Ngk Spark Plug Company, Limited

Energy Storage Materials Llc.

Kenji Murakami

Motohiko Sato

Jun Otsuka

Manabu Sato

Kazuhiro Hayashi

Motonobu Kurahashi

Yusuke Kaieda

Masahiko Okuyama

Akifumi Tosa

Seiji Ichiyanagi

Tomohide Yamada

Hiroshi Yamamoto

Takaaki Tsurumi

Kozo Yamazaki

To provide a capacitor capable of having a larger capacity than a case where only a solid electrolyte is simply used as a dielectric material of the capacitor. The capacitor () includes a solid electrolytic body () and a plurality of electrodes () which is formed on the solid electrolytic body () and disposed opposite to each other with the solid electrolytic body () interposed therebetween, and the solid electrolytic body () includes an oxide-based lithium ion conductive solid electrolyte as a base material and contains oxide particles formed of a part of elements configuring the base material.

Capacitor

A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.

Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate

A method for manufacturing a ceramic capacitor embedded in a wiring substrate, the ceramic capacitor including a capacitor body which has a pair of capacitor main surfaces and a plurality of capacitor side surfaces also has a structure in which a plurality of internal electrodes are alternately layered through a ceramic dielectric layer, the method has (a) laminating ceramic-made green sheets and combining the green sheets into one, to form a multi-device-forming multilayer unit in which a plurality of product areas, each of which becomes the ceramic capacitor, are arranged in longitudinal and lateral directions along a plane direction, (b) forming a groove portion to form a chamfer portion at a boundary portion between at least one of the capacitor main surfaces and the plurality of capacitor side surfaces, (c) sintering the multi-device-forming multilayer unit, and (d) dividing the product areas into each product area along the groove portion.

Method for manufacturing ceramic capacitor

A ceramic capacitor includes a capacitor body and a metal layer arranged on an outer surface of the capacitor body. The outer surface includes: a first capacitor major surface; a second capacitor major surface opposite to the first capacitor major surface in a thickness direction of the capacitor body; and a capacitor lateral surface between the first and second capacitor major surfaces. The capacitor body includes a first layer section and a second layer section. The first layer section includes a plurality of ceramic dielectric layers and a plurality of internal electrodes, wherein the ceramic dielectric layers and the internal electrodes are layered alternately. The second layer section is exposed at the first capacitor major surface, and includes a corner portion at a boundary between the first capacitor major surface and the capacitor lateral surface. The metal layer covers the corner portion of the second layer section.

Ceramic capacitor and wiring board

A capacitor is provided having a tough surface portion which prevents cracking that tends to occur when the capacitor is built-in or surface-mounted on a wiring board. A ceramic sintered body of the capacitor includes a capacitor forming layer portion, a cover layer portion and an interlayer portion. The capacitor forming layer portion has a laminated structure wherein ceramic dielectric layers and inner electrodes connected to a peripheral portion of capacitor via conductors, are alternately laminated. The cover layer portion is exposed at a surface portion of the ceramic body and has a laminated structure wherein ceramic dielectric layers and dummy electrodes not connected to the capacitor via conductors, are alternately laminated.

Capacitor and wiring board including the capacitor

A capacitor comprising: a plurality of laminated dielectric layers; a plurality of inner electrode layers each disposed between mutually adjacent ones of the dielectric layers; and dummy electrode layers respectively disposed between the dielectric layers, disposed on sides closer to outer peripheral sides of the dielectric layers than to the inner electrode layers and disposed apart from the inner electrode layers.

Method of manufacturing capacitor for incorporation in wiring board, capacitor for incorporation in wiring board, and wiring board

A multi-layer capacitor including a capacitor body including dielectric layers, and first and second internal electrode layers which are alternately laminated by mediation of the dielectric layers. The laminate of the first and second internal electrode layers and the dielectric layers are co-fired. The capacitor body further includes first and second electrode terminals formed on one main surface of the capacitor body. At least a single first via electrode extends through the capacitor body in the lamination direction of the capacitor body so as to connect the first electrode terminal and the first internal electrode layers, and at least a single second via electrode extends through the capacitor body in the lamination direction of the capacitor body so as to connect the second electrode terminal and the second internal electrode layers. The via electrodes have an aspect ratio of 4 to 30 as measured after firing.

Growing community of inventors

Kani, Japan

Kenji Murakami