Murata Manufacturing Co., Ltd.

Kenji Kubota

Norio Sakai

Shoichi Kawabata

Hiroaki Kaida

Satoshi Ishino

Jiro Inoue

Michinobu Maesaka

Mamoru Ogawa

Tsuyoshi Saito

Noboru Kato

Yoshihito Otsubo

Mitsuyoshi Nishide

Yuki Ito

Keisuke Araki

Masaaki Mizushiro

Makoto Osamura

Nobuyuki Suzuki

A resin substrate combined structure includes a first resin substrate including a flexible resin defining a main material and includes a first portion, a second resin substrate including a flexible resin defining a main material and includes a second portion spaced from the first portion in a thickness direction, and an insulating member that envelops the first portion and the second portion while retaining a relative positional relationship between the first portion and the second portion. The insulating member includes a material with a higher rigidity than any of the main material of the first resin substrate and that of the second resin substrate.

Resin substrate combined structure

A radio frequency IC device that prevents variations in the value of capacitive coupling between a radio frequency IC element and a radiation electrode and has good signal transmission efficiency includes a radio frequency IC element including input/output electrodes and, a first base including intermediate electrodes that are capacitively coupled to the input/output electrodes and have capacitance values Cand C, respectively, and a second base including radiation electrodes and that are capacitively coupled to the intermediate electrodes and have capacitance values Cand C, respectively. A capacitance Cobtained by combining Cand Cis smaller than a capacitance Cobtained by combining Cand C

Radio frequency IC device and method of manufacturing the same

A method of forming an electronic component includes laminating ceramic green sheets on a support film to obtain a ceramic green sheet laminate, forming through holes through the ceramic green sheet laminate at positions where via hole electrodes are to be located, applying conductive material into the through holes so as to fill the through holes and so as to be located on the upper surface of the ceramic green sheet laminate to form via hole electrodes, and sintering the ceramic green sheet laminate to form a substrate and so as to form protruding portions of the via hole electrodes which protrude upward from the upper surface of the substrate.

Method of forming an electronic component located on a surface of a package member with a space therebetween

A laminated ceramic electronic component includes an embedded portion formed in the periphery of an external terminal electrode so as to extend and be embedded in a component main member defined by ceramic layers, whereby affects of a small edge angle are eliminated.

Laminated ceramic electronic component and method of producing the same

An electronic component includes a package member; a via hole electrode extending through the package member and protruding from a first surface of the package member; an electronic component located on the first surface of the package member with a space located between the package member and the electronic component. The space between the electronic component and the first surface of the package member is provided by a protruding portion of the via hole electrode which extends from the surface of the package member and a joining member joining the electronic component with the via hole electrode.

Apparatus having an electronic component located on a surface of a package member with a space therebetween

In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

Method of manufacturing a multilayer electronic component

A multilayer electronic component having reduced arrangement pitches for external electrodes is formed by providing via holes in a mother laminate with conductive materials. The mother laminate is obtained by stacking a plurality of insulating sheets with interposition of conductor films in positions that are parted by cutting. The conductive materials define external electrodes for individual multilayer electronic components which are obtained by cutting the mother laminate. A specific step for forming the external electrodes is not required, and characteristics of each multilayer electronic component can be efficiently measured while each multilayer electronic component is still part of the mother laminate.

Multilayer electronic component

A method of manufacturing a multilayer electronic component having one major surface which can be completely used as a mounting surface for another electronic component to form a composite component includes the steps of forming a groove in the mother laminate along a cutting line, forming external electrodes on side surfaces of the groove and then dividing the mother laminate along the cutting line to divide the groove thereby forming a plurality of multilayer electronic components that are independent of each other. The method of forming the electronic components allows for measuring electrical characteristics of the individual multilayer electronic components while the components are still part of the mother laminate.

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Kyoto, Japan

Kenji Kubota