Other

Mitsubishi Jukogyo Kabushiki Kaisha

The Kansai Electric Power Co., Inc.

Panasonic Corporation

Nippon Steel Sumitomo Metal Corporation

Sumitomo Metal Industries, Inc.

Panasonic I-pro Sensing Solutions Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Kenji Kobayashi

Masaki Iijima

Shigeaki Mitsuoka

Shigeru Shimojo

Kunihiko Yoshida

Mutsunori Karasaki

Taiichiro Suda

Masumi Fujii

Yoshitsugu Hotta

Yuji Arai

Haruo Kogane

Tomohiko Omura

Toru Seto

Touru Seto

Masayuki Serizawa

Kunio Kondo

Keiichi Kondo

Hideo Numata

Masaki Tsujimoto

Masami Kawasaki

Yuma Kobayashi

Keisuke Tokubuchi

Yuji Kiniwa

Hiroyuki Nagayama

Nobuyuki Hisamune

Fumio Tomikawa

Hiroshi Oshita

Koichi Kitamura

Akira Yamaguchi

Naoki Handa

Atsuo Oumiya

Kouta Tanaka

Emi Matsumoto

Emi Fukami

Jun Kato

Touro Seto

There is provided an image processing apparatus connected to a camera head capable of imaging a left eye image and a right eye image having parallax on one screen based on light at a target site incident on an optical instrument, the apparatus including: an image processor that performs signal processing of the left eye image and the right eye image imaged by the camera head; and an output controller that outputs the left eye image and the right eye image on which the signal processing is performed to a monitor via each of a first channel and a second channel, in which the output controller outputs one of the left eye image and the right eye image on which the signal processing is performed to the monitor via each of the first channel and the second channel in accordance with switching from a 3D mode to a 2D mode.

Image processing apparatus, camera apparatus, and output control method

An image processing apparatus is connected to a camera head capable of imaging a left eye image and a right eye image having parallax on one screen based on light at a target site incident on an optical instrument. The image processing apparatus includes: a deriver that derives parameters of signal processing for the left eye image and the right eye image which are imaged by the camera head in accordance with switching from a 2D mode to a 3D mode; an image processor that performs the signal processing of the left eye image and the right eye image which are imaged by the camera head, based on the derived parameters; and an output controller that outputs the left eye image and the right eye image to which the signal processing is performed to a monitor.

Image processing apparatus, camera apparatus, and image processing method

A camera device includes a camera head that captures an observation image of a target site which is obtained by a surgical microscope, and a camera control unit that processes a signal of the observation video captured by the camera head. The camera head captures right and left observation images having a parallax from the surgical microscope to obtain a high-resolution observation video including right and left parallax videos for one screen, and the camera control unit cuts out the right parallax video and the left parallax video from the observation video including the right and left parallax videos to generate a high-resolution 3D video which is displayed on a monitor in 3D and with which stereoscopic observation can be performed.

Camera device

A seamless steel pipe has a carbon equivalent Ceq of 0.50% to 0.58%, and contains specified carbides containing Mo at a ratio of 50 mass % or more, V, and at least one selected from the group consisting of Ti and Nb, and having a size of 20 nm or more.

Seamless steel pipe and method for producing same

A seamless steel pipe has a yield strength of 400 MPa or less and excellent HIC resistance. The seamless steel pipe includes: a chemical composition consisting, in mass %, of, C: 0.01 to 0.20%, Si: 0.05 to 0.50%, Mn: 0.3 to 2.0%, P: 0.02% or less, S: 0.01% or less, Cr: 0.02 to 0.2%, sol.Al: 0.001 to 0.100%, O: 0.0050% or less, N: 0.0100% or less, Ca: 0 to 0.0050%, Ti: 0 to 0.012%, and Nb: 0 to 0.012%, the balance being Fe and impurities; and a structure consisting, in area ratio, of 10 to 50% of ferrite and 0 to less than 5% of pearlite, the balance being tempered bainite and/or tempered martensite, and the number of inclusions each having a grain diameter of 50 mm or more is not more than 15 per 100 mm, and the seamless steel pipe has a yield strength of 400 MPa or less.

Seamless steel pipe for line pipe used in sour environments

A semiconductor device has a first interlayer insulating film formed on a substrate, having a first interconnection buried therein, and having a depressed portion and an insulating barrier film formed on the first interlayer insulating film. A second interlayer insulating film is formed to fill in the depressed portion, cover the upper surface of the insulating barrier film, and have a second interconnection buried therein.

Method for fabricating a semiconductor device

A seamless steel pipe for line pipe having high strength and stable toughness and having resistance to sulfide corrosion cracking at low temperatures to room temperature is provided. A seamless steel pipe according to the present invention has a chemical composition comprising, in mass percent, C: 0.03-0.08%, Si: 0.05-0.5%, Mn: 1.0-3.0%, Mo: greater than 0.4% to 1.2%, Al: 0.005-0.100%, Ca: 0.001-0.005%, a remainder of Fe and impurities including N, P, S, O, and Cu, with the impurities containing at most 0.01% of N, at most 0.05% of P, at most 0.01% of S, at most 0.01% of O, and at most 0.1% of Cu, and having a microstructure comprising a bainitic-martensitic dual phase structure.

Method for manufacturing seamless steel pipe for line pipe

A semiconductor substrate cleaning method includes a first cleaning step of cleaning the surface of a semiconductor substrate with the use of a first brush and a second cleaning step of cleaning the surface of the semiconductor substrate with the use of a second brush after the first cleaning step. The second cleaning step is performed under a condition that suppresses recontamination of the surface of the semiconductor substrate in comparison with the first cleaning step.

Semiconductor substrate cleaning method and semiconductor substrate cleaning machine

Low alloy steel for oil country tubular goods contains, in percentage by mass, 0.20% to 0.35% C, 0.05% to 0.5% Si, 0.05% to 0.6% Mn, at most 0.025% P, at most 0.01% S, 0.005% to 0.100% Al, 0.8% to 3.0% Mo, 0.05% to 0.25% V, 0.0001% to 0.005% B, at most 0.01% N, and at most 0.01% O, the balance comprising Fe and impurities, the steel satisfying Expression (1): 12V+1&#x2212;Mo&#x2267;0 (1) where the symbols of elements represent the contents of the elements in percentage by mass. In this way, the steel according to the present invention has high SSC resistance.

Low alloy steel for oil country tubular goods having high sulfide stress cracking resistance

Semiconductor device

The present invention provides a semiconductor device and a testing method capable of easily detecting a short circuit in a memory circuit with high precision and efficiently detecting a short circuit in a memory circuit. A memory circuit in which memory cells are disposed at intersections of a plurality of word lines and a plurality of bit lines performs, in a test mode, an operation of applying a predetermined potential to neighboring ones of a plurality of word lines or bit lines, an operation of selecting a plurality of word lines and applying a ground potential of the circuit to all of the plurality of bit lines, and an operation of setting all of the plurality of bit lines at a predetermined potential corresponding to the selection level of the word lines and setting all of the plurality of word lines into a non-selection state. By measuring current flowing in a power supply terminal of the semiconductor device, a short circuit between word lines, a short circuit between bit lines, a short circuit between a word line and a bit line, and the like are detected.

Semiconductor memory device and method of testing short circuits between word lines and bit lines

A process is provided for removing carbon dioxide out of combustion exhaust gas by scrubbing the exhaust gas with an aqueous solution of monoethanolamine in a scrubber, and regenerating the carbon dioxide-loaded aqueous solution of monoethanolamine in a regenerator. The process is provided with means for replenishing the aqueous solution of monoethanolamine with a stock, aqueous solution containing from about 70% to about 75% by weight of monoethanolamine. By providing a stock, aqueous solution containing from about 70% to about 75% by weight of monoethanolamine, which is injected into the carbon dioxide-loaded aqueous solution of monoethanolamine being transferred from the scrubber to the regenerator, the entire carbon dioxide recovery system is free from flammables, rendering fire-fighting precautions unnecessary.

Recovery of carbon dioxide from combustion exhaust gas

A wafer transfer apparatus for sticking a wafer, which is divided into a multiplicity of chips and which has its surface stuck with a protective tape, to a ring frame by a transfer tape, includes: a positioning unit capable of disposing the protective tape stuck wafer on a positioning table and capable of performing a position adjustment of the wafer in longitudinal, lateral and rotational directions, so that the wafer is located in a reference position; a transfer tape mount unit capable of disposing the protective tape stuck wafer, which has been located in the reference position by the positioning unit, on a transfer tape mount table, and capable of sticking a transfer tape to both a ring frame disposed round periphery of the wafer and back of the wafer, so that the wafer and the ring frame are stuck to each other and integrated; and a protective tape peeling unit capable of disposing the wafer, which has its back covered with the transfer tape and which has been integrated with the ring frame by the transfer tape mount unit, on a protective tape peeling table, and capable of bonding an end of a peeling tape to an end of the protective tape stuck to the wafer surface, and capable of pulling the peeling tape so that the protective tape is peeled from the wafer surface.

Wafer transfer apparatus

In order to enlarge a sweet area on a ball hitting surface of a golf clubhead, composite structures of two different specific gravities are utilized in addition to structural devices for fixing composite parts. The center of gravity of a golf clubhead is capable of being further distant from a face by utilizing said composite structures, for example, a balance weight fitted into a head body, a face fitted into a head body, a window-like hole provided in a head body etc. In the case of fitting a face into a head body, the specific gravity of said face is smaller than that of a head body, which is provided with a window-like hole, and/or a back crust therein, whereby golf clubheads with ultra wide sweet area can be obtained.

Golf club head

A metallic golf club head of which the center of gravity is kept a large distance off from a face to enlarge a sweet area, which also enables players to hit balls more easily upward. In one embodiment, a back crust of the head body made of pure titanium or titanium alloy is formed with a window aperture, into which is secured a weight made of beryllium copper alloy. In another embodiment, a weight is secured onto a sole by vises with a large specific gravity. According to the invention, the center of gravity of head body is capable of being positioned as backward and low as possible, so that the distance between the face and the center of gravity can be elongated, making it easier to hit balls upward.

Metallic golf clubhead

Growing community of inventors

Osaka, Japan

Kenji Kobayashi