Nec Corporation

Dexerials Corporation

Kenji Kubota

Takayuki Saito

A method for manufacturing a semiconductor device and an underfill film which can achieve voidless mounting and excellent solder bonding properties even in the case of collectively bonding a plurality of semiconductor chips are provided. The method includes a mounting step of mounting a plurality of semiconductor chips having a solder-tipped electrode onto an electronic component having a counter electrode opposing the solder-tipped electrode via an underfill film; and a compression bonding step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film. The underfill film contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide and has a minimum melt viscosity of 1,000 to 2,000 Pa*s and a melt viscosity gradient of 900 to 3,100 Pa*s/&#xb0; C. from a temperature 10&#xb0; C. higher than a minimum melt viscosity attainment temperature to a temperature 10&#xb0; C. higher than the temperature.

Semiconductor device manufacturing method and underfill film

A magnetic tape device comprises a plurality of magnetic heads for recording or reproducing data to a magnetic tape including a data recording area, a tape running mechanism for making the magnetic tape run on the magnetic heads, and a controller for controlling a recording and reproducing operation of the magnetic heads for the magnetic tape while running. The controller includes a recording controller to control the recording and reproducing operation of the magnetic heads so as to record recording target data including a redundancy without recording the recording data and data which is the same as at least a part of the recording target data as redundant data, these data not being recorded in data recording areas adjacent with each other.

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Tokyo, Japan

Kenji Kubota