Fuji Corporation

Fuji Machine Mfg. Co., Ltd.

Kenji Nakai

Yukinori Nakayama

Satoshi Yoshioka

Shinji Naito

Daisuke Yamanaka

Yuki Kamiya

Tetsuya Kako

A trace assistance device includes a memory section, an acquisition section, and an output section. The memory section stores a manipulation log and an operation log. When a predetermined trigger event occurs during the board work, the acquisition section acquires at least one target manipulation history related to the trigger event, a target operation history associated with the target manipulation history, a comparison manipulation history that is the same as or similar to the target manipulation history, and a comparison operation history associated with the comparison manipulation history from the manipulation log and the operation log stored in the memory device. The output section is configured to output an operation of the board production line recorded in the target operation history and an operation of the board production line recorded in the comparison operation history, which are acquired by the acquisition section, in a comparable manner.

Trace assistance device and trace assistance method

A substrate work system is provided which can reduce the time taken to deal with a communication error by notifying information on the communication error. First confirmation processing section of mounting device determines a cause for a communication error in a communication line between two devices in response to an occurrence of a communication error in first network. Display device displays a result of the confirmation by first confirmation processing section in addition to a message informing that a communication error occurs in first network. As a result, an operator of substrate work system can confirm in which communication path or the like the communication error is possibly occurring in first network by checking the content displayed on display device.

Substrate work system

A reading device including an identification information reading device which reads the identification information, a holding device which holds an identification information application member, a moving device which moves the holding device relative to the identification information reading device, and a control device which controls operations of the identification information reading device, the holding device, and the moving device. The control device causes the holding device to move using the moving device such that at least a portion of the holding region in which the holding device holds the identification information application member is a reading region to move the identification information application member and is configured to perform a first reading process which carries out a reading process of the identification information using the identification information in a state in which holding of the identification information application member using the holding device is released.

Reading device

A die mounting system in which die supply device is set on component mounter and dies supplied from die supply device are mounted on circuit board by mounting head of component mounter, determines the next die transfer position is determined such that the longer of time required for die transfer preparation operation (die imaging and image processing, die pickup operation, and movement and vertical inverting operation of a supply head) of die supply device and time required for die mounting operation (movement and vertical motion at the mounting position of mounting head) of component mounter is made shorter, and the difference (which corresponds to the waiting time at the die transfer position) between the two times decreased, such that the cycle time is shortened.

Die mounting system and die mounting method

In a die mounting system in which a die supply device is set on a component mounter and dies supplied from a die supply device are mounted on a circuit board by a mounting head of the component mounter, the position of a die is recognized by processing an image of the die on a dicing sheet captured by a camera, a supply head is moved to a die pickup position by a supply head moving mechanism, the die is picked up, the supply head is vertically inverted and moved to a die transfer position, and the die held by the supply head is picked up by a mounting head of the component mounter at a component transfer position and mounted on the circuit board. The die transfer position is set at a position such that die transfer and die imaging are able to be performed in parallel.

Growing community of inventors

Chiryu, Japan

Kenji Nakai