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Koyo Machine Industries Company Limited

Kenji Ohkura

Tadahiro Kato

Shunichi Ikeda

A two-sided surface grinding apparatus capable of eliminating undulations of concentric circles produced in the work surfaces by grinding, thereby further improving the degree of flatness of the work surfaces after grinding includes a pair of support pads which hold work outwardly of grinding whetstones and noncontactly support the work by the pressure of fluid are formed with notches corresponding to the grinding whetstones and extending from the outer edge to the center, and their noncontact support surfaces are provided with a plurality of pockets having fluid supply holes, and a mesh section forming banks around the peripheries of these pockets, the mesh section being composed of a peripheral edge disposed along the outer periphery of the noncontact support surface, and inside veins disposed so as to divide the inside of the peripheral edges and connected to the inside-and-outside connecting sections. The portion of the peripheral edge which extends along the notch is not provided with any inside-and-outside connecting section in the region excluding at least the vicinity of a central position of the work.

Two-sided surface grinding apparatus

A double side grinding apparatus comprises a pair of grinding wheels ( ), work rotating device ( ) and moving device ( ). The apparatus operates to bring the grinding faces ( ) into contact with the respective work surfaces (a) to advance each grinding face to the position of a predetermined depth of cut by moving at least one of the grinding wheels ( ) while rotating the grinding wheels ( ) and rotating the work (W) by the device ( ) about an axis thereof as supported in a predetermined grinding position so that an outer periphery of the work (W) intersects outer peripheries of the grinding wheels ( ) with a center (c) of the work (W) positioned inwardly of the grinding faces ( ), stop each of the grinding wheels ( ) from advancing in the direction of depth of cut, move each of the grinding wheels ( ) and the work (W) by the moving device ( ) relative to each other in a direction parallel to the work surface (a) until the center (c) of the work (W) is positioned externally of the grinding faces ( ), and separate the grinding faces ( ) from the work surfaces (a). The surfaces of the work can be ground at the same time easily with diminished variations in the thickness of the work although the apparatus is small-sized.

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Yao, Japan

Kenji Ohkura