Murata Manufacturing Co., Ltd.

Kenji Matsuda

Yuko Fujita

Hironobu Takahashi

Fumiya Isono

Takuya Hashimoto

Yuki Nakaike

A multilayer body includes insulator layers including a first insulator layer laminated in a vertical direction. Electrodes include a signal electrode and are provided at an upper main surface of the first insulator layer and arranged in a transverse direction. At least a portion of each of the electrodes is exposed to outside from a circuit board. First and second interlayer connection conductors extend through the first insulator layer in the vertical direction and electrically connect the signal electrode and a signal conductor layer. Mounting portions are located at the portions of the electrodes that are exposed to the outside from the circuit board. The first and second interlayer connection conductors are electrically connected to the signal electrode so as not to overlap the mounting portion that is provided at the signal electrode.

Circuit board and electronic-component-equipped circuit board

In a first region, a multilayer body is bent along a first bending line such that a first main surface is located farther on an outer peripheral side than a second main surface. In a second region, the multilayer body is bent along a second bending line such that the first main surface is located farther on an inner peripheral side than the second main surface. In the first region, a first metal foil layer is located farther on an outer peripheral side than a center of the multilayer body. In the second region, a second metal foil layer is located farther on the outer peripheral side than the center of the multilayer body. In the second region, a distance between the second metal foil layer and the second main surface is shorter than a distance between the second metal foil layer and the first main surface.

Multilayer substrate and electronic device

A transmission line includes a substrate including insulator layers, a mounting electrode on a front layer of the substrate, a signal conductor, a first ground conductor, a first connecting electrode that electrically connects the mounting electrode and the signal conductor and is between the signal conductor and the first ground conductor in a laminating direction, a first inter-layer connecting conductor that is electrically connected between the mounting electrode and the first connecting electrode and is bonded to the first connecting electrode, and a second inter-layer connecting conductor that is electrically connected between the signal conductor and the first connecting electrode, is bonded to the first connecting electrode, and does not overlap with the first inter-layer connecting conductor when viewed in the laminating direction. The first ground conductor does not overlap with at least a portion of the first connecting electrode when viewed in the laminating direction.

Transmission line

An atomic oscillator includes a light source, a gas cell including an internal space in which an alkali metal atom is sealed, and a photodetector to detect light emitted from the light source and passing through the gas cell. A radiation region of the light source is wider than a sectional area of the internal space at a distal end of the gas cell relative to the light source.

Atomic oscillator and electronic device

An atomic oscillator including a light source, a gas cell including an internal space in which alkali metal atoms are encapsulated, and a light detector that detects light which has emitted from the light source and has passed through the gas cell. The alkali metal atoms encapsulated in the internal space are adhered, in a liquid state or a solid state, to at least an incident window, such that light incident on the incident window is reduced.

Atomic oscillator and electronic apparatus

In a non-reciprocal circuit element, electric power handling capability is improved, and leakage power between adjacent channels is reduced. In addition, balance is taken between reduction of noise between adjacent ports and an increase in insertion loss. A non-reciprocal circuit element includes a YIG ferrite () and a plurality of conductors () disposed on the YIG ferrite () and intersecting each other in an insulated state. A part of Y of the YIG ferrite () is substituted with at least any one element of Ho, Dy, and Gd, or a part of Fe of the YIG ferrite () is substituted with Co.

Growing community of inventors

Nagaokakyo, Japan

Kenji Matsuda