Denso Corporation

Adeka Corporation

Kenji Koga

Daisuke Takama

Ryo Ogawa

Takuya Matsuda

Shinsuke Yamada

Provided is a photocurable adhesive with which curing by direct irradiation of laser light is possible with almost no occurrence of surface carbonization and which is capable of satisfactory curing even when the coating thickness is increased. A photocurable adhesive, which is cured by irradiation of laser light, is provided. The curable adhesive contains an epoxy adhesive component, a light-absorbing component for thermal curing of the epoxy adhesive component by absorption of laser light, and an inorganic filler. The content of the light-absorbing component is 0.1 mass % or less. The pre-curing thermal conductivity of the photocurable adhesive is at least 0.2 W/m&#xb7;K and the post-curing thermal conductivity is at least 0.5 W/m&#xb7;K.

Photocurable adhesive

A product includes a first component, a second component and an adhesive. The adhesive fills an interior space that is surrounded by the first component and the second component. The second component comprising an inlet that communicates between an exterior space of the second component and the interior space so as to enable the adhesive to be injected into the interior space. The inlet comprising a tapered portion that narrows from the exterior space towards the interior space.

Growing community of inventors

Kariya, Japan

Kenji Koga