Kitagawa Industries Co., Inc.

Kenji Konda

Hideo Yumi

Tatsuya Nakamura

Tomohisa Kurita

Hiroki Kitano

A surface mount clip includes: a bottom portion having a flat surface; clip spring portions which extend from parts of the bottom portion and are provided in a standing manner, in a pair facing each other so as to form a gap therebetween, and which are configured to clip a plate material inserted into the gap by a resilient repulsive force; and a bottom spring portion which is formed by cutting and raising a part of the bottom portion or the clip spring portions, and which has an upper surface to be pressed by a lower end of the plate material inserted between the pair of the clip spring portions.

Surface mount clip

A surface mount clip including: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board. A pair of support parts are connected to the solder joint part and, when the solder joint part is soldered and connected to the printed circuit board, are supported in a position above the printed circuit board at an interval between the pair of support parts. The interval allows a conductive member, other than the printed circuit board, to be inserted therein. A resilient contact part, that is connected at least to one of the pair of support parts, is resiliently deformed and pressed by the conductive member, when the conductive member is inserted between the pair of support parts, and electrically connects the conductor pattern and the conductive member.

A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.

Contact

A surface mount contact member includes a metal base and a conductive coil spring. The metal base is provided with a nozzle suction surface to be sucked by a suction nozzle and a soldering surface that can be soldered. The soldering surface is faced downward when the nozzle suction surface is faced upward. The conductive coil spring is attached to the metal base in an electrically conductive manner with the nozzle suction surface being exposed to an inner peripheral side of the coil spring.

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Nagoya, Japan

Kenji Konda