Tokyo Electron Limited

3M Innovative Properties Company

Citizen Watch Company, Ltd.

Japan Aviation Electronics Industry, Limited

Tohoku University

Konica Corporation

Honda Giken Kogyo Kabushiki Kaisha

Bridgestone Corporation

Hoya Corporation

Taiyo Yuden Co., Ltd.

Citizen Electronics Co., Ltd.

Other

Nec Corporation

Dainippon Screen Mfg. Co., Ltd.

Kyoto University

Kenji Matsumoto

Hitoshi Itoh

Hiroshi Sato

Ayano Tanabe

Junichi Koike

Nobuyuki Hashimoto

Masafumi Yokoyama

Hiroyuki Nagai

Shinichi Irie

Makoto Kurihara

Koji Neishi

Peng Chang

Hiroshi Shinriki

Takakazu Yano

Hidenori Miyoshi

Kengo Imamura

Kenton D Budd

Junji Miyashita

Toshihiro Kasai

Akitoshi Sakaue

Chikafumi Yokoyama

James A Laird

Stephen L Lieder

Shigetoshi Hosaka

Tadahiro Fukuda

Hirohiko Ono

Toshinori Naruse

Tadahiro Ishizaka

Kazuya Sato

Takashi Sakuma

Osamu Yokoyama

Tetsuo Shimura

Hirohisa Saito

Yousuke Nakada

Atsushi Udagawa

Tomohiro Ando

Tatsufumi Hamada

Hiroyuki Yamazaki

Shigeru Morokawa

Masashi Saito

Toru Tatsumi

Shigeru Tahara

Masafumi Okada

Hideo Shimizu

Kazuhiro Hirota

Yoichi Yamaguchi

Kaoru Maekawa

Yuta Hasegawa

Yasushi Mizusawa

Yoichi Hachitani

Hideaki Mitsui

Hisao Hosoya

Hiroto Ito

Takeshi Sakuma

Junichi Fujita

Naoki Otomo

Yasuaki Kayanuma

Tatsutoshi Nakahata

Yutaka Takezawa

Osamu Saito

Shigeru Futakami

Tetsuya Yamamoto

Tsunehisa Hata

Takeo Komiyama

Hideaki Morita

Atsushi Ogane

Gouji Sakaoka

Yutaka Ohtani

Toshio Takagi

Ryo Takimura

Hirohiko Yamazaki

Kazuo Suzuki

Takeyoshi Iguchi

Hirohisa Tanaka

Takao Tsuda

Takuya Miyashita

Yoichi Endo

Tsuyoshi Takiguchi

Hideharu Takemoto

Hiroyuki Uematsu

Takashi Sekimoto

Masayuki Nasu

Takanori Tsuji

Joji Akizuki

Miharu Sugiura

Keiji Hosoda

Masahiko Yamazaki

Yukio Nojiri

Hiroaki Kawasaki

Daisuke Urayama

Tomoyuki Sakoda

Masayuki Muraoka

Kohichiro Tsuji

Feng Ma

Go Ichien

Akio Segawa

Eiji Agatsuma

Yuka Saito

Yuji Kato

Tsutomu Ohgushi

The disclosure provides a pharmaceutical composition containing an anti-IgE antibody that suppresses the production of allergen-specific IgE antibodies and methods of use thereof.

Method for primary prevention of allergic disorders during infancy through IgE-class-specific immunosuppression

Provided is a wiring board including a fine-wire pattern made of cured conductive ink formed on a board surface, wherein assuming that two orthogonal directions on the board surface are directions X and Y, a line width of another fine wire that is included in the fine-wire pattern, passes through another point on the board surface not aligned in the direction X but aligned in the direction Y with one intersection where three or more fine wires included in the fine-wire pattern are centered at one spot, and does not form another intersection where three or more fine wires are centered at one spot at said another point is 1.5 times or more a minimum line width of the fine wires included in the fine-wire pattern.

Wiring board production method and wiring board

A plasma processing system includes processing modules, a transfer device connected to the processing modules, and a control unit for controlling an oxygen partial pressure and a water vapor partial pressure in the transfer device. The control unit controls the oxygen partial pressure and the water vapor partial pressure in the transfer device to 127 Pa or less and 24.1 Pa or less, respectively. The processing modules include a first processing module for performing etching on the target object, a second processing module for performing surface treatment on the target object, and a third processing module for performing a deposition process on the target object. The second processing module performs the surface treatment using hydrogen radicals generated by a high frequency antenna. The high frequency antenna resonates at one half of a wavelength of a signal supplied from a high frequency power supply used in the processing system.

Processing system and processing method

A substrate processing apparatus includes a first mounting unit, a second mounting unit and an adjusting unit. The first mounting unit is configured to mount thereon a target substrate to be processed that is a plasma processing target. The second mounting unit is disposed to surround the first mounting unit to mount thereon a focus ring. The adjusting unit is configured to adjust a height of a peripheral portion of the target substrate with respect to a height of a central portion of the target substrate in response to consumption of the focus ring.

Substrate processing apparatus and substrate processing control method

A method MT in an embodiment is a method for etching an etching target layer EL which is included in a wafer W and contains copper. The wafer W includes the etching target layer EL, and a mask MK provided on the etching target layer EL. In the method MT, the etching target layer EL is etched by repeatedly executing a sequence SQ including a first step of generating a plasma of a first gas in a processing containerof a plasma processing apparatusin which the wafer W is accommodated, a second step of generating a plasma of a second gas in the processing container, and a third step of generating a plasma of a third gas in the processing container. The first gas contains a hydrocarbon gas, the second gas contains either a rare gas or a mixed gas of a rare gas and hydrogen gas, and the third gas contains hydrogen gas.

Method for etching copper layer

A method for manufacturing a touch panel having a sensing area that includes a conductive part made up of thin-line mesh includes a step of designing the thin-line mesh, the thin-line mesh including a plurality of intersections, wherein the intersection forms therearound an acute angular area and an obtuse angular area, the acute angular area being defined between a pair of adjacently converging thin lines that forms an acute angle therebetween, the obtuse angular area being defined between a pair of adjacently converging thin lines that forms an obtuse angle therebetween, a step of filling electrically conductive ink into a printing plate by a squeezing process using a doctor blade, the printing plate having a groove pattern that conforms with the thin-line mesh, and a step of forming the conductive part by printing, in which the electrically conductive ink is transferred to a surface of a base member.

Method for manufacturing touch panel

In a touch panel having a structure in which a first layer in which a first sensor electrode in the form of a mesh of fine lines is formed and a second layer in which a second sensor electrode in the form a mesh of fine lines is formed are overlaid on one another with a transparent insulator between them, a first dummy wiring that constitutes a first mesh pattern with the first sensor electrode is formed in the first layer and a second dummy wiring that constitutes a second mesh pattern with the second sensor electrode is formed in the second layer. The first mesh pattern and the second mesh pattern are identical to each other in a pair of tiling periodicity directions and translational periods corresponding thereto.

Touch panel

In an embodiment, an electronic component fuseincludes: (1) an insulator sleevehaving a hollow partthat opens to the exterior at both ends; (2) a conductor elementhaving a fusible partwhose cross-section is smaller than the cross-section of the hollow part, a first engagement partprovided at one end of the fusible part, and a second engagement partprovided at the other end of the fusible part, where the fusible partis positioned in the hollow part, the first engagement partand the second engagement partare disposed on the respective ends of the insulator sleeve; (3) a first terminalhaving a first connection partconnected to the first engagement part; and (4) a second terminalhaving a second connection partconnected to the second engagement part

Electronic component fuse and fused electronic component module

A method of forming, on a substrate having on a surface thereof a film having a trench of a preset pattern and a via at a bottom of the trench, a Cu wiring by burying Cu or Cu alloy in the trench and the via includes forming a barrier film (process); forming, on a surface of the barrier film, a wetting target layer of Ru or the like (process); forming, on a surface of the wetting target layer, a Cu-based seed film by PVD (process); filling the via by heating the substrate and flowing the Cu-based seed film into the via (process); and forming, on the substrate surface, a Cu-based film made of the Cu or Cu alloy by PVD under a condition where the Cu-based film is flown on the wetting target layer to bury the Cu-based film in the trench (process).

Cu wiring forming method and semiconductor device manufacturing method

In a Cu wiring manufacturing method, a MnOfilm which becomes a self-formed barrier film by reaction with an interlayer insulating film of a substrate is formed on a surface of a recess formed in the interlayer insulating film by ALD. A hydrogen radical process is performed on a surface of the MnOfilm to reduce the surface of the MnOfilm. A Ru film is formed by CVD on the surface of the MnOfilm which has been reduced by the hydrogen radical process. A Cu-based film is formed on the Ru film by PVD to be filled in the recess. When the Ru film is formed, a film-formation condition of the MnOfilm and a condition of the hydrogen radical process are set such that nucleus formation is facilitated and the Ru film is formed in a state where a surface smoothness is high.

Method of manufacturing Cu wiring

A lens member includes a light-incident side; a light-exit side that is opposite to the light-incident side, a Fresnel lens arranged on a center axis that passes through a center of the light-incident side, and a diffraction grating structure arranged around a periphery of the Fresnel lens and having a center through which the center axis passes. Also, it is disclosed that the Fresnel lens may include a first Fresnel lens and a second Fresnel lens, the first Fresnel lens includes annular prisms that are divided from a convex lens and having a center through which the center axis of the light-incident side passes, and the second Fresnel lens includes annular prisms that are divided from a TIR lens and arranged around the periphery of the first Fresnel lens, centering around the center axis of the light-incident side.

Lens member and light-emitting device using same

An object of the present invention is to provide electronic eyeglass and liquid crystal lens production methods that eliminate the need for forming a liquid crystal injection path in the liquid crystal lens, while making provisions so as to be able to sufficiently maintain a prescribed gap between substrates. The electronic eyeglass and liquid crystal lens production methods includes the steps of placing a sealing agent so as to form a closed planar region on at least one of first and second transparent substrates, dropping a liquid crystal material into an inside space enclosed by the sealing agent, bonding the other of the transparent substrates onto the one transparent substrate on which the liquid crystal material has been dripped, and filling a resin into a space created outside the sealing agent.

Electronic eyeglass and liquid crystal lens production methods

An electric circuit device connecting first and second external elements, the electric circuit device including: a first electronic component; a first bus bar electrically connected to the first electronic component; a second bus bar electrically connected to the electronic component and overlapped with the first bus bar in a direction perpendicular to main surfaces of the first and second bus bars; a first external terminal electrically connecting the first bus bar to the first external element; a second external terminal electrically connecting the second bus bar to the second external element; a first region in the first external terminal electrically coupled to the first external element; and a second region in the second external terminal electrically coupled to the second external element, and at least partially overlapped with the first region in the direction.

Electric circuit device

In a Cu wiring manufacturing method for manufacturing Cu wiring that fills a recess formed in a predetermined pattern on a surface of an interlayer insulating film of a substrate, a MnOfilm that becomes a self-formed barrier film by reaction with the interlayer insulating film is formed at least on a surface of the recess by ALD. A CuOfilm that becomes a liner film is formed on a surface of the MnOfilm by CVD or ALD. An annealing process is performed on the substrate on which the CuOfilm is formed and the CuOfilm is reduced to a Cu film by oxidation-reduction reaction between the MnOfilm and the CuOfilm. A Cu-based film is formed on the Cu film obtained by reducing the CuOfilm by PVD to fill the Cu-based film in the recess.

Cu wiring manufacturing method and Cu wiring manufacturing system

A touch panel includes first sensor electrode arrays in which first island-shaped electrode portions are arrayed along a first direction and connected through connecting portions, second sensor electrode arrays in which second island-shaped electrode portions are arrayed at intervals along a second direction, jumper wiring portions being superimposed through insulating portions and connecting the second island-shaped electrode portions arranged adjacent to each other along the second direction, and a lead-out wiring portion connected to the first and second sensor electrode arrays, the first and second sensor electrode arrays being formed of a first transparent conductor layer having a first thickness, the jumper wiring portions being formed of a second transparent conductor layer having a second thickness, the lead-out wiring portion being formed of a third transparent conductor layer having a third thickness that is larger than the first thickness.

Touch panel and production method thereof

Growing community of inventors

Tokyo, Japan

Kenji Matsumoto