Nec Corporation

Kenji Nanba

Akira Miyata

Katsumi Kikuchi

Takanori Nishi

Ayami Yamaguchi

Suguru Watanabe

Hideyuki Satou

A quantum device according to an example embodiment includes: a quantum chip with a first surface and a second surface located on a side opposite to the first surface, in the quantum chip, at least a part of a qubit circuit being provided on the second surface; a first interposer with a third surface and a fourth surface located on a side opposite to the third surface, the first interposer being connected to the quantum chip in such a manner that the second surface of the quantum chip is opposed to the third surface of the first interposer; and a second interposer with a fifth surface and a sixth surface located on a side opposite to the fifth surface, the second interposer being connected to the first interposer in such a manner that the fourth surface of the first interpose is opposed to the fifth surface of the second interposer.

Quantum device

A quantum device capable of securing terminals for external connection is provided. A quantum device according to an example embodiment includes a quantum chip, an interposeron which the quantum chipis mounted, and a socketdisposed so as to be opposed to the interposer, the socketcomprising a movable pinand a housingsupporting the movable pin, in which at least one end of the movable pin, which includes the one end and the other end opposite to the one end, is movable relative to the housing, the one end being in electrical contact with a terminal of the interposer, and the other end is in an electrical contact with a terminal of a boardon which a connectoris formed, the connectorbeing configured to serve as an external input/output.

A quantum device capable of improving a cooling effect while securing the number of terminals is provided. A quantum device according to an example embodiment includes a quantum chip, and an interposeron which the quantum chipis mounted, in which the interposerincludes a conductive wiring line CLelectrically connected to the quantum chip, and a metal filmdisposed in a part of the interposerthat is in contact with a sample stagehaving a cooling function, and a mounting surfaceof the interposeron which the quantum chipis mounted or an opposite surfaceopposite to the mounting surfaceincludes a first area ARand a second area ARdifferent from the first area ARas viewed in a direction perpendicular to the mounting surfaceor the opposite surface

Quantum device having quantum chip on interposer in contact with sample stage

A quantum device () includes: an interposer (); a quantum chip (); a first connection part () that is provided between the interposer () and the quantum chip () and electrically connects a wiring layer of the interposer () to a wiring layer of the quantum chip (); and a second connection part () that is provided on a main surface of the interposer () where the first connection part () is arranged and is connected to a cooling plate ().

Quantum device and method of manufacturing the same

A quantum device according to an example embodiment includes a quantum chip, and an interposeron which the quantum chipis mounted, in which the interposerincludes a conductive wiring line CLelectrically connected to the quantum chip, a mounting surfaceof the interposeron which the quantum chipis mounted or an opposite surfaceopposite to the mounting surfaceincludes a first area ARand a second area ARdifferent from the first area ARas viewed in a direction perpendicular to the mounting surfaceor the opposite surface, the conductive wiring line CLis disposed in the first area ARon the mounting surfaceor the opposite surface, and a movable memberis in contact with the second area ARof the interposer

A quantum device () includes an interposer (), a quantum chip () mounted on the interposer (), and a shield part () provided so as to surround a quantum circuit region of the interposer () and the quantum chip (). Accordingly, the quantum device () is able to prevent interference in the quantum circuit region due to exogenous noise.

Quantum device including shield part and method of manufacturing the same

A quantum device () includes: an interposer (); a quantum chip (); and a connection part () that is provided between the interposer () and the quantum chip () and electrically connects a wiring layer of the interposer () to a wiring layer of the quantum chip (), in which the connection part () includes: a plurality of pillars () arranged on a main surface of the interposer (); and a metal film () provided on a surface of the plurality of pillars () in such a way that it contacts the wiring layer of the quantum chip () and the thickness of the metal film at outer peripheral parts of the tip of each of the plurality of pillars () becomes larger than the thickness of the metal film at a center part of the tip of each of the plurality of pillars ().

[Problem] A semiconductor device which achieves a fine pitch, a high throughput and a high connection reliability, especially in flip-chip mounting is provided. A method for manufacturing the semiconductor device and a circuit device using the semiconductor device are also provided. [Means for solving the problem] The semiconductor device has: an electrode; an insulating part having an opening on the electrode; a protruding part formed on the electrode; a protecting part which is formed at the periphery of the protruding part and electrically isolates the protruding part; and a bonding part which is formed on the protecting part by being spaced apart from the protruding part. An upper surface of the protruding part, an upper surface of the protecting part, and an upper surface of the bonding part form the same plane.

Growing community of inventors

Tokyo, Japan

Kenji Nanba