Toyo Kasei Kogyo Company Limited

Mitsui Chemicals, Inc.

Toyo Boseki Kabushiki Kaisha

Osaka Municipal Technical Research Institute

Kenji Kashihara

Shoji Maekawa

Tatsuo Tsuneka

Isao Wada

Tetsuji Nishioka

Takafumi Masuda

Toshiyuki Tamai

Hideo Matsuoka

Mitsuru Watanabe

An aqueous resin composition that can provide excellent properties using a high molecular weight resin and less amount of surfactant, and also that does not require a complicated production procedure, is provided. The aqueous resin composition is obtained by heating and dissolving 100 parts by mass of acid-modified chlorinated polyolefin with an average molecular weight of 37,000 to 150,000 in the presence of 2 to 30 parts by weight of a surfactant, 10 to 50 parts by mass of a glycol ether-based compound that satisfies general formula (1) shown below, and 150 to 425 parts by mass of water, and then dispersing this with a basic compound that has been added at a ratio of 1 to 4 chemical equivalents per carboxyl group of the acid-modified chlorinated polyolefin. General Formula (1) CH&#x2014;(OCHCH)&#x2014;OH n: an integer from 1 to 4.

Aqueous resin composition and method of producing the same

A polyolefin wax-containing aqueous resin composition that can provide excellent properties without the use of a surfactant is provided. The aqueous resin composition is obtained by heating and dissolving 100 parts by mass of a carboxyl group-containing polyolefin wax in the presence of 15 to 67 parts by mass of a compound that satisfies formula (1) shown below, and 90 to 380 parts by mass of water, and then dispersing this with a basic compound that has been added at a ratio of 1 to 4 chemical equivalents per carboxyl group of the carboxyl group-containing polyolefin wax. CH&#x2014;(OCHCH)&#x2014;OH Formula (1) m: an integer from 4 to 6, n: an integer from 1 to 4.

Method of producing aqueous resin composition

An ultraviolet-curing resin composition of (a) 5 to 35 parts by mass of a chlorinated polyolefin with a chlorine content of 15 to 40 mass %, (b) 15 to 60 parts by mass of an alicyclic hydrocarbon mono(meth)acrylate, and (c) 5 to 80 parts by mass of a polypropylene glycol di(meth)acrylate; and, per 100 parts by mass of the total amount of components (a), (b) and (c), (d) 0 to 1100 parts by mass of an aliphatic hydrocarbon di(meth)acrylate and (e) 0 to 600 parts by mass of a polyfunctional monomer having 3 to 6 (meth)acryloyl groups in its molecule; and, per 100 parts by mass of the total amount of components (b), (c), (d) and (e), (f) 1 to 15 parts by mass of a photoinitiator; and

Ultraviolet-curing resin composition, paint, ink, adhesive, sealing agent and primer

An aqueous resin composition obtained by dissolving 100 parts by mass of acid-modified polyolefin and 5 to 60 parts by mass of surfactant in 15 to 1900 parts by mass of polymerizable monomer, adding water in the presence of basic compound to perform phase inversion emulsification, and polymerizing the monomer;

Water base resin composition, process for producing the same, paint, ink, adhesive, sealant and primer

The present invention provides a binder resin solution composition, and a coating, ink, and adhesive containing the composition as an active ingredient, the binder resin solution composition having a solid content of 10 to 50 wt. % and comprising (a) a chlorinated polyolefin prepared by chlorinating to a chlorine content of 10 to 40 wt. % an ethylene-propylene-butene ternary random copolymer having an ethylene content of 3.0 to 3.7 mol %, 1-butene content of 2.4 to 2.8 mol %, and melting point of 129 to 133&#xb0; C., and (b) an organic solvent.

Binder resin solution composition, coatings, inks, adhesives and primers

The present invention provides a binder resin solution composition, and a coating, ink, and adhesive containing the composition as an active ingredient, the binder resin solution composition having a solid content of 10 to 50 wt. % and comprising (a) a chlorinated polyolefin prepared by chlorinating an isotactic polypropylene polymer having a molecular weight distribution of no more than 3 and a melting point measured by a differential scanning calorimeter of 110 to 140&#xb0; C. to a chlorine content of 10 to 40 wt. % and, (b) an organic solvent.

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Takasago, Japan

Kenji Kashihara