Other

Renesas Technology Corp.

Akita Electronics Systems Co., Ltd.

Kenji Koyama

Yusuke Sato

Toshiaki Morita

Kunihiro Fukuda

Takumi Ueno

Hiroshi Terui

Yasutoshi Kurihara

Yasuo Kondo

Kazuhiko Nakagawa

Mikio Kobayashi

Norinaga Arai

Toshihiko Kyogoku

Toshihiro Miura

Takashi Suzumura

Mamoru Iizuka

Akio Mikami

Tomoya Kitajima

Kunihiko Araki

An electrode on a main surface of a module board, to which an emitter electrode of a semiconductor chip which includes a switching element of a power supply control circuit that supplies a power supply voltage to amplifier circuit parts of a power module of a digital cellular phone, is electrically connected to a wiring in an internal layer of the module board through a plurality of via holes. Further, the wiring is electrically connected to an electrode for the supply of the power supply voltage, which is provided on a back surface of the module board. Accordingly, an output characteristic of the semiconductor device is improved.

Semiconductor device

To provide a composite material member for semiconductor device, an insulated semiconductor device and non-insulated semiconductor device using the composite material member, which are effective for obtaining a semiconductor device that alleviates thermal stress or thermal strain occurring during production or operation, has no possibilities of deformation, degeneration and rupture of each member, and is highly reliably and inexpensive. The composite material member for semiconductor device is characterized by being a composite metal plate with particles composed of cuprous oxide dispersed in a copper matrix, in which a surface of the composite metal plate is covered with a metal layer, and a copper layer with thickness of 0.5 &mgr;m or larger exists in an interface formed by the composite metal plate and the metal layer.

Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material member

A semiconductor device comprises: a first semiconductor chip having a control circuit; a plurality of second semiconductor chips whose operation is controlled by the control circuit; and a resin sealing body for sealing the first semiconductor chip and the plurality of second semiconductor chips, wherein: the first semiconductor chip is arranged in the central portion of the resin sealing body; and the plurality of second semiconductor chips are arranged on a periphery of the first semiconductor chip. A fuse element is further arranged outside the plurality of second semiconductor chips.

Semiconductor device having switching elements around a central control circuit

A motor-driven film winder for use with a camera having a film winding mechanism has a motor, a first system for transmitting rotative power from the motor to the film winding mechanism, a second system for transmitting rotative power from the motor to a mounting screw for threaded engagement in a tripod screw hole of the camera, and a switching control assembly for selectively operating the first or second system. The second system includes first and second selector gears angularly movable about the axis of a main gear and rotatable about their own axes in opposite directions. One of the first and second selector gears is selectively coupled, at a time, to the mounting screw by the switching control assembly.

Motor-driven film winder for cameras

Growing community of inventors

Komoro, Japan

Kenji Koyama