Dainippon Screen Mfg. Co., Ltd.

Sharp Kabushiki Kaisha Corporation

Sokudo Co., Ltd.

Sebacs Co., Ltd.

Kenji Kamei

Tetsuya Hamada

Toru Kitamoto

Hidekazu Inoue

Kenji Hashinoki

Satoshi Yamamoto

Kenji Sugimoto

Kazuya Akiyama

Toru Morimoto

Masami Ohtani

Tsuyoshi Mitsuhashi

Takeshi Takada

Joichi Nishimura

Akihiko Morita

Yasufumi Koyama

Yasumichi Mori

Shinsuke Anzai

Masaki Iwami

Kazuhiro Nishimura

Shinji Kiyokawa

Masao Tsuji

Noriaki Yokono

Yasuo Imanishi

Nobutoshi Orgami

Kazuya Ono

Tamihiro Bun

Kinya Murata

Toshiaki Dainin

Seiji Tsutsui

A sensor part is provided with a printed circuit board that is made of resin and formed with a pair of electrically conductive metal patterns. Each of the pair of electrically conductive metal patterns includes: a first pattern part connected to a pair of electrodes of a temperature sensor; a second pattern part connected to a pair of conductive wires; and a connection part making a connection between the first and second pattern parts. The connection between the pair of electrodes of the temperature sensor and the first pattern part or between the pair of conductive wires and the second pattern part is made with the use of Dotite or solder.

Temperature computing instrument and method for calibrating temperature of sensor part used therefor

A first thermometry system for measuring a temperature of an object under test includes a first detecting sheet having crystal oscillators arranged on a first sheet-like object formed of resin, and a first measuring device for measuring the temperature based on frequencies acquired from the crystal oscillators and corresponding to natural frequencies of the crystal oscillators. In this system, the first detecting sheet is placed in contact with the object under test, whereupon the crystal oscillators provide the natural frequencies corresponding to the temperature of the object under test. The first measuring device measures the temperature of the object under test accurately based on the frequencies corresponding to the natural frequencies.

First detecting sheet and first thermometric system for detecting and measuring temperature of an object under test, second detecting sheet and second thermometric system for detecting and measuring temperature of a dummy substrate, and heat treatment apparatus using same

A substrate processing apparatus and an information storage server are connected with each other through a network. A storage part of the substrate processing apparatus stores set information and a control program, for controlling operation of the substrate processing apparatus according to the set information and the control program. The substrate processing apparatus is provided with a schedule function, for transmitting a backup instructional command according to the schedule. In response to this instructional command, the substrate processing apparatus generates a duplicate of specified information stored in the aforementioned storage part and transfers the duplicate information to the information storage server through the network. The information storage server stores the received duplicate information in a hard disk as backup data. The information storage server can also store only differential data of the duplicate information. Thus, information for controlling the operation of the substrate processing apparatus can be efficiently backed up without burdening the user.

Managing apparatus for substrate processing system

A substrate heat treatment apparatus for heat-treating a substrate includes a bake plate for supporting the substrate, and a cover disposed above the bake plate and temperature-controlled for securing a heat-treating atmosphere of the bake plate. An adjusting device adjusts a space between the cover and the bake plate. A control device adjusts the space, through the adjusting device, successively to a transport space for allowing transport of the substrate, a transitional space smaller than the transport space and close to the bake plate, and a steady space smaller than the transport space and larger than the transitional space.

Substrate heat treatment apparatus

A substrate processing system comprises a substrate processing apparatus, an information storage server and a support computer, which are connected to a network respectively. When the substrate processing apparatus causes a failure, an alarm processing part extracts a necessary relevant log file and stores the same in a hard disk of the information storage server. A failure information generation part generates failure information, which in turn is finally stored in the hard disk of the information storage servers as a failure information database. An apparatus information uncasing part renders the relevant log file and the failure information database readable from the support computer located in a remote place. Thus, the relevant log file and the failure information database can be immediately read. In other words, provided is a substrate processing system rendering operation information immediately readable from a remote place when the substrate processing apparatus causes a failure.

Substrate processing system managing apparatus information of substrate processing apparatus

After an exposure process in an exposure part, the exposure part transmits an exposure completion signal to a main controller. At time (t12) which is a predetermined time interval (T12) later than an exposure completion time (t11), the main controller transmits a substrate transport signal to a heating part, to cause the transport of a substrate from a temporary substrate rest part to a heating plate and the start of a heating process by the heating plate. This provides substantially the same length of the time interval between the completion of the exposure process and the start of the heating process in the heating part, if there are variations in the time at which each substrate is placed on the temporary substrate rest part of the heating part.

Substrate processing apparatus

A substrate processing system comprises a substrate processing apparatus and a support computer, which are connected to a network respectively. Updated countermeasure information is accumulated in the support computer by a system administrator. When the substrate processing apparatus causes a failure, content of the failure is displayed on a display part while an alarm processing part controls process according to an alarm definition file. Further, a countermeasure information acquisition part requires updated countermeasure information against the failure from the support computer. In response to this, countermeasure information distribution part of the support computer transmits updated countermeasure information. Thus, updated countermeasure information can be read instantly when a failure occurs.

An edge exposing apparatus includes a photo detector and a lighting time measuring circuit for detecting a decrease in performance of light source units. The lighting time measuring circuit detects a ready state ((stabilization of luminous intensity) of the light source units, for example by measuring a lighting time for a startup (switch-on) of the light source units. When the measuring circuit detects a preset lighting time, or when the photo detector detects a luminous intensity below a preset value, the light source units are determined to have lowered performance, and are switched off. When a decrease in performance of one unit is detected, a replacement light source unit is started while continuing edge exposure with one or more other light source unit(s). When a ready state is detected, the edge exposure with the one light source unit is terminated (switch-off), and edge exposure is performed with the replacement light source unit.

Edge exposing apparatus

A controller is connected to a substrate processing apparatus and an exposure apparatus. A pilot substrate subjected to a series of processing as preprocessing is transported to an inspection unit. An inspection result determination part compares inspection results received from the inspection unit with substrate condition data so that a condition change instruction part changes the processing condition of each processing unit when no requirement is satisfied. This operation is so repeated that a processing control part executes actual processing according to recipe data when the inspection results satisfy the requirement. Thus, the efficiency a step of changing the processing condition of each processing part in response to the inspection results in the inspection part is improved in preprocessing executed in the substrate processing apparatus.

Substrate processing apparatus control system and substrate processing apparatus

A substrate treating apparatus has an antireflection film forming block, a resist film forming block and a developing block arranged in juxtaposition, each of these blocks including treating modules and a single main transport mechanism. The main transport mechanism transports substrates within each block, and transfers the substrates between the blocks through inlet substrate rests and outlet substrate rests provided as separate components. This construction realizes improved throughput of the substrate treating apparatus.

Substrate treating apparatus

A semiconductor integrated circuit of the present invention includes: n first output circuits and m second output circuits which are provided such that adjacent first and second output circuits are spaced at a regular first pitch; and input circuits which are provided such that adjacent input circuits are spaced at a regular second pitch, in which the first and second output circuits are provided such that at least part of ones of the first and second output circuit blocks alternate with the other ones of the first and second output circuits and each of the first output circuits is connected to a corresponding one of input circuits by a first conductor line which is kept straight, and second conductor lines are connected to the second output circuits such that each second conductor line passes through a gap between the input circuits.

Semiconductor integrated circuit

A substrate processing apparatus reduces an instantaneous maximum power consumption at turn-on. Power receiving parts of a plurality of processing units are connected to one end of a turn-on switch respectively through switches. The other end of the turn-on switch is connected to an external power source through a breaker. Timer values are set in advance in the timers, respectively. When the turn-on switch is turned on, the timers turn on the associated switches respectively after times which are defined by the timer values, whereby the processing units are provided with electric power, each with a delay of a constant time.

Substrate processing apparatus having regulated power consumption and

A method and apparatus for exposing a substrate to light perform the steps of inputting position data of a peripheral region along an outline of a chip region on a substrate, which has been placed on a spin chuck, detecting a reference position at an outer edge of the substrate inputting axial directions of the position data and aligning axial directions of an orthogonal shifting mechanism. Based on the position data inputted, light of an irradiator is shifted along the peripheral region to expose the peripheral region in a staggered way along the outline of the chip region. The method and apparatus may also perform the steps of inputting a shape of the chip region on the substrate as image information, deriving position data of the peripheral region along the outline of the chip region from the image information, and exposing the peripheral region to light based on the position data derived. The method and apparatus may also perform the steps of inputting shape information of the substrate, the chip region, and an area around a crossing point of scribe lines in the chip region on the substrate as image information, computing the positions of the peripheral region from the image information and the shape information of the substrate and the chip region; and exposing the peripheral region to light based on the positions of the computed peripheral region.

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Kyoto, Japan

Kenji Kamei