Sharp Kabushiki Kaisha Corporation

Fuji Electric Co., Ltd.

Funai Electric Company Ltd.

Fujitsu Corporation

Panasonic Intellectual Property Management Co., Ltd.

Komatsu Corporation

Jsr Corporation

Hitachi Zosen Corporation

Au Optronics Corporation

Symyx Technologies, Inc.

Sony Corporation

Hitachi, Ltd.

Panasonic Corporation

Kubota Corporation

Kyushu University

Kenji Okamoto

Hidefumi Yoshida

Tsuyoshi Kamada

Yoshio Koike

Seiji Tanuma

Yohei Nakanishi

Yasutoshi Tasaka

Takashi Sasabayashi

Hiroyasu Inoue

Takahiro Sasaki

Yoji Taniguchi

Yoshinori Tanaka

Katsufumi Ohmuro

Arihiro Takeda

Tetsuya Fujikawa

Shingo Kataoka

Hideo Chida

Manabu Sawasaki

Tomonori Tanose

Takatoshi Mayama

Satoshi Murata

Kunihiro Tashiro

Hisashi Yamaguchi

Hideaki Tsuda

Kazuhiko Hayashi

Kenjiro Shimada

Kazuya Ueda

Dominique Charmot

Adam Luke Safir

Isao Nishimura

Han-Ting Chang

Yuichi Inoue

Kazutaka Hanaoka

Shinji Uchida

Yuji Nakamura

Yukio Nakajima

Akira Sakai

Toshihiro Suzuki

Hisashi Watanabe

Masumi Kubo

Mitsuhiro Murata

Akihiro Yamamoto

Tsuyoshi Maeda

Masahiro Hasegawa

Toshihiro Takagi

Yuichiro Yamada

Shougo Hayashi

Makoto Tachibanaki

Hideaki Takizawa

Minoru Otani

Keiji Imoto

Makoto Morishige

Makoto Ohashi

Kouji Tsukao

Masahiro Ikeda

Tadashi Hasegawa

Atuyuki Hoshino

Noriaki Furukawa

Takeshi Kinjou

Siro Hirota

Hidaki Takizawa

Takeshi Kinjo

Katsuhiko Itoh

Yong Wang

Didier G Benoit

Tadahiko Udagawa

Takashi Aihara

Hideyuki Fukui

Yoshihiro Matsumoto

Masanori Ikeda

Naoki Yamamoto

Yasuhiro Nasu

Kiyoshi Ozaki

Satoru Kawai

Takao Ichihara

Daisuke Nagai

Shinichi Horii

Soichi Kuwahara

Masahiro Kihara

Yuji Yakura

Yosuke Iwata

Yasuhiro Inui

Hiromitsu Takeda

Shigeru Abe

Atsushi Kumano

Hitoshi Kobayashi

Hiroki Oso

Hideyuki Koyama

Yusuke Nishihara

Hideaki Masuko

Masatoshi Shibasaki

Tomoyuki Kawashima

Mitsuaki Kirisawa

Nobuyuki Sekine

Akira Shibazaki

Kosuke Kinoshita

Kazuteru Adachi

Daisuke Kawaguchi

A pressurizing suction-attachment table comprises a porous body having a suction-attachment surface on which an object can be placed, an elastic member provided to the porous body, and a frame body supporting the porous body via the elastic member. The pressurizing suction-attachment table comprises an aspirator capable of aspirating an aspiration space formed between the porous body and the frame body to cause the object to be suction-attached to the suction-attachment surface. The porous body includes an opposite surface positioned on a side opposite to the suction-attachment surface. The frame body includes a receiving surface for receiving the opposite surface when the elastic member is elastically deformed due to pressurizing the object on the suction-attachment surface thereto. The pressurizing suction-attachment table is configured such that, when the opposite surface is received by the receiving surface, the porous body applies a uniform reactive force to the object being pressurized.

Pressurizing suction-attachment table and pressurizing device equipped with the same

The present invention provides an all-solid state secondary cell equipped with: a positive electrode collector; a negative electrode collector; and a powder laminate placed between the positive electrode collector and the negative electrode collector. The powder laminate has: a positive electrode powder layer; a negative electrode powder layer; and solid electrolyte layers that are placed between the positive electrode powder layer and the negative electrode powder layer, and also cover the outer periphery of the positive electrode powder layer and the negative electrode powder layer. The powder laminate comprises a peripheral edge part, and a center part surrounded by this peripheral edge part. The thickness of the peripheral edge part is the thickness of the center part or greater.

All-solid state secondary cell and production method for the same

Provided is an exhaust system for an engine in which a fastening force of a fastener hardly decreases. An exhaust system for an engine includes: an exhaust passage component of ferrous metal; and a fastener that fastens the exhaust passage component to other parts, the exhaust passage component including a pressure receiving surface that receives a fastening force of the fastener. The oxide film of triiron tetraoxide is formed on the pressure receiving surface of the exhaust passage component. It is preferable that the oxide film of triiron tetraoxide be also formed on an outer surface other than the pressure receiving surface of the exhaust passage component. It is preferable that the oxide film of triiron tetraoxide be also formed on an inner surface of the exhaust passage component.

Exhaust system for engine

Provided is a method for producing an all-solid-state battery, which is capable of preventing the occurrence of a short circuit or a charge abnormality due to the formation of a dendrite even in cases where the pressing force is decreased. In the method for producing an all-solid-state battery, a solid electrolyte layer is arranged between a positive electrode layer and a negative electrode layer and current collectors are connected to the positive electrode layer and the negative electrode layer, respectively. This method for producing an all-solid-state battery is characterized by comprising: a step for forming at least one powder film for constituting the positive electrode layer, the negative electrode layer and/or the solid electrolyte layer, and a step for pressing a surface of the powder film by a pressing body consisting of an elastic body.

Method and apparatus for producing all-solid-state battery

A charge remaining in an electrostatic coater when power supply to the electrostatic coater is stopped is neutralized at an early stage. A rotary atomizing headreceives a high voltage of negative polarity from a cascade. An electrostatic coaterfurther includes a second high-voltage generatorthat generates a high voltage of positive polarity. The second high-voltage generatoris composed of a Cockcroft-Walton circuit. The Cockcroft-Walton circuit is composed of diodes and capacitors. A high voltage of the electrostatic coateris controlled by a controller. Immediately after running of the electrostatic coateris stopped by stopping power supply to the cascade, power is supplied to the second high-voltage generator. The high voltage of positive polarity generated by the second high-voltage generatoris supplied to the rotary atomizing headfor a predetermined time period.

Electrostatic coater and electrostatic coating method

A method for manufacturing an all-solid state secondary battery including a plurality of provisional battery bodies, the method including: forming each of the plurality of provisional battery bodies by pressing a positive-electrode mixture, a solid electrolyte, and a negative-electrode mixture that are stacked between a pair of electrode current collectors and pressure-molding the stacked provisional battery bodies with the electrode current collectors facing each other. The electrode current collectors facing each other have rough surfaces.

All-solid state secondary battery and method for manufacturing same

A management apparatus is connected to a mount substrate manufacturing line including a print apparatus, a component mounting apparatus, and a reflow apparatus, through a network. The management apparatus instructs at least one of apparatuses that are at a more upstream side than a reflow apparatus in a mount substrate manufacturing line to start production of the mount substrate, based on first data relating to the period of time necessary to complete preparation for the performing of a process by the reflow apparatus.

Management apparatus, mount substrate manufacturing system, and mount substrate manufacturing method

A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 &#x3bc;m with an average particle diameter (D) of 500 nm to 20 &#x3bc;m, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.

Metal-base printed circuit board

Provided is a semiconductor device capable of self-repairing cracks or peels occurring in sealing materials. A semiconductor module includes a member including a semiconductor element, an insulating substrate bonded onto one surface of the semiconductor element, and a printed circuit board for coupling with an external circuit connected to the other surface of the semiconductor element, which are sealed with a sealing material. In the semiconductor module, the sealing material includes a first thermosetting resin and a microcapsule particle containing a second thermosetting resin precursor.

Semiconductor device

A method evaluates the mobility of a polymer composition in a high-temperature region of 150&#xb0; C. or above. The method for evaluating a physical property of a polymer composition, the method comprising the steps of: obtaining a thin film sample which is formed on a substrate and which comprises: a fluorescent probe including a fluorescent rare earth complex having a melting point of 200&#xb0; C. or higher; and a target polymer composition; and obtaining a relationship between a temperature and a fluorescent characteristic of the thin film.

Method for evaluating physical properties of polymer compositions

A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder is instructed for each component terminal.

Component mounting method

A management apparatus is connected to a mount substrate manufacturing line including at least a print apparatus, a component mounting apparatus, and a reflow apparatus, through a network. The management apparatus instructs at least one of apparatuses that are at a more upstream side than the reflow apparatus in a mount substrate manufacturing line, to perform at least any one of an operation relating to maintenance, an operation relating to calibration, and an warm-up operation, based on first data relating to a period of time necessary to complete preparation for performing a process by the reflow apparatus.

Management apparatus, and mount substrate manufacturing method

A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder to be mounted on each electrode of the board is instructed.

An electrostatic screen printer includes: an electrically conductive screen arranged in non-contact with a printing medium; sponges for rubbing a powder into the screen; and a direct current power source for applying a voltage to the printing medium and the powder, wherein the powder rubbed into the screen is adhered to the printing medium by electrostatic induction. The electrostatic screen printer includes a rotation mechanism for rotating the sponges, a parent revolution mechanism for parent revolution of the sponges, and a child revolution mechanism for child revolution of the sponges. The revolution speed ratio of the child revolution to the parent revolution may preferably be 4.0 or greater, a scraper is provided on the parent revolution mechanism so as to be interlocked with the revolution of the sponges, and the scraper is arranged so as to scrape the powder on the screen toward an axis of the parent revolution because of the interlocking.

Electrostatic screen printer

Growing community of inventors

Kawasaki, Japan

Kenji Okamoto