Ebara Corporation

Kenji Kodera

Masayuki Nakanishi

Satoru Yamamoto

Yasuyuki Miyasawa

Kenji Kamimura

Kenya Ito

Masaya Seki

Yu Ishii

Toshifumi Watanabe

Hiroyuki Kawasaki

Keisuke Uchiyama

Michiyoshi Yamashita

Hokuto Yamanobe

Nobuhiro Yanaka

The present invention relates to a substrate cleaning method and a substrate cleaning apparatus for cleaning a substrate, such as a wafer. The substrate cleaning method includes: holding a periphery of a substrate (W) with holding rollers (); rotating the substrate (W) about its central axis by rotating the holding rollers () about their respective central axes; delivering a two-fluid jet from a two-fluid jet nozzle () to a surface of the substrate (W) while moving the two-fluid jet nozzle () in a radial direction of the substrate (W), the two-fluid jet () being composed of a mixture of a first liquid and a gas; and when the two-fluid jet is being delivered to the surface of the substrate (W), delivering a fan-shaped jet of a second liquid from a spray nozzle () to the surface of the substrate (W) to form a flow of the second liquid on the surface of the substrate (W). The fan-shaped jet is located away from the two-fluid jet.

Substrate cleaning method and substrate cleaning apparatus

One object is to improve the uniformity of polishing of a substrate. The present application discloses, as one embodiment, a substrate polishing device for a quadrilateral-shaped substrate, the device including: a surface plate; a substrate support mechanism that is attached to the surface plate and that supports the substrate; a polishing head mechanism for attaching a polishing pad, the polishing head mechanism opposing the surface plate; and an orbital drive mechanism for orbitally driving the polishing head mechanism. The substrate support mechanism includes: a base plate; a plate flow passage provided to the base plate; and a plurality of substrate support chambers that are connected to the plate flow passage, wherein each substrate support chamber independently applies a vertical direction force to the substrate, and the vertical direction force applied to the substrate corresponds to an internal pressure of the substrate support chamber.

Substrate polishing device and polishing method

A vacuum suction pad capable of making it more difficult to separate a substrate when the substrate is held by vacuum suction, the vacuum suction padincluding: a pad main bodyhaving a lower surface adhered to a stageof a substrate holder; and a plurality of circular arc-shaped substrate holding convexities, provided on a top surface of the pad main body, for holding a substrate W attracted by vacuum suction to the top surface of the pad main body, wherein the substrate holding convexitiesare arranged concentrically with the circular pad main body, and width Win a radial direction of the substrate holding convexitylocated on a radially outer side among the plurality of substrate holding convexitiesis narrower than width Win the radial direction of the substrate holding convexityon a radially inner side.

Vacuum suction pad and substrate holder

To provide a polishing apparatus capable of polishing bevel portions of varying shape by selecting a suitable polishing recipe, based on a state before polishing. The polishing apparatuscomprises: a holding/polishing unitfor holding and polishing a workpiece W; and an identifying unitfor identifying dataassociated with a state of the peripheral portion of the substrate Wbefore polishing. The holding/polishing unitcomprises: a holderfor holding and rotating the substrate W; and a polisherfor polishing the peripheral portion of the substrate Wby pressing a polishing member against the peripheral portion. A polishing-condition determinerdetermines a polishing condition, based on dataindicating to which type, of a plurality of shape-related types, the shape of a given peripheral portion belongs.

Polishing apparatus and polishing method

A polishing apparatus which can keep a width of a polishing tool constant when a peripheral portion of a substrate is polished by the polishing tool is disclosed. The polishing apparatus includes a substrate holderconfigured to hold a substrate W and to rotate the substrate W, and a pressing padconfigured to press a polishing toolagainst a peripheral portion of the substrate W held by the substrate holder. The pressing padincludes an elastic memberhaving a pressing surfaceconfigured to press the polishing toolagainst the peripheral portion of the substrate W and a support memberconfigured to support the elastic member. The support memberhas a recessformed in a front surfaceof the support member, the elastic memberbeing capable of entering the recess

Polishing apparatus and pressing pad for pressing polishing tool

Vacuum contact pad

Pressing member for substrate polishing apparatus

A polishing apparatusincludes a holding stagethat holds a central portion of a back surface of a substrate W, a motor Mthat rotates the holding stage, a front surface nozzlethat feeds a rinse liquid to a front surface of the substrate W, a back surface nozzlethat feeds the rinse liquid to a back surface of the substrate W, a rinse liquid control sectionthat feeds the rinse liquid through the back surface nozzleafter a preset time elapses since the start of feeding of the rinse liquid through the front surface nozzleand a polishing head assemblyA that polishes a peripheral portion of the substrate installed on the holding stageafter the rinse liquid control sectionfeeds the rinse liquid to the substrate W.

There is disclosed a method of polishing a peripheral portion of a wafer having a hard film with use of an abrasive film while preventing damage to the abrasive film. The polishing method uses an abrasive film including a base film made of polyimide, a binder made of polyimide, and abrasive grains held by the binder. The polishing method includes: rotating a silicon substrate having a surface on which a silicon carbide film is formed; and removing the silicon carbide film from a peripheral portion of the silicon substrate by pressing the abrasive film at a low force against the silicon carbide film on the peripheral portion of the silicon substrate.

Polishing method

A method of polishing a peripheral portion of a substrate is provided. This method includes: causing sliding contact between the peripheral portion of the substrate and a polishing tape; and supplying a polishing liquid onto the polishing tape contacting the peripheral portion of the substrate. The polishing tape includes a base tape and a fixed abrasive formed on the base tape, and the polishing liquid is an alkaline polishing liquid containing an alkaline chemical and an additive including molecules that cause steric hindrance.

Growing community of inventors

Tokyo, Japan

Kenji Kodera