Shinko Electric Industries Co., Ltd.

Shinshu University

Sony Corporation

Kenji Kawamura

Yoriyuki Suwa

Masao Nakazawa

Syuzo Aoki

Susumu Arai

Tsutomu Naitou

Toshihisa Yoda

Yasushi Hatakeyama

Hironori Nishizawa

A radiation member includes a base material; and a composite plating layer, formed on the base material, that includes a metal layer and two or more kinds of carbon materials, having different diameters from each other, dispersed in the metal layer such that to be provided with a plurality of protruding portions, each of the protruding portions being composed by a part of each of the carbon materials that are protruded from a surface of the metal layer.

Radiation member

In one embodiment, there is provided a composite plating liquid. The composite plating liquid includes: a plating metal salt; a sulfate of at least one element selected from alkali metals and alkaline earth metals; boric acid; a carbon nanotube; and a dispersant. Also, there is provided a plating method of plating a member using the composite plating liquid, and a composite plating film formed by the plating method.

Composite plating liquid

A heat radiating component includes a base including a first metal, a first plating layer formed on the base and including a second metal and carbon material structures dispersed in the second metal, and a second plating layer formed on the first plating layer. The first plating layer includes protruding parts that are parts of the carbon material structures protruding from a surface of the second metal. The second plating layer is formed on the first plating layer to cover surfaces of the protruding parts and the surface of the second metal without filling spaces between the protruding parts.

Heat radiating component and method of producing same

In one embodiment, there is provided a heat radiating component. The heat radiating component includes: a base material made mainly of copper; an electroplated aluminum layer that covers at least a part of a surface of the base material; and an alumite layer formed on the electroplated aluminum layer and formed by anodic-oxidizing the electroplated aluminum layer.

Heat radiating component and semiconductor package having the same

An air-core stepping motor includes: a tubular stator including a yoke and a coil; a tubular rotor including a cylindrical magnet; and rotor support means for supporting the rotor rotatably with respect to the stator, the rotor support means including a sleeve fixed to the rotor, a holder fixed to the stator, and a ball held between the sleeve and the holder, the holder having a first holder member and a second holder member separated in a rotational-axial direction of the motor, the first holder member and the second holder member being assembled with the first holder member or the second holder member fitted to the sleeve, and being used thereafter with the first holder member or the second holder member disconnected from the sleeve.

Air-core stepping motor and shaft support structure

An optical cap for semiconductor device, the cap comprising: a metal cap body having an opening and a transparent optical window sealed with the metal cap body to cover the opening by means of a sealing member. The sealing member includes a bismuth low-melting point glass containing no lead, an intermediate metal layer attached to the metal cap body, the intermediate metal layer being a metal capable of causing a eutectic reaction with respect to Bi contained in the low-melting point glass, and an eutectic alloy layer thus formed between the low-melting point glass and the intermediate metal layer.

Growing community of inventors

Nagano, Japan

Kenji Kawamura