Canon Kabushiki Kaisha

Somar Corporation

Nec Corporation

Kenji Kitagawa

Toshiki Ito

Shigeru Yamamoto

Chieko Mihara

Shigeo Sumi

Shiori Yonezawa

Youji Kawasaki

Naoko Matsufuji

A photocurable composition which decreases a mold releasing force is provided. The photocurable composition is a photocurable composition which is cured using light while being in contact with a mold having a surface in which a concavo-convex pattern is formed so as to manufacture a film having a concavo-convex pattern and which includes a polymerizable compound, a photopolymerization initiator, and a photosensitive gas generating agent having a photostimulation responsive portion. The photosensitive gas generating agent has a repeating structure containing at least one alkylene oxide chain and generates a gas from the photostimulation responsive portion by light irradiation.

Photocurable composition and method for manufacturing film

A photocurable composition excellent in the effect of reducing the mold releasing force even in a small amount of light exposure, and a photosensitive gas generating agent contained in the photocurable composition are provided. The photosensitive gas generating agent is a compound having a photostimulation responsive gas generating group to generate a gas by photostimulation, a perfluoroalkyl group and a polyalkyleneoxy group to link the photostimulation responsive gas generating group and the perfluoroalkyl group. The photocurable composition contains the photosensitive gas generating agent.

Photosensitive gas generating agent and photocurable composition

Provided is a curable composition, including a polymerization initiator; a polymerizable compound; and an internal addition type release agent having a hydrophilic functional group, in which the internal addition type release agent is prevented from being unevenly distributed in a gas-liquid interface of the curable composition.

Curable composition, film, and method of producing film

In a semiconductor integrated circuit, a plurality of logic blocks formed on a semiconductor chip are respectively operated in sync with clock signals unique to the plurality of logic blocks. Data transfer between the plurality of logic blocks is performed in asynchronous transfer scheme.

Asynchronous data transfer between logic box with synchronization circuit

A film applying apparatus,is provided with preparatory bonding rolls,A,,B and laminating rolls,A,,B, and a laminated film,wound out from a film roll,and a substrate,conveyed by a substrate conveying device,pass between these rolls and pressure bonding is performed. Diameter of the preparatory bonding rolls,A,,B is made smaller than diameter of the laminating rolls,A,,B and range of elastic deformable area S1 at the roll surface at grasping starting of the substrate and the laminated film,by the preparatory bonding rolls,A,,B is made small thereby range of generating, air holding or the like is limited to small.

Film applying apparatus

A film applying apparatus is provided with preparatory bonding rolls, laminating rolls, a laminated film wound out from a film roll and a substrate conveyed by a substrate conveying device. The laminated film passes between these rolls and pressure bonding is performed. The diameter of the preparatory bonding rolls is made smaller than the diameter of the laminating rolls. The range of the elastically deformed area at the roll surface where the grasping of the substrate and the laminated film by the preparatory bonding rolls is begun, is made small, thereby limiting the range and reducing the generated amount of air holding or the like.

It is an object of the invention to provide film peeling method and device which, when a circuit board with laminated thin films coated on the front and back surfaces thereof is beaten by vibrator rods from the front and back sides thereof to thereby peel the film, can absorb variations in the coated positions of the front and back laminated thin films and also prevent the vibrator rods from being damaged when they beat each other idly. Vibrators 16A, 16B are disposed on the front and back sides of a circuit board 14 with laminated thin films 12A, 12B coated on the front and back surfaces thereof, back and front back-up rollers 24B, 24A are disposed at positions respectively opposed to the front and back rods 18A, 18B of the vibrators 16A, 16B, and the back and front back-up rollers 24B, 24A are moved synchronously with the front and back rods 18A, 18B, respectively.

Growing community of inventors

Tokyo, Japan

Kenji Kitagawa