Mitsubishi Electric Corporation

Mitsubishi Denki Kabushiki Kaisha

Fujitsu Corporation

Almex Inc.

Kenji Mimura

Takashi Nishimura

Hiromi Ito

Kei Yamamoto

Seiki Hiramatsu

Motoki Masaki

Hiroyuki Hama

Hirofumi Fujioka

Hiroki Shiota

Kazuhiro Tada

Atsuko Fujino

Xiaohong Yin

Hideki Takigawa

Yurie Nakamura

Hiroshi Yoshida

Hiroshi Aoki

Hiroyuki Nishimura

Motohiro Sato

Nobutake Taniguchi

Yukio Ozaki

Shuichi Hiza

Kazuharu Kato

Mariko Takahara

Eishiro Kawana

Hitoshi Usuda

Takashi Kawana

Fumihiko Hosokoshi

Etsuro Tomonaga

An insulating molded body to be used for an arc extinguishing device of a gas circuit breaker is provided. The insulating molded body includes a fluororesin mixture which contains a fluororesin and an oxygen generator configured to generate oxygen through thermal decomposition at 450&#xb0; C. or more and 1,150&#xb0; C. or less with an arc generated when a conduction current is interrupted. The oxygen generator is dispersed in the fluororesin. Also provided is a gas circuit breaker including an insulating nozzle formed of the insulating molded body.

Insulating molded body and gas circuit breaker

A thermosetting resin composition containing a thermosetting resin and an inorganic filler, in which the inorganic filler contains secondary sintered particles (A) formed of primary particles of boron nitride, which have an aspect ratio of 10 to 20, and secondary sintered particles (B) formed of the primary particles of boron nitride, which have an aspect ratio of 2 to 9. The thermosetting resin composition can produce a thermal conductive sheet that has excellent filling property of the inorganic filler, and excellent thermal conductivity, adhesiveness and electrical insulating properties.

Thermosetting resin composition, method of producing thermal conductive sheet, and power module

A method for manufacturing, by a transfer mold method, a power module equipped with a heat conductive insulating sheet in which an inorganic filler including secondary aggregated particles formed by aggregation of primary particles of scaly boron nitride is dispersed in a thermosetting resin, where curing of an uncured or semi-cured heat conductive insulating sheet during transfer molding is advanced under specific conditions. The method for manufacturing a power module equipped with a heat conductive insulating sheet has excellent thermal conductivity and electric insulation ability.

Heat conductive insulating sheet, power module, and manufacturing method thereof

Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 &#x3bc;m to 80 &#x3bc;m. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.

Thermosetting resin composition, B-stage heat conductive sheet, and power module

Provided is a semiconductor device including: a base plate; a thermally conductive resin layer formed on an upper surface of the base plate; an integrated layer which is formed on an upper surface of the thermally conductive resin layer, and includes an electrode and an insulating resin layer covering all side surfaces of the electrode; and a semiconductor element formed on an upper surface of the electrode, in which the integrated layer is thermocompression bonded to the base plate through the thermally conductive resin layer. This semiconductor device excels in insulating properties and reliability.

Semiconductor device and process for producing same

Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 &#x3bc;m or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 &#x3bc;m or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.

Heat conductive sheet and method for producing same, and powder module

There is provided an epoxy resin composition, which has superior resistant property to SF gas, mechanical strength and cracking resistance in a well balanced manner and which can provide an insulating molded article having a low dielectric constant. The epoxy resin composition for an SF -gas insulating device of the present invention is obtained by adding a silicate compound powder to an epoxy resin.

Epoxy resin composition for SF6 gas insulating device and SF6 gas insulating device

A method of applying a coating material to two surfaces of a plate includes the steps of applying the coating material to the two surfaces simultaneously such that holding areas in the absence of the coating material are provided on the two surfaces in proximity of side ends of the plate with respect to a travel direction of the plate, and conveying the plate by holding the holding areas.

Method of applying a coating material to a plate with conveying rollers

The present invention provides an insulating spacer for a high-voltage conductor constructed with a plastic made of an epoxy resin composition so that the volumetric specific resistance of the shield electrode increases toward the median point between a container and the conductor and a method for manufacturing shield electrode used therein. The insulating spacer according to the present invention can lessen the concentration of electric fields in the boundary areas between the shield electrode and the insulating member with the result that reliability is improved and service life is lengthened.

Insulating spacer with shield electrodes having a graded resistance

Growing community of inventors

Tokyo, Japan

Kenji Mimura