Mitsubishi Materials Corporation

Mistubishi Materials Corporation

Kenji Kubota

Yoshie Tarutani

Kiyotaka Nakaya

Takashi Tamagawa

Naoki Kato

Isao Arai

Yuki Taninouchi

Kazunari Maki

Shinichi Funaki

Toyo Ohashi

Naoki Katou

Naoki Miyashima

Tooru Nishimura

Marina Sakamaki

Hiroaki Nakayama

Kenzi Okada

Jyunichi Kumagai

A bonded body has a structure in which an insulating resin member made of an insulating resin and a metal part made of a metal are bonded. In the bonded body, a bonded interface between the insulating resin member and the metal part has an uneven shape including a protrusion in which the metal part protrudes toward an insulating resin member side and a recess in which the metal part retracts from the insulating resin member side, at least one of a kurtosis Rku of contour curve at the bonded interface of the metal part and a kurtosis Sku of contour surface at the bonded interface of the metal part is in a range of 2.75 or more and 6.00 or less, and an overhang rate that indicates a length ratio of regions overlapping in a lamination direction in a direction along the bonded interface is 7% or more.

Bonded body and insulating circuit board

Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 μm to 20 μm inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.

Terminal material for connectors

A copper alloy plate including 0.3 mass % or more and 1.2 mass % or less of Mg, 0.001 mass % or more and 0.2 mass % or less of P, and the balance Cu with inevitable impurities in a thickness center portion in a plate thickness direction; Mg concentration on a plate surface is 30% or less of bulk Mg concentration at the thickness center portion; a surface layer part having a depth from the plate surface to where it is 90% of the bulk Mg concentration is provided; and in the surface layer part, the Mg concentration increases from the plate surface toward the thickness center portion with a concentration gradient 1.8 mass %/&#x3bc;m or more and 50 mass %/&#x3bc;m or less.

Copper alloy plate, plating film-attached copper alloy plate, and methods respectively for manufacturing these products

A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silver and formed on the silver-nickel alloy plating layer; the silver-nickel alloy plating layer has a film thickness 0.05 &#xb5;m or more and less than 0.50 &#xb5;m and a nickel content 0.03 at% or more and 1.00 at% or less.

Terminal material for connector

In a method for producing high-purity electrolytic copper, a first additive (A) containing an aromatic ring of a hydrophobic group and a polyoxyalkylene group of a hydrophilic group, a second additive (B) formed of polyvinyl alcohols, and a third additive (C) formed of tetrazoles are added to a copper electrolyte, copper electrolysis is performed by controlling each concentration of the first additive (A), the second additive (B), and the third additive (C), a current density and a bath temperature, and accordingly, electrolytic copper in which a concentration of Ag is less than 0.2 mass ppm, a concentration of S is less than 0.07 mass ppm, a concentration of all impurities is less than 0.2 mass ppm, and an area ratio of crystal grains having an average crystal grain misorientation (referred to as a GOS value) exceeding 2.5&#xb0; is 10% or less is obtained.

Method for producing high-purity electrolytic copper

An anti-corrosion terminal material including a base material made of copper or copper alloy and a coating film laminated on the base material: the coating film includes: a first coating film, provided with a zinc layer made of zinc alloy and a tin layer made of tin or tin alloy which are laminated in this order, and formed at a planned core contact part; and a second coating film including the tin layer but not comprising the zinc layer, which is provided at a planned contact part being a contact part when the terminal is formed: and the zinc layer has a thickness not less than 0.1 &#x3bc;m and not more than 5.0 &#x3bc;m and zinc concentration not less than 30% by mass and not more than 95% by mass, and has any one or more of nickel, iron, manganese, molybdenum, cobalt, cadmium, lead and tin as a balance.

Anti-corrosion terminal material, anti-corrosion terminal and electric wire end structure

In a terminal material with a silver coating film including a silver layer on a surface, a terminal and a terminal material having high reliability are easily manufactured with low cost without a heat treatment. A base material formed of copper or a copper alloy; and nickel layer, an intermediate layer, and a silver layer laminated on the base material in this order are included, the nickel layer has a thickness of 0.05 &#x3bc;m to 5.00 &#x3bc;m and is formed of nickel or a nickel alloy, the intermediate layer has a thickness of 0.02 &#x3bc;m to 1.00 &#x3bc;m and is an alloy layer containing silver (Ag) and a substance X, and the substance X includes one or more kinds of tin, bismuth, gallium, indium, and germanium.

Terminal material with silver coating film and terminal with silver coating film

The present invention provides a high-purity electrolytic copperhaving a Cu purity excluding gas components (O, F, S, C, and Cl) is 99.9999 mass % or more, a content of S is 0.1 mass ppm or less, and an area ratio of crystals having a (101)&#xb1;10&#xb0; orientation is less than 40%, when crystal orientation is measured by electron backscatter diffraction in a cross section along a thickness direction.

High-purity electrolytic copper

Provided is a tin-plated copper terminal material, a terminal formed from the terminal material, and an electric-wire terminal structure using the terminal: the terminal material has a substrate of copper or a copper alloy; an intermediate zinc layer of a zinc alloy that is formed on the substrate and has a thickness of 0.10 &#x3bc;m to 5.00 &#x3bc;m; and a tin layer of tin or a tin alloy that is formed on the intermediate zinc layer and in which the length proportion occupied by low-angle grain boundaries is 2% to 30% with respect to the total length of all crystal grain boundaries; wherein galvanic corrosion is effectively suppressed.

Tin-plated copper terminal material, terminal, and electric-wire terminal structure

A terminal material for a connector terminal, using a copper or copper alloy substrate is crimped to an end of wire formed from an aluminum wire material; and a terminal using this terminal material: a zinc layerthat is formed of zinc or a zinc alloy and a tin layerthat is formed of tin or a tin alloy are sequentially laminated in this order on a substratethat is formed of copper or a copper alloy: with respect to the zinc layer and the tin layer, the adhesion amount of tin contained in the whole layers is from 0.5 mg/cmto 7.0 mg/cm(inclusive) and the adhesion amount of zinc contained in the whole layers is from 0.07 mg/cmto 2.0 mg/cm(inclusive), and the content percentage of zinc in the vicinity of the surface is from 0.2% by mass to 10.0% by mass (inclusive).

Terminal material for connectors, terminal, and electric wire termination structure

On a base member made of copper or a copper alloy, a zinc-nickel alloy layer including zinc and nickel, and a tin layer made of tin alloy are laminated in this order: the zinc-nickel alloy layer has a thickness of 0.1-5 &#x3bc;m inclusive and has a nickel content of 5-50 mass % inclusive, the tin layer has a zinc concentration of 0.6-15 mass % inclusive, and, under an oxide layer which is the outermost layer, a metal zinc layer, having a zinc concentration of 5-40 at % inclusive and a thickness of 1-10 nm inclusive in SiOconversion, is formed on the tin layer.

Tin-plated copper terminal material, terminal, and wire terminal part structure

A corrosion-resistant terminal material has a substrate made of copper or a copper alloy and a film layered on the substrate. The film has a planned core wire contact part with which a core wire of an electric wire is in contact when the material is formed to a terminal and a planned contact part. The film formed in the planned core wire contact part has a tin layer made of tin or tin alloy and a metallic zinc layer formed on the tin layer; the film formed in the planned contact part has a tin layer made of tin or tin alloy but does not have a metallic zinc layer. A corrosion-resistant terminal uses the corrosion-resistant terminal material described herein.

Corrosion-resistant terminal material, corrosion-resistant terminal, and wire-end structure

Providing a tin-plated terminal material with high corrosion-prevention effect and low contact resistance, a terminal formed from the terminal material, and an electric wire terminal-end structure. Provided are a base material made of copper or copper alloy, a zinc layer made of zinc or zinc alloy formed on the base material, and a tin layer made of tin or tin alloy formed on the zinc layer: in a whole of the zinc layer and the tin layer, a tin amount per unit area is 0.30 mg/cmto 7.00 mg/cminclusive, a zinc amount per unit area is 0.07 mg/cmto 2.00 mg/cminclusive, a content percentage of zinc in a vicinity of a surface in the tin layer is 0.2% to 10% by mass inclusive, and a length proportion of low-angle grain boundaries occupied in a total length of crystal boundaries in the tin layer is 2% to 30% inclusive.

Tin-plated copper terminal material, terminal and electric wire terminal-end structure

A terminal material in which galvanic corrosion is not occurred using a copper or copper alloy base material as a terminal crimped to an end part of an electrical wire formed from an aluminum wire material: an intermediate zinc layerformed from zinc or zinc alloy and a tin layerformed from tin or tin alloy are layered in this order on a base materialformed from copper or copper alloy; the intermediate zinc layerhas a thickness of 0.1 &#x3bc;m to 5.0 &#x3bc;m inclusive and a zinc concentration equal to or more than 5 mass %; and the tin layerhas a zinc concentration of 0.4 mass % to 15 mass % inclusive and a grain size of the tin layeris 0.1 &#x3bc;m to 3.0 &#x3bc;m inclusive preferably.

Tinned copper terminal material, terminal, and electrical wire end part structure

The present invention provides an additive for high-purity copper electrolytic refining and a method of producing high-purity copper using the additive. The additive of the present invention for high-purity copper electrolytic refining can be added to a copper electrolyte in electrolytic refining for producing high-purity copper. The additive includes a main agent formed of a non-ionic surfactant which has a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group, and a stress relaxation agent formed of a polyvinyl alcohol or a derivative thereof.

Growing community of inventors

Naka, Japan

Kenji Kubota