a through-hole provided under the fixing portion. The guide portion is opposed to the through-hole and formed in a substantially concave curve shape. The guide portion is formed such that an end portion further from the through-hole is positioned to be above an end portion closer to the through-hole. The fixing member extends through the through-hole and fixes the harness portion to the holding body by winding the harness portion and the fixing portion together.

Switch device

A switch device includes a operation body, a membrane switch pushed by the operation body, and plural push switches activated by pushing the operation body via the membrane switch. The membrane switch includes plural contact switches electrically connected upon being pushed by the operation body. The switch device is activated easily without operating errors.

Switch device and input device using the same

A method for electrically connecting an upper wiring with a lower wiring consists of the steps of arranging the upper wiring mixed with thermo-softening material on an upper insulating sheet, arranging the lower wiring mixed with thermo-softening material on a lower insulating sheet, putting the upper insulating sheet on the lower insulating sheet to bring the upper wiring into contact with the lower wiring, and providing ultrasonic vibration to the upper and lower wirings and the upper insulating sheet while pushing the upper insulating sheet toward the lower insulating sheet. In these steps, the upper and lower wirings and the upper insulating sheet are heated and melted because friction heat is generated by the ultrasonic vibration. Thereafter, the upper insulating sheet is pushed into the upper and lower wirings while pushing these wirings aside and is boded with the lower insulating sheet. Also, the upper wiring is bonded with the lower wiring so that these wirings are electrically connected.

Method for connecting a wiring arranged on a sheet with another wiring

Growing community of inventors

Fukui, Japan

Kenji Otomo