Mitsubishi Denki Kabushiki Kaisha

Kenji Kagata

Tsuneo Hamaguchi

Osamu Hayashi

Mitsuyuki Takada

Susumu Hoshinouchi

Masanobu Kohara

Goro Izuta

Tosihiro Fusayasu

Isao Kitamura

Hirotugu Yamada

Mitsunori Ishizaki

A semiconductor device includes projecting electrodes formed on one surface of a wiring substrate so as to have a prescribed height, a semiconductor chip having a thickness smaller than the height of the projecting electrodes, and an electronic component having a thickness larger than that of the semiconductor chip and mounted on the other surface of the wiring substrate so that the wiring substrate is warped to be recessed at the one surface. Thus, the rigidity as well as the spacing between the semiconductor chip and the mounting board are assured. Moreover, the semiconductor device having a logic LSI mounted on both surfaces of a wiring substrate is mounted on a mounting board in a housing with projecting electrodes having a prescribed height interposed therebetween, wherein the wiring substrate is warped to be recessed on the side having the projecting electrodes.

Semiconductor device, method for manufacturing an electronic equipment, electronic equipment, and portable information terminal

Semiconductor device, method for manufacturing an electronic equipment, electronic equipment and portable information terminal

A high-speed, high-density, small-sized, low-cost semiconductor device wherein the feeder substrate 2 for supplying power to the semiconductor elements 3 as a bare chip has the containers 2a for containing the semiconductor elements 3, the semiconductor elements 3 are bonded to the wiring layer 1b of the signal transmission substrate 1 for transmitting signals to the semiconductor elements 3 and contained in the containers 2a, the containers 2a are covered with the signal transmission substrate 1, and the signal transmission substrate 1 is superposed upon and bonded to the feeder substrate 2.

Semiconductor device, production method therefor, method for testing

The semiconductor package and manufacturing method thereof whereby the inexpensive package of high thermal conductivity is obtained by applying a Cu/Mo/Cu clad material for a base plate which matches the thermal expansion of a semiconductor chip, and the inexpensive package with high heat transfer suitable for a high frequency device is obtained by controlling a thickness of glass, and a size of a lead (width, thickness), thereby to match impedance of a wiring portion with that of the semiconductor chip, by plating only necessary areas with Au, and by plating the exterior with Sn.

Cu/Mo/Cu clad mounting for high frequency devices

Growing community of inventors

Hyogo, Japan

Kenji Kagata