Honda Motor Co., Ltd.

Kenji Oogushi

Eisuke Komazawa

Kenji Okamoto

Masatoshi Nakajima

Hideaki Iwashita

Kenichi Nonaka

Takeshi Kato

Yoshihiko Higashidani

Yoshimitsu Saito

Naoto Doi

Masaya Deguchi

A power control apparatus is mounted on an electrically driven vehicle which includes an electrical storage device configured by connecting a plurality of batteries in parallel, a voltage detection unit which detects a voltage of each battery, and a load, and the power control apparatus includes, a voltage deviation calculation unit which is connected to the electrical storage device, and calculates voltage deviation between the plurality of batteries based on the voltage detected by each voltage detection unit at the time of driving the load which is driven by power supply from the electrical storage device, a comparator which compares the voltage deviation calculated by the voltage deviation calculation unit and a first predetermined threshold, and a cutoff detection unit which detects a presence or absence of the battery, which comes into a cutoff state in the electrical storage device, when the voltage deviation is equal to or more than the first threshold in a comparison result by the comparator.

Power control apparatus

A power semiconductor module having an integral circuit board with a metal substrate electrode, an insulation substrate and a heat sink joined is disclosed. A SiC semiconductor power device is joined to a top of the metal substrate electrode of the circuit board. A difference in average coefficients of thermal expansion between constituent materials of the circuit board in a temperature range from room to joining time temperatures is 2.0 ppm/&#xb0; C. or less, and a difference in expansion, produced by a difference between a lowest operating temperature and a joining temperature, of the circuit-board constituent materials is 2,000 ppm or less.

Power semiconductor module

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Wako, Japan

Kenji Oogushi