Hitachi Ulsi Systems Co., Ltd.

Renesas Technology Corp.

Renesas Electronics Corporation

Kenji Nishimoto

Takashi Akioka

Masao Shinozaki

Shinji Nakazato

Shusaku Miyata

Sanae Asari

Yutaka Kohara

Mitsuaki Katagiri

Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.

Semiconductor integrated circuit device

There is provided a multi-chip module which can vary functions of a memory chip at the time of loading or after loading, to the wiring board, the memory chip having formed an external connecting terminal with the wafer process. Two kinds of multi-chip modules having different functions such as word configuration and operation mode is realized using the identical memory chips by preparing for two kinds of module substrate of different patterns of wiring including the power supply voltage wiring and the ground potential wiring and then loading a memory chip and a control chip to these two kinds of module substrate.

Semiconductor device and a method of manufacturing the same

Growing community of inventors

Saitama, Japan

Kenji Nishimoto