Taiyo Ink Mfg. Co., Ltd.

Kenji Kato

Masao Arima

Yoko Shibasaki

Nobuhito Itoh

Masaki Sasaki

Gen Itokawa

The present invention provides a photocurable and thermosetting resin composition having excellent surface curability and deep curability, allowing pattern formation with a laser beam having a wavelength of 350 to 410 nm, and being useful as a solder resist for laser direct imaging, the composition including a carboxylic resin (A), an oxime ester-based photopolymerization initiator (B) such as 2-(acetyloxyiminomethyl)thioxanthene-9-one, and another photopolymerization initiator than (B) such as 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, and a sulfur compound (E) such as 2-mercaptobenzothiazole.

Photocurable and thermosetting resin composition, cured product thereof, and printed circuit board

An alkali development-type solder resist includes (A) a carboxyl group-containing photosensitive resin obtained by reacting (a) a compound having two or more cyclic ether or thioether groups in the molecule with (b) an unsaturated monocarboxylic acid, reacting the product with (c) a polybasic acid anhydride, reacting the resulting resin with (d) a compound having a cyclic ether group and an ethylenic unsaturated group in the molecule, and reacting the product additionally with (c) a polybasic acid anhydride, (B) an oxime ester-based photopolymerization initiator containing a specific oxime ester group, (C) a compound having two or more ethylenic unsaturated groups in the molecule, and (D) a thermosetting component, wherein the dry film obtained by applying the composition has an absorbance of 0.3 to 1.2 per 25 &#x3bc;m of the film thickness at a wavelength of 350 to 375 nm.

Alkali development-type solder resist, cured product thereof, and printed wiring board prepared by using the same

There are provided a photosensitive composition used in one-shot exposure of exposing it via a photomask to light from a UV lamp or in direct writing with light from a UV lamp or laser light to form a patterned latent image to be developed with an alkaline aqueous solution, wherein a difference between maximum absorbance and minimum absorbance, in a wavelength range of 355 to 405 nm, of a dry coating thereof before light exposure is within 0.3 per 25 &#x3bc;m film thickness of the dry coating, and a dry film obtained by applying the photosensitive composition onto a carrier film and then drying it.

Photosensitive composition

An object of the present invention is to provide a black paste composition suitable for use in laser direct imaging devices employing a light source emitting a laser having a maximum wavelength of 350 to 420 nm, useful in forming a high-definition black matrix pattern efficiently, and superior in storage stability, a black matrix pattern formed by using the composition, a plasma display having the pattern, and a method of forming the black matrix pattern by using the composition. An alkali development-type black paste composition of the present invention comprises (A) a carboxyl group-containing resin, (B) a glass frit, (C) a black pigment, (D) a compound having at least one radically polymerizable unsaturated group in its molecule, and (E-1) an oxime-based photopolymerization initiator represented by the following general formula (I).

Black paste composition, method of forming black matrix pattern by using the same, and the black matrix pattern formed

A photocurable and thermosetting resin composition comprising (A) a carboxylic acid-containing photosensitive resin having at least one carboxyl group and at least two ethylenically unsaturated bonds in its molecule, (B) a filler, (C) a photopolymerization initiator, (D) a diluent, and (E) a compound having at least two cyclic ether groups and/or cyclic thioether groups in its molecule, wherein the difference between the refractive index of the carboxylic acid-containing photosensitive resin (A) and that of the filler (B) is 0.20 or less, and the average grain diameter of the filler (B) is 0.5 to 0.05 &#x3bc;m, and wherein the photo-curing and thermosetting resin composition can be developed by a diluted alkali solution, and can be pattern-formed by a laser oscillation light source of 350 to 420 nm in wavelength.

Photocurable and thermosetting resin composition, dry film using the same, and cured product thereof

An object of the present invention is to provide a silver paste composition suitable for use in laser direct imaging devices employing a light source emitting a laser having a maximum wavelength of 350 to 420 nm, useful in forming a high-definition conductive pattern efficiently, and superior in storage stability, a conductive pattern formed by using the composition, a plasma display having the pattern, and a method of forming the conductive pattern by using the composition. An alkali development-type silver paste composition of the present invention comprises (A) a carboxyl group-containing resin, (B) a glass frit, (C) a silver powder, (D) a compound having at least one radically polymerizable unsaturated group in its molecule, and (E-1) an oxime-based photopolymerization initiator represented by the following general formula (I).

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Hiki-gun, Japan

Kenji Kato