Dow Toray Co., Ltd.

Dow Corning Toray Silicone Company Limited

Dow Silicones Corporation

Dow Corning Toray Company, Ltd.

Dow Corning Corporation

Kenji Ota

Hiroshi Honma

Takao Matsushita

Kazuo Hirai

Toyohiko Fujisawa

Katsuya Baba

Thomas W Galbraith

Hiroshi Adachi

Brent D Dull

A curable organopolysiloxane composition is provided. The composition provides an organopolysiloxane cured product that can be cured at low temperatures while having high thermal conductivity and that can achieve high initial adhesion and adhesive strength to various base materials in contact during the curing process. A thermally conductive member containing the composition, and a heat dissipating structure using the member, are also provided. The curable organopolysiloxane composition comprises (A) an alkenyl group-containing organopolysiloxane having a specific viscosity, (B) an organohydrogenpolysiloxane, (C) a hydrosilylation-reaction catalyst, (D) a thermally conductive filler, (E) a siloxane compound having an alkenyl group and a hydrolyzable silyl group on ends of a specific molecular chain, (F) an alkoxysilane having an alkyl group with 6 or more carbon atoms or a hydrolyzed condensate thereof, and (G) an adhesion promoter.

Curable organopolysiloxane composition, thermally conductive member and heat dissipation structure

Provided is a thermally conductive silicone gel composition having high thermal conductivity, excellent extrudability and mixing stability, resistance to separation of each liquid even in a two-component package, stable storage, and superior gap fill properties for heat dissipating components, and the like. A multi-component thermally conductive silicone gel composition comprises: (A-1) an alkenyl group-containing organopolysiloxane having a degree of polymerization of 5 to 100; (A-2) an alkenyl group-containing organopolysiloxane having a degree of polymerization of 400 or more; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane coupling agent, and the like; and (F) an organopolysiloxane having a hydrolyzable silyl group at the end of the molecular chain. A mixture viscosity of component (A-1) and component (A-2) is within a range of 1.15 to 5.50 times the viscosity of the component (A-1) at 25° C.

Multi-component type thermally conductive silicone-gel composition, thermally conductive material and heat-emission structure

Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and has excellent gap-filling ability and repairability; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) a straight-chain organohydrogenpolysiloxane containing an average of 2 to 4 silicon-bonded hydrogen atoms per molecule, at least two of the hydrogen atoms are being located on a side chain of the molecular chain, wherein the amount of silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 mol with respected to 1 mol of an alkenyl group contained in component (A); (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; and (E) an alkoxysilane having an alkyl group with 6 or more carbon atoms per molecule.

Thermally-conductive silicone gel composition, thermally-conductive member, and heat dissipation structure

Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and is less likely to flow out and slip off/drop off from a surface on which the gel composition is placed, even when the composition that has not been cured is placed on a sloped surface or in a vertical direction, and has excellent gap-filling ability with respect to a heat dissipation part, etc., and excellent repairability if desired; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for a hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The gel composition has certain viscosity properties as disclosed herein.

Provided is: a multicomponent curable thermally conductive silicone gel composition which has a high thermal conductivity, has excellent gap-filling ability and repairability, and has superior storage stability; a thermally conductive member comprising the composition; and a heat dissipating structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent or a hydrolysis condensation product thereof; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The thermally conductive silicone gel composition includes (I) a liquid composition that includes components (A), (C), (D), (E), and (F), but does not include component (B) and (II) a liquid composition that includes components (B), (D), (E), and (F), but does not include component (C) which are individually stored.

Multicomponent-curable thermally-conductive silicone gel composition, thermally-conductive member and heat dissipation structure

The present disclosure relates to a primer composition. The primer composition comprises: a tert butyl acetate solvent; an organometallic reagent selected from organotitanates, organozirconates, aluminum organometallic compounds, and any combination thereof; an organotin compound; a silane with at least 3 hydrolyzable groups; and a polyorganosiloxane resin. Optionally, the primer composition further comprises a second solvent different from the tert butyl acetate solvent.

Low VOC construction primer

A heat-curable silicone rubber composition for a rubber laminate composed of a silicone-rubber layer and a rubber layer of a material other than silicone, the composition comprising: an alkenyl-containing diorganopolysiloxane (A) which comprises: 50 to 99 mass % of a diorganopolysiloxane (A1) that contains alkenyl groups, is capped at molecular terminals with alkenyl-containing organosilyl groups, and is free of alkenyl groups in side molecular chains; 1 to 50 mass % of an alkenyl-containing diorganopolysiloxane (A2) having two or more alkenyl groups in a side molecular chain; a fine silica powder (B); an organohydrogenpolysiloxane (C) having in one molecule at least two silicon-bonded hydrogen atoms; and an organic peroxide (D).

Heat-curable silicone rubber composition for rubber laminate

To provide a silicone rubber composition for wiper blades, which, due excellent moldability and ability to closely repeat the shape of the die during extrusion, is suitable for forming wiper blades of complicated shapes; to provide a method of manufacturing the aforementioned composition. A silicone rubber composition for a wiper blade comprising (A), a polydiorganosiloxane, (B) a finely divided, reinforcing silica filler, (C) orthoboric acid or metaboric acid, (D) a powdered calcium carbonate, (E) an organic peroxide curing agent, and an additive for improving water-repellent properties of a wiper blade made from said composition, comprising one or both of (F) a polyorganosiloxane having a viscosity of 1 to 10000 mPa&#xb7;s and containing in one molecule at least two silicon-bonded hydrogen atoms and (G) a polydiorganosiloxane having a viscosity of 1 to 10000 mPa&#xb7;s; a method of manufacturing the aforementioned composition.

Silicone rubber composition

A silicone rubber base compound for electrical wire coating such that when it is extruded using an extruding machine having a variable screw with an L/D&equals;10 and a die with a diameter of 1 mm attached thereto at a barrel and head temperature of 70&deg; C., the per-minute extruder output rate at a screw rotation speed of 100 rpm is not less than 1.2 times the extruder output rate at a screw rotation speed of 50 rpm, a silicone rubber composition for electrical wire coating obtained by compounding diacyl organic peroxide consisting of carbon atoms, hydrogen atoms, and oxygen atoms with the silicone rubber base compound for electrical wire coating, and a process for the production of silicone rubber coated electrical wire using the silicone rubber composition for electrical wire coating.

Silicone rubber base compound for electrical wire coating, silicone composition for electrical wire coating, and process for the production of silicone rubber coated electrical wire

The flame-retardant silicone rubber composition for coating electrical wire and cable that comprises

Flame-retardant silicon rubber composition for coating electrical wire

A silicone rubber composition having improved mold release properties comprising (A) silicone rubber base compound, (B) organopolysiloxane having no aliphatic unsaturated groups, (C) higher fatty acid or higher fatty acid metal salt, (D) water, and (E) curing agent.

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Ichihara, Japan

Kenji Ota