Tokai Shoji Co., Ltd

Toray Engineering Company, Limited

Fuji Electrochemical Co., Ltd.

Kenji Kambara

A printing device, a production unit and a production method of electronic parts suitable for production of precise electronic parts are provided. A squeegee is attached to a rotating machine, and is autorotated and self-driven, and moreover, a printing pressure is generated in the squeegee, and resin is strongly filled, thereby achieving a print having a precision-shape. Further, with a perforated plate as a boundary, upper and lower chambers are provided so as to control a pressure, thereby performing cutting and dispensing of the resin and achieving a print having a precision-shape. This method is applied to the packaging of electronic parts. A printing device Ecomprises: a rollerallowing a peripheral surfaceto approach one sideof a circuit board; moving meansfor horizontally moving the roller; rotating meansfor allowing the moving meansto rotate the roller; a squeegeerotatably supported along the peripheral surfaceof the roller; and printing pressure generating meansfor pressing the squeegeeto the circuit boardby a rotating reactive force of the roller

Printing device, production unit, and production method of electronic parts

Production unit including a printing device and upper and lower sealed chambers

Printing device for electronic parts having a roller and a squeegee arrangement

A method of sealing electronic parts mounted on the substrates with a resin, by porous plate-printing, by employing a primary porous plate-printing in which sealing portions of an electronic part mounted on a substrate are filled with a sealing resin through resin push-in pores formed in the porous plate in vacuum by reciprocally moving a squeeze, the resin is introduced based on a pressure difference in vacuum of a degree lower than that of the above vacuum state so that the sealing resin infiltrates into every gap under the wires bonding the lead wires of the substrate to the electronic part, and supplementary sealing with the resin is effected by a secondary porous plate-printing. Even those portions in the structure of the electronic part that cannot be easily filled with the sealing resin can be filled with the sealing resin without forming air-containing voids. Besides, such portions can be filled without causing damage to the wires. The sealing with the resin is effected maintaining flat surfaces of the sealing resin, highly precise shape and size of the resin-sealed structure, and offering highly improved reliability for the resin-sealed electronic parts.

Method of sealing electronic parts with a resin

An insulating tape for winding coils which includes a guide sheet having a predetermined width and a plurality of narrow insulating strips provided with adhesive on both surfaces thereof and removably connected to the guide sheet at predetermined spaces, facilitating accurate winding of insulating strips on a bobbin or the like and further enabling the winding operation to be carried out automatically.

Growing community of inventors

Otsu, Japan

Kenji Kambara