Oki Electric Industry Co., Ltd.

Kenji Mizuuchi

Hiroyasu Torazawa

Kazuo Hagimura

First and second MOS transistor elements, each having two source pads respectively arranged in the vicinity of two opposite corners and a gate pad arranged in the vicinity of a corner between these two corners, and a light receiving element arranged on a second terminal. In this way, wires respectively connecting gate pads of the first and second MOS transistor elements and the light receiving element are shortened. A source pad of the first MOS transistor element adjacent to the second terminal and the second terminal can be connected by a wire, so this wire can be shortened. A source pad of the second MOS transistor element adjacent to the second terminal and the second terminal can be connected by a wire, so this wire also can be shortened.

Semiconductor device

In order to prevent deterioration of adhesion between a molding resin and a lead frame and a light transmission characteristic due to the attachment of a translucent resin to an upper surface of the lead frame upon charging a photocoupler with the translucent resin, a concave portion is provided in an island of a lead frame to which the smallest semiconductor device is attached. The filling of the translucent resin between opposed semiconductor devices includes filling through the concave portion. The provision of the concave portion prevents the translucent resin from contacting the upper surface, resulting in a more stable configuration.

Method of manufacturing photosensitive semiconductor device

An object of the present invention is to prevent deterioration of adhesion between a molding resin and lead frame and a light transmission characteristic due to the attachment of a translucent resin to an upper surface of the lead frame upon charging a photocoupler with the translucent resin. A concave portion is defined in an island of a lead frame to which a photosensitive semiconductor device is fixed.

Photosensitive semiconductor device

The present invention relates to a light-activated semiconductor device comprising light-emitting elements for emitting light respectively, light-receiving elements for producing driving voltages in response to the light respectively and output elements activated in response to the driving voltages respectively. The light-receiving elements are disposed on two planes opposed to each other. The output elements are disposed on their corresponding planes in opposing relationship.

Growing community of inventors

Tokyo, Japan

Kenji Mizuuchi